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21. 发明申请

US20050131002A1 Novel amide compounds and medications containing the same 失效
标题翻译：新颖的酰胺化合物和含有相同的药物
公开(公告)号：US20050131002A1
公开(公告)日：2005-06-16
申请号：US10985938
申请日：2004-11-09
申请人： Kimiyuki Shibuya , Toru Miura , Katsumi Kawamine , Yukihiro Sato , Tadaaki Ohgiya , Takahiro Kitamura , Chiyoka Ozaki , Toshiyuki Edano , Mitsuteru Hirata
发明人： Kimiyuki Shibuya , Toru Miura , Katsumi Kawamine , Yukihiro Sato , Tadaaki Ohgiya , Takahiro Kitamura , Chiyoka Ozaki , Toshiyuki Edano , Mitsuteru Hirata
IPC分类号： A61K31/4439 , C07D401/12 , C07D403/12 , C07D413/12 , C07D417/12 , C07D498/04 , C07D513/04 , A61K31/506 , C07D413/02 , C07D417/02 , C07D43/02
CPC分类号： C07D403/12 , A61K31/4439 , C07D401/12 , C07D413/12 , C07D417/12 , C07D513/04
摘要： The present invention provides to a novel compound having an ACAT inhibiting activity. The present invention relates to compounds represented by formula (I) wherein represents an optionally substituted divalent residue such as benzene, pyridine, cyclohexane or naphthalene, or a group, Het represents a 5- to 8-membered, substituted or unsubstituted heterocyclic group containing at least one heteroatom selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom, such as a monocyclic group, a polycyclic group or a group of a fused ring, X represents —NH—, an oxygen atom or a sulfur atom, Y represents —NR4—, an oxygen atom, a sulfur atom, a sulfoxide or a sulfone, Z represents a single bond or —NR5—, R4 represents a hydrogen atom, a lower alkyl group, an aryl group or an optionally substituted silyl lower alkyl group, R5 represents a hydrogen atom, a lower alkyl group, an aryl group or an optionally substituted silyl lower alkyl group, and n is an integer of from 1 to 15, or salts or solvates thereof, and a pharmaceutical composition containing at least one of these compounds.
摘要翻译：本发明提供具有ACAT抑制活性的新型化合物。本发明涉及由式（I）表示的化合物，其中表示任选取代的二价残基例如苯，吡啶，环己烷或萘，或者基团，Het表示5至8元，取代或未取代的杂环基，至少一个选自氮原子，氧原子和硫原子的杂原子，如单环基团，多环基团或稠环基团，X表示-NH-，氧原子或硫原子原子，Y表示-NR 4 - ，氧原子，硫原子，亚砜或砜，Z表示单键或-NR 5 - ， - R 4表示氢原子，低级烷基，芳基或任选取代的甲硅烷基低级烷基，R 5表示氢原子，低级烷基，芳基基团或任选取代的甲硅烷基低级烷基，n为1至15的整数，或其盐或溶剂化物， d含有这些化合物中的至少一种的药物组合物。

22. 发明授权

US06825223B2 Anilide compounds and pharmaceutical compositions comprising them 失效
标题翻译：酰苯胺化合物和包含它们的药物组合物
公开(公告)号：US06825223B2
公开(公告)日：2004-11-30
申请号：US09789967
申请日：2001-02-21
申请人： Kimiyuki Shibuya , Katsumi Kawamine , Yukihiro Sato , Toshiyuki Edano , Souhei Tanabe , Masami Shiratsuchi
发明人： Kimiyuki Shibuya , Katsumi Kawamine , Yukihiro Sato , Toshiyuki Edano , Souhei Tanabe , Masami Shiratsuchi
IPC分类号： A61K31428
CPC分类号： C07D263/58 , C07D235/28 , C07D277/70
摘要： The invention provides novel anilide compounds and pharmaceutical compositions comprising them. The invention relates to compounds of a formula: wherein Ar is an optionally-substituted aryl group; R4 and R5 are the same or different, and each is a hydrogen atom, a lower alkyl group, or a lower alkoxy group; and R4 and R5 may together form a lower alkylene group of which one or more methylene moieties may optionally be substituted by oxygen and/or sulfur atoms; X is —NH—, or an oxygen or sulfur atom; Y is —NH—, an oxygen or sulfur atom, or a sulfoxide or sulfone group; Z is a single bond, or —NR6—; R4 represents a hydrogen atom or a lower alkylene group; and n is an integer of from 0 to 15; and their salts and solvates. The compounds of the invention are useful as pharmaceutical compositions, especially as acyl coenzyme A cholesterol acyltransferase (ACAT) inhibitors.
摘要翻译：本发明提供了新的酰苯胺化合物和包含它们的药物组合物。本发明涉及下式的化合物：其中Ar是任选取代的芳基; R 4和R 5相同或不同，并且各自是氢原子，低级烷基基团或低级烷氧基; 并且R 4和R 5可以一起形成低级亚烷基，其中一个或多个亚甲基部分可以任选地被氧和/或硫原子取代; X是-NH-或氧或硫原子; Y是-NH-，氧或硫原子，或亚砜或砜基; Z为单键或-NR 6 - ; R 4表示氢原子或低级亚烷基; 和n为0至15的整数;以及它们的盐和溶剂化物。本发明的化合物可用作药物组合物，特别是作为酰基辅酶A胆固醇酰基转移酶（ACAT）抑制剂。

23. 发明授权

US06797717B2 Anilide compounds and drugs containing the same 失效
标题翻译：苯胺类化合物和含有相同的药物
公开(公告)号：US06797717B2
公开(公告)日：2004-09-28
申请号：US10034669
申请日：2001-12-19
申请人： Kimiyuki Shibuya , Katsumi Kawamine , Yukihiro Sato , Toshiyuki Edano , Mitsuteru Hirata , Chiyoka Ozaki
发明人： Kimiyuki Shibuya , Katsumi Kawamine , Yukihiro Sato , Toshiyuki Edano , Mitsuteru Hirata , Chiyoka Ozaki
IPC分类号： A61K31435
CPC分类号： C07D263/58 , C07D233/84 , C07D235/28 , C07D263/60 , C07D277/74 , C07D413/04 , C07D413/12 , C07D471/04
摘要： The invention relates to a novel anilide compound and a pharmaceutical composition comprising the same. The invention relates to a compound represented by the following general formula: represents a divalent residue of benzene with a substituent(s), heterocycle-condensed benzene which may or may not have a substituent, pyridine which may or may not have a substituent, cyclohexane or naphthalene Ar represents an aryl group which may or may not have a substituent, X represents —NH—, oxygen atom or sulfur atom; Y represents —NR4—, oxygen atom, sulfur atom, sulfoxide or sulfone; Z represents single bond or —NR5—; R4 represents hydrogen atom, a lower alkyl group, an aryl group or a silylated lower alkyl group which may or may not have a substituent; R5 represents hydrogen atom, a lower alkyl group, an aryl group or a silylated lower alkyl group which may or may not have a substituent; and n represents an integer of 0 to 15. The inventive compounds are useful in the form of pharmaceutical composition, specifically as acyl coenzyme A cholesterol acyltransferase (ACAT) inhibitor.
摘要翻译：本发明涉及一种新的酰苯胺化合物和包含其的药物组合物。本发明涉及由以下通式表示的化合物：表示具有取代基的苯的二价残基，可以具有也可以不具有取代基的杂环稠合苯，可以具有也可以不具有取代基的吡啶，可以不具有取代基的吡啶，环己烷或萘Ar表示可以具有或不具有取代基的芳基，X表示-NH-，氧原子或硫原子; Y表示-NR4-，氧原子，硫原子，亚砜或砜; Z表示单键或-NR5 - ; R4表示氢原子，可以具有或不具有取代基的低级烷基，芳基或甲硅烷基化低级烷基; R5表示氢原子，低级烷基，芳基或甲硅烷基化的低级烷基，可以或可以不具有取代基; andn表示0至15的整数。本发明化合物可以药物组合物的形式使用，特别是作为酰基辅酶A胆固醇酰基转移酶（ACAT）抑制剂。

24. 发明授权

US5225301A Electrophotographic yellow toner and process for producing the same 失效
标题翻译：电子黄铜墨粉及其制造方法
公开(公告)号：US5225301A
公开(公告)日：1993-07-06
申请号：US810137
申请日：1991-12-19
申请人： Heihachi Yushina , Yukihiro Sato , Yasuo Kamoshita , Hirofumi Oda
发明人： Heihachi Yushina , Yukihiro Sato , Yasuo Kamoshita , Hirofumi Oda
IPC分类号： G03G9/08 , G03G9/087 , G03G9/09
CPC分类号： G03G9/091 , G03G9/081
摘要： An electrophotographic yellow toner comprising binder resins having dispersed therein acetoacetanilide type monoazo pigments in its amorphous phase. The toner is excellent in transparency and spectral reflection characteristics. The toner is prepared by a process comprising a step of subjecting a colorant containing acetoacetanilide monoazo pigments and binder resins to heat treatment at a temperature higher than the softening point of the binder resin by at least 40.degree. C.

25. 发明授权

US08409007B2 Server apparatus and game system 有权
标题翻译：服务器设备和游戏系统
公开(公告)号：US08409007B2
公开(公告)日：2013-04-02
申请号：US12065824
申请日：2006-08-31
申请人： Kenji Kobayashi , Yukizumi Terao , Yukihiro Sato , Masaru Nakamura
发明人： Kenji Kobayashi , Yukizumi Terao , Yukihiro Sato , Masaru Nakamura
IPC分类号： A63F9/24 , G06F17/00
CPC分类号： A63F13/795 , A63F13/12 , A63F13/35 , A63F2300/406 , A63F2300/556 , A63F2300/8047
摘要： In a game system, a server apparatus (3) that communicates with a plurality of game devices (1) stores play data elements for a plurality of players and public IDs for identifying a plurality of players in a latest play data table (T1) and a public ID table (T2). The server apparatus (3) transmits to a mobile terminal (4), which is being used by a player, information depending on latest play data elements stored in the latest play data table (T1), the latest play data elements belonging to other players who have been registered with the personal relationship table (T3) as a friend of the player possessing the mobile terminal (4). Upon receiving a public-ID-change request from a mobile terminal (4), which is being used by a player, the server apparatus (3) changes the public ID of the player stored in the public ID table (T2).
摘要翻译：在游戏系统中，与多个游戏装置（1）通信的服务器装置（3）存储多个玩家的播放数据元素和用于识别最新播放数据表（T1）中的多个玩家的公开ID，以及公共ID表（T2）。服务器装置（3）根据存储在最新播放数据表（T1）中的最新播放数据元素向播放器使用的移动终端（4）发送信息，属于其他播放器的最新播放数据元素已经作为拥有移动终端（4）的玩家的朋友登记在个人关系表（T3）中的人。在从玩家正在使用的移动终端（4）接收到公共ID变更请求时，服务器装置（3）改变存储在公开ID表（T2）中的玩家的公开ID。

26. 发明授权

US08299600B2 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US08299600B2
公开(公告)日：2012-10-30
申请号：US12619561
申请日：2009-11-16
申请人： Yukihiro Sato , Katsuhiko Funatsu , Hiroyuki Nakamura
发明人： Yukihiro Sato , Katsuhiko Funatsu , Hiroyuki Nakamura
IPC分类号： H01L23/48
CPC分类号： H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/91 , H01L2224/0603 , H01L2224/29111 , H01L2224/2919 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/40095 , H01L2224/40245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4847 , H01L2224/48599 , H01L2224/73215 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2224/85013 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device is provided with improved reliability. A semiconductor chip is mounted over a chip mounting portion of a lead frame via solder. A metal plate is arranged over a source pad of the semiconductor chip and a lead portion of a lead frame via solder. A solder reflow process is performed thereby to bond the semiconductor chip over the chip mounting portion with a solder, and to bond the metal plate to the source pad and the lead portion with the other solders. The lead frame is formed of a copper alloy, and thus has its softening temperature higher than the temperature of the solder reflow process. The metal plate is formed of oxygen-free copper, and has its softening temperature lower than the temperature of the solder reflow process, whereby the metal plate is softened in the solder reflow process. Thereafter, a gate pad electrode of the semiconductor chip is coupled to a lead portion via the wire, a sealing resin portion is formed, and then the lead frame is cut.
摘要翻译：半导体器件具有改进的可靠性。通过焊料将半导体芯片安装在引线框架的芯片安装部分上。金属板通过焊料布置在半导体芯片的源极焊盘和引线框架的引线部分的上方。进行焊料回流工艺，从而通过焊料将半导体芯片连接在芯片安装部分上，并将金属板与其它焊料接合到源极焊盘和引线部分。引线框架由铜合金形成，因此其软化温度高于焊料回流工艺的温度。金属板由无氧铜形成，其软化温度低于焊锡回流工序的温度，由此金属板在回流焊工艺中软化。此后，半导体芯片的栅极焊盘电极通过导线连接到引线部分，形成密封树脂部分，然后引线框架被切割。

27. 发明申请

US20120261825A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120261825A1
公开(公告)日：2012-10-18
申请号：US13533391
申请日：2012-06-26
申请人： Nobuya KOIKE , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
发明人： Nobuya KOIKE , Atsushi Fujiki , Norio Kido , Yukihiro Sato , Hiroyuki Nakamura
IPC分类号： H01L23/48
CPC分类号： H01L21/565 , H01L23/49503 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/04042 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/32257 , H01L2224/40095 , H01L2224/40245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/49171 , H01L2224/49175 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device.A first chip is mounted on a first die pad, and a second chip is also mounted on a second die pad. A first die pad and a second die pad do division structure in parallel to the first side and second side of sealing body 40. As a result, the pin for an output from a first chip and the pin for control of the circuit for a drive can make it able to project from a counter direction, and can set the wiring layout at the time of mounting as the minimum route.
摘要翻译：通过改变半导体器件的结构，安装时的安装布线的布局变得有效。第一芯片安装在第一芯片焊盘上，第二芯片也安装在第二芯片焊盘上。第一管芯焊盘和第二管芯焊盘与密封体40的第一侧面和第二侧平行地进行分割结构。结果，用于从第一芯片输出的引脚和用于控制驱动电路的引脚可以使其能够从反方向投影，并可以将安装时的布线布局设置为最小路线。

28. 发明申请

US20100140718A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100140718A1
公开(公告)日：2010-06-10
申请号：US12706295
申请日：2010-02-16
申请人： Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
发明人： Yukihiro Sato , Norio Kido , Tatsuhiro Seki , Katsuo Ishizaka , Ichio Shimizu
IPC分类号： H01L27/092
CPC分类号： H01L23/49575 , H01L23/485 , H01L23/49568 , H01L23/49582 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/05647 , H01L2224/0603 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/8385 , H01L2224/85447 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要： A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor chip including a pMISFET and a second semiconductor chip including an nMISFET are mounted over each of a first tab, second tab, and third tab. The drains of the pMISFET and nMISFET over each tab are electrically connected with each other. Thus, two of six MISFETs can be placed over each of three tabs divided in correspondence with the number of phases of the motor, and they can be packaged in one in a compact manner. As a result, the size of the HSOP for driving a three-phase motor, having a plurality of chips can be reduced.
摘要翻译：具有多个芯片的半导体器件的尺寸减小。在用于驱动三相电机的HSOP（半导体器件）中，包括pMISFET的第一半导体芯片和包括nMISFET的第二半导体芯片安装在第一突片，第二突片和第三突片的每一个上。 pMISFET和nMISFET的漏极在每个接片上彼此电连接。因此，可以将六个MISFET中的两个放置在与电机的相位数相对应地分开的三个接片中的每一个上，并且它们可以以紧凑的方式封装在一个中。结果，可以减少具有多个芯片的用于驱动三相电动机的HSOP的尺寸。

29. 发明授权

US07679173B2 Semiconductor device including a DC-DC converter 有权
标题翻译：包括DC-DC转换器的半导体器件
公开(公告)号：US07679173B2
公开(公告)日：2010-03-16
申请号：US11626564
申请日：2007-01-24
申请人： Tomoaki Uno , Nobuyoshi Matsuura , Yukihiro Sato , Keiichi Okawa , Tetsuya Kawashima , Kisho Ashida
发明人： Tomoaki Uno , Nobuyoshi Matsuura , Yukihiro Sato , Keiichi Okawa , Tetsuya Kawashima , Kisho Ashida
IPC分类号： H01L23/02 , H01L31/111
CPC分类号： H01L23/50 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/05647 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/4847 , H01L2224/48624 , H01L2224/48647 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/05042 , H01L2924/12032 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/01039 , H01L2924/00 , H01L2924/00012 , H01L2924/207
摘要： The electrical characteristics of a semiconductor device are enhanced. In the package of the semiconductor device, there are encapsulated first and second semiconductor chips with a power MOS-FET formed therein and a third semiconductor chip with a control circuit for controlling their operation formed therein. The bonding pads for source electrode of the first semiconductor chip on the high side are electrically connected to a die pad through a metal plate. The bonding pad for source electrode of the second semiconductor chip on the low side is electrically connected to lead wiring through a metal plate. The metal plate includes a first portion in contact with the bonding pad of the second semiconductor chip, a second portion extended from a short side of the first portion to the lead wiring, and a third portion extended from a long side of the first portion to the lead wiring.
摘要翻译：提高了半导体器件的电气特性。在半导体器件的封装中，存在其中形成有功率MOS-FET的封装的第一和第二半导体芯片，以及具有用于控制其中形成的工作的控制电路的第三半导体芯片。高侧的第一半导体芯片的源极的接合焊盘通过金属板电连接到管芯焊盘。低侧的第二半导体芯片的源电极接合焊盘通过金属板电连接到引线。金属板包括与第二半导体芯片的焊盘接触的第一部分，从第一部分的短边延伸到引线布线的第二部分和从第一部分的长边延伸到第三部分的第三部分引线。

30. 发明申请

US20090298593A1 Server Apparatus And Game System 有权
标题翻译：服务器设备和游戏系统
公开(公告)号：US20090298593A1
公开(公告)日：2009-12-03
申请号：US12065824
申请日：2006-08-31
申请人： Kenji Kobayashi , Yukizumi Terao , Yukihiro Sato , Masaru Nakamura
发明人： Kenji Kobayashi , Yukizumi Terao , Yukihiro Sato , Masaru Nakamura
IPC分类号： A63F9/24
CPC分类号： A63F13/795 , A63F13/12 , A63F13/35 , A63F2300/406 , A63F2300/556 , A63F2300/8047
摘要： In a game system, a server apparatus (3) that communicates with a plurality of game devices (1) stores play data elements for a plurality of players and public IDs for identifying a plurality of players in a latest play data table (T1) and a public ID table (T2). The server apparatus (3) transmits to a mobile terminal (4), which is being used by a player, information depending on latest play data elements stored in the latest play data table (T1), the latest play data elements belonging to other players who have been registered with the personal relationship table (T3) as a friend of the player possessing the mobile terminal (4). Upon receiving a public-ID-change request from a mobile terminal (4), which is being used by a player, the server apparatus (3) changes the public ID of the player stored in the public ID table (T2).
摘要翻译：在游戏系统中，与多个游戏装置（1）通信的服务器装置（3）存储多个玩家的播放数据元素和用于识别最新播放数据表（T1）中的多个玩家的公开ID，以及公共ID表（T2）。服务器装置（3）根据存储在最新播放数据表（T1）中的最新播放数据元素向播放器使用的移动终端（4）发送信息，属于其他播放器的最新播放数据元素已经作为拥有移动终端（4）的玩家的朋友登记在个人关系表（T3）中的人。在从玩家正在使用的移动终端（4）接收到公共ID变更请求时，服务器装置（3）改变存储在公开ID表（T2）中的玩家的公开ID。

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