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21. 发明申请

US20070207613A1 Methods for selective removal of material from wafer alignment marks 有权
公开(公告)号：US20070207613A1
公开(公告)日：2007-09-06
申请号：US11711491
申请日：2007-02-26
申请人： Russell Zahorik , Guy Hudson , Hugh Stroupe , Todd Dobson , Brian Gordon
发明人： Russell Zahorik , Guy Hudson , Hugh Stroupe , Todd Dobson , Brian Gordon
IPC分类号： H01L21/02
CPC分类号： H01L23/544 , C23F1/08 , H01L21/0206 , H01L21/02063 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/67028 , H01L21/6708 , H01L2223/54426 , H01L2223/54453 , H01L2924/0002 , Y10S134/902 , H01L2924/00
摘要： A process and apparatus for locally removing any material, such as a refractory metal, in particular tungsten, from any desired area of a wafer, such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon.

22. 发明申请

US20060060325A1 Filament winding for metal matrix composites 失效
标题翻译：金属基复合材料的丝缠绕
公开(公告)号：US20060060325A1
公开(公告)日：2006-03-23
申请号：US10995275
申请日：2004-11-24
申请人： Brian Gordon , Gregg Wolfe
发明人： Brian Gordon , Gregg Wolfe
IPC分类号： B22D19/00 , B22D19/02
CPC分类号： C22C47/08 , B22F2998/00 , B22F2998/10 , C22C47/064 , C22C47/20 , C22C47/06
摘要： A wet filament winding method and apparatus for producing a consolidated metal matrix composite is described. The methods are directed to winding a softened metal infiltrated fiber bundle and layering the resulting softened metal infiltrated fiber bundle onto a rotating mandrel in a prescribed pattern on the surface of the mandrel to form a consolidated metal matrix composite. Upon cooling, the matrix metal solidifies and the resulting consolidated metal matrix composite may be removed from the mandrel. The consolidated metal matrix composites may be produced in a variety of shapes, such as cylinder, a tapered cylinder, a sphere, an ovoid, a cube, a rectangular solid, a polygonal solid, and panels.
摘要翻译：描述了用于生产固结的金属基质复合材料的湿丝缠绕方法和设备。该方法涉及卷绕软化的金属渗透的纤维束，并将所得到的软化金属渗透的纤维束以规定的图案在心轴的表面上分层到旋转心轴上以形成固结的金属基质复合材料。在冷却时，基质金属固化，并且所得到的固结的金属基质复合材料可以从心轴移除。固结的金属基复合材料可以以各种形状生产，例如圆柱体，锥形圆柱体，球体，卵球形，立方体，矩形固体，多边形固体和面板。

23. 发明申请

US20060040521A1 Printed circuit board support 失效
公开(公告)号：US20060040521A1
公开(公告)日：2006-02-23
申请号：US11215111
申请日：2005-08-30
申请人： Brian Gordon , Tony Teitenberg , John Godfrey
发明人： Brian Gordon , Tony Teitenberg , John Godfrey
IPC分类号： H01R12/00
CPC分类号： H05K13/0069
摘要： A printed circuit board conveying system is provided comprising a printed circuit board conveyor and a printed circuit board support. The printed circuit board support is positioned to support a major portion of the printed circuit board between opposite lateral edge portions of the board and comprises a support base, a spacer, and a spacer securement. A printed circuit board processing system including the conveying system is also provided. The conveying system couples a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven.

24. 发明申请

US20050133123A1 Glass fiber metal matrix composites 审中-公开
标题翻译：玻璃纤维金属基复合材料
公开(公告)号：US20050133123A1
公开(公告)日：2005-06-23
申请号：US10995516
申请日：2004-11-24
申请人： Brian Joseph , Brian Gordon , Kenneth Hart , Joseph Polsinelli , James Witzgall , Gregg Wolfe
发明人： Brian Joseph , Brian Gordon , Kenneth Hart , Joseph Polsinelli , James Witzgall , Gregg Wolfe
IPC分类号： C22C21/00 , C22C47/08 , C22C49/02 , C22C49/06 , C22C49/14
CPC分类号： C22C47/068 , B22F2998/00 , C22C49/14 , C22C47/08
摘要： A glass fiber reinforced metal matrix composite is described. The composite includes glass fibers distributed in a metal matrix body. The fibers may be uniformly distributed in the metal matrix and may include continuous lengths of the glass fibers. The glass fibers may be glass fibers, S-glass, E-glass fibers, soda-lime-silica fibers, basalt fibers, quartz fibers, or other similar glassy fibers. The metal matrix may include aluminum or alloys of aluminum as well as other metals and alloys.
摘要翻译：描述了玻璃纤维增强金属基复合材料。复合材料包括分布在金属基体中的玻璃纤维。纤维可以均匀分布在金属基质中，并且可以包括连续长度的玻璃纤维。玻璃纤维可以是玻璃纤维，S玻璃，E玻璃纤维，钠钙二氧化硅纤维，玄武岩纤维，石英纤维或其它类似的玻璃纤维。金属基质可以包括铝或铝的合金以及其它金属和合金。

25. 发明申请

US20050029724A1 Inflatable bladder with suction for supporting circuit board assembly processing 失效
公开(公告)号：US20050029724A1
公开(公告)日：2005-02-10
申请号：US10930193
申请日：2004-08-31
申请人： Brian Gordon
发明人： Brian Gordon
IPC分类号： B25B5/06 , B25B11/00 , H05K13/00 , B25J15/06
CPC分类号： B25B5/065 , B25B11/005 , H05K13/0069 , Y10T29/4913 , Y10T29/49998 , Y10T29/53191 , Y10T29/53961
摘要： An inflatable bladder comprising at least one aperture and/or at least one baffle within the bladder for supporting a printed circuit board during component placement on a semiconductor substrate such as a printed circuit board is provided. The inflatable bladder is positioned to provide support for the substrate while apertures within the inflatable bladder communicate a suction force to the substrate to inhibit the substrate from bending, bowing, or flexing away from contact with the inflatable bladder during component placement. The inflatable bladder provides support for the substrate while attempting to prevent injury to components by pliably conforming to component irregularities on the back side of the substrate. The inflatable bladder can be selectively inflated or deflated for contacting the substrate and thereafter supporting the back side of the substrate during assembly operations. Alternatively, a lift table can be selectively raised or lowered for placing the inflatable bladder in contact with the back side of the substrate during assembly operations. The inflatable bladder can contain one or more baffles to define one or more compartments within the inflatable bladder. The inflatable bladder can be incorporated into a typical system for component assembly comprising a pair of rails, each having a slot therein, for receiving a substrate.

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