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    • 22. 发明授权
    • Negative type radiation sensitive resin composition
    • 负型辐射敏感树脂组合物
    • US07323284B2
    • 2008-01-29
    • US10171583
    • 2002-06-17
    • Toshiyuki KaiDaigo Ichinohe
    • Toshiyuki KaiDaigo Ichinohe
    • G03F7/004
    • G03F7/0045G03F7/038Y10S430/106
    • A negative type radiation sensitive resin composition comprising: (A) an alkali-soluble resin containing the polymerized unit of a polymerizable unsaturated compound having a phenolic hydroxyl group and having a weight average molecular weight of 4,100 to 20,000 and a weight average molecular weight/number average molecular weight ratio of more than 1.25 to not more than 2.00; (B) a radiation sensitive acid generating agent; and (C) an acid crosslinking agent. This composition can be used with an alkali developer having a normal concentration, can form a high-resolution rectangular line-and-space resist pattern, and provides a chemically amplified negative type resist which is free from a resist pattern defect (bridging or chip line) after development and has excellent sensitivity, developability and dimensional fidelity.
    • 一种负型辐射敏感性树脂组合物,其包含:(A)含有酚羟基的可聚合不饱和化合物的聚合单元的碱溶性树脂,其重均分子量为4100〜20,000,重均分子量/数 平均分子量大于1.25至不大于2.00; (B)辐射敏感性酸产生剂; 和(C)酸交联剂。 该组合物可以与具有正常浓度的碱性显影剂一起使用,可以形成高分辨率矩形线间距抗蚀剂图案,并提供无抗蚀剂图案缺陷的化学放大负型抗蚀剂(桥接或芯片线 ),具有优异的灵敏度,可开发性和尺寸保真度。