专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US06331729B1 Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them 失效
标题翻译：用于半导体封装的芯片支撑衬底，半导体器件及其制造方法
公开(公告)号：US06331729B1
公开(公告)日：2001-12-18
申请号：US09297296
申请日：1999-08-10
申请人： Masami Yusa , Toshihiko Kato , Fumio Inoue , Shigeki Ichimura
发明人： Masami Yusa , Toshihiko Kato , Fumio Inoue , Shigeki Ichimura
IPC分类号： H01L2340
CPC分类号： H01L23/3121 , H01L23/13 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-sized semiconductor packages preventive of package cracking and having a high reliability, because the function of the vent hole is not damaged and also gases and water vapor which are generated from the insulating film adhesive material at the time of reflowing can be driven off surely outside the package.
摘要翻译：在本发明中，绝缘膜粘合剂材料以帐篷的形式附接到布线上，从而提供与通气孔连通的空的空间。使用该芯片支撑基板使得可以生产小型半导体封装，防止封装开裂并具有高可靠性，因为通气孔的功能不被损坏，并且还产生从绝缘膜产生的气体和水蒸汽在回流时的粘合剂材料可以在包装外确保地被驱除。

22. 发明授权

US6064111A Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package 失效
标题翻译：用于保持半导体封装芯片，半导体封装和半导体封装的制造工艺的衬底
公开(公告)号：US6064111A
公开(公告)日：2000-05-16
申请号：US903996
申请日：1997-07-31
申请人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
发明人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
IPC分类号： H01L23/02 , H01L23/498 , H01L23/495 , H01L21/44
CPC分类号： H01L23/4985 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/181
摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.
摘要翻译：本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。在绝缘支撑基板上的绝缘性支撑基板上形成有各自的配线的绝缘物的绝缘体上设置开口部，绝缘性支撑基板是设置有内部连接部的外部连接部的部分。绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

23. 发明授权

US5976912A Fabrication process of semiconductor package and semiconductor package 失效
标题翻译：半导体封装和半导体封装的制造工艺
公开(公告)号：US5976912A
公开(公告)日：1999-11-02
申请号：US716362
申请日：1996-09-18
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L21/48 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/31 , H01L23/498 , H05K3/20 , H01L23/28
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要翻译： PCT No.PCT / JP95 / 00492 Sec。 371日期1996年9月18日 102（e）1996年9月18日PCT PCT 1995年3月17日PCT公布。公开号WO95 / 26047 日期1995年9月28日提供了半导体封装基板，可以满足半导体高集成化的趋势。将镍层电镀在电镀铜箔上以形成布线图案。将LSI芯片安装在铜箔上，通过引线接合连接LSI芯片和布线图案的端子，然后用半导体密封环氧树脂密封。只有铜箔用碱蚀刻剂溶解掉才能暴露镍。对于具有低铜溶力的镍剥离器，去除镍层以露出布线图案。涂覆阻焊剂，并且以使连接端子部分露出的方式形成图案。将焊球放置在布线图案的露出部分，然后熔合。布线图案通过焊球与外部印刷电路板连接。

24. 发明授权

US5758940A Liquid crystal Projection display 失效
标题翻译：液晶投影显示
公开(公告)号：US5758940A
公开(公告)日：1998-06-02
申请号：US682030
申请日：1996-07-16
申请人： Masanori Ogino , Yoshiaki Iwahara , Takeo Yamada , Shigeru Mori , Fumio Inoue , Akio Yamamoto
发明人： Masanori Ogino , Yoshiaki Iwahara , Takeo Yamada , Shigeru Mori , Fumio Inoue , Akio Yamamoto
IPC分类号： G03B21/14 , H04N9/31
CPC分类号： H04N9/3108 , G03B21/006 , G03B21/14 , G03B21/208 , H04N9/315 , H04N9/3155 , H04N9/3194
摘要： A liquid crystal projection display capable of functioning at a high light capturing efficiency and a high relative corner illuminance comprises a light source means including a light source, a liquid crystal panel means, a projection lens means and a screen means. A liquid lens formed by sealing a liquid in a space between opposite transparent members is disposed near the light source or the real image of the light source to enhance the relative corner illuminance without reducing the light capturing efficiency by multiplying the angle of divergence of light rays emitted by the light source by the reciprocal of the refractive index of the liquid. A first optical system disposed on the entrance side of the liquid crystal panel is provided with a relative corner illuminance enhancing means comprising a first light converging means disposed relatively near to the light source means, and a second light converging means disposed relatively remote from the light source means. The first light converging means enhances the relative corner illuminance on the entrance surface of the second light converging means.
摘要翻译：能够以高的光捕获效率和高的相对角照度起作用的液晶投影显示器包括光源装置，其包括光源，液晶面板装置，投影透镜装置和屏幕装置。通过在相对的透明构件之间的空间中密封液体而形成的液体透镜设置在光源附近或光源的实像附近，以通过将光线的发散角相乘来降低光捕获效率，从而提高相对的角度照度由光源发射的液体的折射率的倒数。设置在液晶面板的入口侧的第一光学系统设置有相对角照明增强装置，包括相对靠近光源装置设置的第一聚光装置和相对远离光的第二聚光装置源意味着。第一聚光装置增强第二聚光装置的入射面上的相对角照度。

25. 发明授权

US5541665A Image processing apparatus with change over of clock signals 失效
标题翻译：具有时钟信号切换的图像处理装置
公开(公告)号：US5541665A
公开(公告)日：1996-07-30
申请号：US362241
申请日：1994-12-22
申请人： Hiroyuki Urata , Masahiro Eto , Atsushi Maruyama , Fumio Inoue , Masanori Ogino , Kiyoshi Yamamoto , Kazutaka Naka , Masaaki Iwanaga
发明人： Hiroyuki Urata , Masahiro Eto , Atsushi Maruyama , Fumio Inoue , Masanori Ogino , Kiyoshi Yamamoto , Kazutaka Naka , Masaaki Iwanaga
IPC分类号： H04N5/12 , H04N5/46 , H04N7/01 , H04N7/12 , H04N11/24 , H04N5/00 , H04N7/015 , H04N7/46
CPC分类号： H04N7/125 , H04N11/006 , H04N7/0105 , H04N5/126 , H04N5/46
摘要： In order to enable sampling of high definition still video signals in addition to common video signals, a function is added for sampling video signals with every other plurality of picture elements as an interval to an image processing apparatus without using a sampling circuit which requires high speed operations. The invention is also intended to change over between two circuits that is, a circuit for using a picture element clock regenerated by a PLL circuit as a sampling clock for analog to digital converters and a circuit for using a clock obtained by dividing the picture element clock as a sampling clock for the analog to digital converters to sample video signals with every other plurality of picture elements as an interval. Thus, it is possible to carry out sampling of high definition video signals with high frequencies in addition to common video signals without necessity of raising the operating speed of the sampling circuit.
摘要翻译：为了能够对公共视频信号进行高分辨率静止图像信号的采样，添加了将图像信号与其他多个像素一起作为图像处理装置的间隔进行采样的功能，而不使用需要高速的采样电路操作。本发明还旨在在两个电路之间切换，即，用于使用由PLL电路再生的像素时钟作为模数转换器的采样时钟的电路和用于使用通过将图像元素时钟作为模数转换器的采样时钟，以与其他多个像素作为间隔采样视频信号。因此，除了公共视频信号之外，可以对高频高清晰度视频信号进行采样，而不需要提高采样电路的工作速度。

26. 发明授权

US5517210A Multi-scan type display system with pointer function 失效
标题翻译：具有指针功能的多扫描型显示系统
公开(公告)号：US5517210A
公开(公告)日：1996-05-14
申请号：US115025
申请日：1993-09-02
申请人： Masanori Ogino , Yasuharu Tamuro , Miyuki Ikeda , Fumio Inoue
发明人： Masanori Ogino , Yasuharu Tamuro , Miyuki Ikeda , Fumio Inoue
IPC分类号： G09G1/16 , G06F3/033 , G09G5/00 , G09G5/08 , G09G5/12 , G09G5/18
CPC分类号： G09G5/08 , G06F3/033
摘要： A multi-scan type display apparatus with pointer function includes a multi-scan type display unit for displaying a plurality of kinds of main picture signals having different numbers of scanning lines and a pointer position identifying signal generating circuit for generating a pointer position identifying signal. The pointer position identifying signal generating circuit transfers the pointer position identifying signal to the multi-scan type display unit, the multi-scan type display unit includes a universal vertical position address signal generating circuit, a horizontal position address signal generating circuit, a pointer signal generating circuit and a superimposing circuit. The pointer signal generating circuit generates a pointer signal in response to the pointer position identifying signal, a universal vertical position address signal and a horizontal position address signal, the pointer signal is superimposed on the main picture signal by the superimposing circuit, so that even if the input signal to the multi-scan type display unit is changed over to a different one having a different number of scanning lines, a pointer display position is kept constant on the display unit, and the pointer position can be moved to a desired position by controlling the pointer position identifying signal.
摘要翻译：具有指针功能的多扫描型显示装置包括：多扫描型显示单元，用于显示具有不同数目的扫描线的多种主图像信号;以及指针位置识别信号产生电路，用于产生指针位置识别信号。指针位置识别信号发生电路将指针位置识别信号传送到多扫描型显示单元，多扫描型显示单元包括通用垂直位置地址信号发生电路，水平位置地址信号发生电路，指针信号发电电路和叠加电路。指针信号发生电路响应于指针位置识别信号，通用垂直位置地址信号和水平位置地址信号产生指针信号，通过叠加电路将指针信号叠加在主图像信号上，使得即使向多扫描型显示单元的输入信号转换为具有不同数目的扫描线的不同的指示器显示位置在显示单元上保持恒定，并且可以通过以下方式将指针位置移动到所需位置控制指针位置识别信号。

27. 发明授权

US4617591A Chroma scanning circuit for use in beam index type color picture reproducing apparatus 失效
标题翻译：用于光束折射型彩色图像再现装置的色度扫描电路
公开(公告)号：US4617591A
公开(公告)日：1986-10-14
申请号：US689005
申请日：1985-01-04
申请人： Fumio Inoue , Masahiro Eto , Takashi Kubota
发明人： Fumio Inoue , Masahiro Eto , Takashi Kubota
IPC分类号： H04N9/24
CPC分类号： H04N9/24
摘要： Disclosed is a chroma scanning circuit used in a beam index type color picture reproducing apparatus, the circuit being provided with an inductance element connected in series to a horizontal deflection coil, and a scanning signal generation circuit connected to a junction between the horizontal deflection coil and the inductance element. The impedance between the junction and the earth at the chroma scanning frequency is increased by the inductance element to thereby make a chroma scanning signal generated from the chroma scanning signal generation circuit flow easily in the horizontal deflection coil.
摘要翻译：公开了一种用于光束折射率型彩色图像再现装置的色度扫描电路，该电路设置有与水平偏转线圈串联连接的电感元件，以及扫描信号产生电路，连接到水平偏转线圈和电感元件。通过电感元件增加色度扫描频率处的结和地之间的阻抗，从而使得从色度扫描信号产生电路产生的色度扫描信号容易地在水平偏转线圈中流动。

28. 发明申请

US20110147072A1 METHOD FOR SURFACE TREATMENT OF COPPER AND COPPER 有权
标题翻译：铜和铜的表面处理方法
公开(公告)号：US20110147072A1
公开(公告)日：2011-06-23
申请号：US13060095
申请日：2009-06-17
申请人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
发明人： Tomoaki Yamashita , Sumiko Nakajima , Sadao Itou , Fumio Inoue , Shigeharu Arike
IPC分类号： H05K1/03 , C23C22/68 , C22C9/00 , B32B15/04
CPC分类号： C23F1/18 , C23F1/02 , H01L2224/16225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H05K3/384 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , Y10T29/49982 , Y10T428/12438 , Y10T428/12771 , Y10T428/24917 , H01L2924/00012 , H01L2924/00014
摘要： An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要翻译：本发明的目的是提供一种铜表面处理方法，其能够确保铜表面和抗蚀剂之间或铜表面与绝缘树脂之间的结合强度，而不会形成尺寸大于1μm的凹凸铜表面和用该方法处理的铜。表面处理方法，包括：在铜表面上离开形成比铜更贵的金属的第一步骤; 在第一步骤之后的第二步，通过用含有氧化剂的碱性溶液氧化在铜表面上形成氧化铜; 以及将氧化铜溶解以除去的第三步骤，从而在铜表面上形成凹凸。

29. 发明授权

US07588835B2 Method of treating the surface of copper and copper 有权
标题翻译：处理铜和铜表面的方法
公开(公告)号：US07588835B2
公开(公告)日：2009-09-15
申请号：US11908329
申请日：2006-03-10
申请人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
发明人： Tomoaki Yamashita , Yasuo Inoue , Masaharu Matsuura , Toyoki Ito , Akira Shimizu , Fumio Inoue , Akishi Nakaso
IPC分类号： B32B15/20 , C23C22/78 , C23C22/63 , C23C22/83
CPC分类号： H05K3/385 , C23C8/02 , C23C8/40 , C23C22/63 , C23C28/00 , C23C28/321 , C23C28/322 , C23C28/345 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H05K3/384 , H05K3/389 , H05K3/4644 , H05K2201/0347 , H05K2201/0373 , H05K2203/0315 , H05K2203/1157 , Y10T428/12438 , Y10T428/12771 , Y10T428/12875 , Y10T428/12903 , Y10T428/12993 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.
摘要翻译：提供一种处理铜表面的方法，以确保铜表面和绝缘层之间的粘合强度，而不会在铜表面上形成超过1um的凹凸，并提高布线之间的绝缘可靠性。还提供了通过上述表面处理方法处理其表面的铜。处理铜的表面的方法包括铜的表面，包括以下步骤：在铜的表面上离散地形成比铜更贵的金属; 然后通过使用含有氧化剂的碱性溶液氧化铜的表面。

30. 发明授权

US07486334B2 Image display system 失效
标题翻译：图像显示系统
公开(公告)号：US07486334B2
公开(公告)日：2009-02-03
申请号：US10897204
申请日：2004-07-23
申请人： Kouzou Masuda , Ikuya Arai , Sadao Tsuruga , Jiro Kawasaki , Tsuyoshi Sano , Tamotsu Nagabayashi , Ryuuichi Someya , Fumio Inoue , Kouji Kitou , Yasuhiro Imai , Masatoshi Hirose
发明人： Kouzou Masuda , Ikuya Arai , Sadao Tsuruga , Jiro Kawasaki , Tsuyoshi Sano , Tamotsu Nagabayashi , Ryuuichi Someya , Fumio Inoue , Kouji Kitou , Yasuhiro Imai , Masatoshi Hirose
IPC分类号： H04N5/445
CPC分类号： H04N5/126 , H04N5/44591 , H04N5/45 , H04N5/52 , H04N5/57 , H04N7/012 , H04N21/4113 , H04N21/4305 , H04N21/4316 , H04N21/4318 , H04N21/440218
摘要： An image display system includes a display device, an input section to which video signals of an interlace scanning system are inputted, a signal converter section which increases horizontal scanning lines of the inputted video signals in number by a factor of at least two, and which generates first and second fields, each of the fields including effective scanning lines used for displaying and ineffective scanning lines not used for displaying, with the effective and ineffective scanning lines being arranged alternately in each of the fields, and a display control section which controls the display device to display the first and second fields alternately. The display control section controls the display device such that positions of the effective scanning lines of the first fields correspond with those of the ineffective scanning lines of the second fields, and vice versa.
摘要翻译：图像显示系统包括：显示装置，输入交错扫描系统的视频信号的输入部分;信号转换部，其将所输入的视频信号的水平扫描线数量增加至少2倍;以及哪个产生第一和第二场，每个场包括用于显示的有效扫描线和不用于显示的无效扫描线，其中有效和无效扫描线交替地布置在每个场中;以及显示控制部分，其控制显示装置交替地显示第一和第二场。显示控制部控制显示装置，使得第一场的有效扫描线的位置与第二场无效扫描线的位置相对应，反之亦然。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式