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21. 发明专利

JP2014025028A Heat-conductive adhesive sheet 审中-公开
标题翻译：导热胶片
公开(公告)号：JP2014025028A
公开(公告)日：2014-02-06
申请号：JP2012168597
申请日：2012-07-30
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , FURUTA KENJI , NAKAYAMA JUNICHI , TOJO MIDORI
IPC分类号： C09J7/02 , B32B15/08 , B32B27/00 , B32B27/20 , B32B27/30 , C09J11/04 , C09J133/06 , C09K5/08
CPC分类号： C09J133/10 , C08K3/22 , C08K2201/001 , C09J7/22 , C09J7/28 , C09J7/30 , C09J9/00 , C09J133/14 , C09J2205/102 , C09J2400/163 , C09J2433/00 , C08F2220/281 , C08F226/10 , C08F220/58 , C08F222/1006
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive adhesive sheet that has excellent workability and handling properties, has excellent appearance, and further is excellent in the direction perpendicular to the thickness direction.SOLUTION: A heat-conductive adhesive sheet 1 is provided with a metal layer 2 and a heat-conductive adhesive agent layer 3 laminated on the rear surface of the metal layer 2. The heat-conductive adhesive agent layer 3 contains: an adhesive component that is produced by polymerizing a monomer component comprising a (meth)acrylic acid alkyl ester; and heat-conductive particles. The monomer component contains substantially no carboxyl-group-containing monomer.
摘要翻译：要解决的问题：提供具有优异的加工性和操作性的导热性粘合片，具有优异的外观，并且在与厚度方向垂直的方向上也是优异的。解决方案：导热粘合片1设置有金属层2和导电性粘合剂层3，其层压在金属层2的背面上。导热性粘合剂层3含有：通过使含有（甲基）丙烯酸烷基酯的单体成分聚合而制造的粘合剂成分，丙烯酸烷基酯; 和导热颗粒。单体组分基本上不含有含羧基的单体。

22. 发明专利

JP2014022442A Electrolytic capacitor 审中-公开
标题翻译：电解电容器
公开(公告)号：JP2014022442A
公开(公告)日：2014-02-03
申请号：JP2012157533
申请日：2012-07-13
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TOJO MIDORI , TERADA YOSHIO , FURUTA KENJI
IPC分类号： H01G9/08
CPC分类号： H01G9/08 , H01G2/08 , H01G9/14
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic capacitor which achieves excellent heat radiation performance and stability.SOLUTION: An electrolytic capacitor 1 includes: a capacitor element 2; an exterior case 3 in which the capacitor element 2 is housed and an upper end part 13 opens, the exterior case 3 including a side wall 10 and a bottom wall 11; and a sealing material 4 which seals an opening of the upper end part 13. In the electrolytic capacitor 1, a heat conductive adhesive sheet 30 is disposed between the capacitor element 2 and an inner surface 26 of the bottom wall 11 of the exterior case 3.
摘要翻译：要解决的问题：提供一种具有优异的散热性能和稳定性的电解电容器。解决方案：电解电容器1包括：电容器元件2; 容纳电容器元件2并且上端部13打开的外壳3，外壳3包括侧壁10和底壁11; 以及密封上端部13的开口部的密封材料4.在电解电容器1中，导电性粘接片30配置在电容器元件2与外壳3的底壁11的内表面26之间。

23. 发明专利

JP2013227379A Thermally-conductive adhesive sheet, method for producing the same, method for affixing thermally-conductive adhesive sheet, and affixed structure 审中-公开
标题翻译：导热粘合片及其制造方法，热传导粘合片的结合方法及其结构
公开(公告)号：JP2013227379A
公开(公告)日：2013-11-07
申请号：JP2012098859
申请日：2012-04-24
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TOJO MIDORI , TERADA YOSHIO , FURUTA KENJI
IPC分类号： C09J7/02 , B32B27/00 , C09J5/00 , C09J11/04 , C09J133/00
CPC分类号： C09J133/08 , C09J7/35 , C09J2201/20 , C09J2201/622
摘要： PROBLEM TO BE SOLVED: To provide: a thermally-conductive adhesive sheet with good reworkability and temporally fixable while being excellent in thermal conductivity; a method for producing the same; a method for affixing the thermally-conductive adhesive sheet; and an affixed structure.SOLUTION: A thermally-conductive adhesive sheet 7 is provided with: an adhesive layer 4 containing thermally-conductive particles; and a base material 5 which is laminated on one surface of the adhesive layer 4 in the thickness direction thereof and is formed with a plurality of through-holes 8 passing therethrough in the thickness direction, wherein the thermal conductivity is at least 0.3 W/m×K.
摘要翻译：要解决的问题：提供：具有良好的再加工性和时间固定性而导热性优异的导热粘合片; 其制造方法; 用于固定导热粘合片的方法; 和固定结构。导热粘合片7设置有：含有导热颗粒的粘合剂层4; 以及基材5，其在厚度方向上层压在粘合剂层4的一个表面上，并且在厚度方向上形成有多个通过其的通孔8，其中导热率为至少0.3W / m ×K。

24. 发明专利

JP2011241328A Heat-conductive self-adhesive sheet 审中-公开
标题翻译：导热自粘片
公开(公告)号：JP2011241328A
公开(公告)日：2011-12-01
申请号：JP2010115603
申请日：2010-05-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TSUKAKOSHI TATSUYA , TERADA YOSHIO , SHOJI AKIRA , FURUTA KENJI , TOJO MIDORI
IPC分类号： C09J7/00 , B32B27/00 , B32B27/30 , C08L33/08 , C09J133/08
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive self-adhesive sheet which can easily adhere a heat-generating member to a heat-releasing member with sufficient adhesive force.SOLUTION: The heat-conductive adhesive sheet having a self-adhesive layer prepared by forming a heat-conductive adhesive composition containing an acrylic polymer component into a sheet-like shape is characterized in that the self-adhesive force on 180° peeling is ≥1 N/20 mm, and the thermal contact resistance is ≤0.6 cmK/W, when the heat-conductive self-adhesive sheet is press-bonded to an adherend at pressure of 200 kPa.
摘要翻译：要解决的问题：提供一种能够以足够的粘合力容易地将发热构件粘附到散热构件的导热性自粘合片。解决方案：通过将含有丙烯酸类聚合物组分的导热粘合剂组合物形成为片状形成的具有自粘层的导热粘合片的特征在于，180°剥离时的自粘力当导热性自粘合片压接在被粘物上时，≥1N/ 20mm，热接触电阻≤0.6cm 2 K / W 在200kPa的压力下。版权所有（C）2012，JPO＆INPIT

25. 发明专利

JP2011162582A Thermally conductive double-sided adhesive sheet 有权
标题翻译：导热双面粘合片
公开(公告)号：JP2011162582A
公开(公告)日：2011-08-25
申请号：JP2010023330
申请日：2010-02-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , NAKAYAMA JUNICHI , FURUTA KENJI , SHOJI AKIRA , TSUKAKOSHI TATSUYA , TOJO MIDORI
IPC分类号： C09J7/00 , B32B27/00 , B32B27/18 , B32B27/30 , C08J7/04 , C09J133/04
CPC分类号： C09J9/00 , C08K2003/2227 , C08K2003/385 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2205/102 , C09J2433/00 , Y10T428/2891
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive double-sided adhesive sheet that can improve workability when pasting together and peeling apart a pair of adherends. SOLUTION: This thermally conductive double-sided adhesive sheet is provided with adhesive layers obtained by molding a thermally conductive adhesive composition, which contains a thermally conductive substance and an acrylic polymer component, into a sheet shape, wherein a strong adhesive layer which forms one surface and a weak adhesive layer which forms another surface are laminated in a manner so that adhesive strength of the one surface with respect to the adherend is stronger than adhesive strength of the other surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种当粘贴在一起并剥离一对被粘物时可以提高加工性的导热双面粘合片。解决方案：该导热双面粘合片设置有通过将含有导热物质和丙烯酸类聚合物成分的导热性粘合剂组合物成型为片状而获得的粘合剂层，其中强粘合剂层形成一个表面和形成另一表面的弱粘合剂层以使得一个表面相对于被粘物的粘合强度比另一个表面的粘合强度更强的层压方式。版权所有（C）2011，JPO＆INPIT

26. 发明专利

JP2009224670A Permanent magnet and method for manufacturing the same 有权
标题翻译：永久磁铁及其制造方法
公开(公告)号：JP2009224670A
公开(公告)日：2009-10-01
申请号：JP2008069382
申请日：2008-03-18
申请人： Nitto Denko Corp , Toyota Motor Corp , トヨタ自動車株式会社 , 日東電工株式会社
发明人： OZEKI IZUMI , KUME KATSUYA , NAKAYAMA JUNICHI , FUKUDA YUKI , HOSHINO TOSHINOBU , HORIO TOMOKAZU , NAKAMURA KENJI
IPC分类号： H01F1/08 , H01F1/053 , H02K15/03
CPC分类号： H01F41/0266 , H01F1/0552 , H01F1/0557 , H01F1/0572 , H01F1/0577 , H01F41/0293 , H01F41/16 , H02K15/03
摘要： PROBLEM TO BE SOLVED: To provide a permanent magnet which simplifies a manufacturing process and is formed with high dimensional precision, and to provide a method of manufacturing the permanent magnet. SOLUTION: The permanent magnet 1 is manufactured by performing wet grinding of a magnet raw material made of 27-30 wt.% of Nd, 60-70 wt.% of Fe, and 1-2 wt.% of B for dispersing in a solvent, adding a resin binder to the ground magnet powder, generating slurry 41 by kneading the magnet powder and the resin binder, and sintering a green sheet 42 where the generated slurry is formed in a sheet. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种简化制造工艺并且以高尺寸精度形成的永磁体，并提供一种制造永磁体的方法。解决方案：通过对由27-30重量％的Nd，60-70重量％的Fe和1-2重量％的B制成的磁体原料进行湿磨，来制造永磁体1，用于分散在溶剂中，向接地磁铁粉末中加入树脂粘合剂，通过捏合磁体粉末和树脂粘合剂产生浆料41，并将生成的浆料形成片材的生片42烧结。版权所有（C）2010，JPO＆INPIT

27. 发明专利

JP2009091485A Double-sided pressure-sensitive adhesive tape or sheet for printed circuit board and printed circuit board 有权
标题翻译：印刷电路板和印刷电路板双面压敏胶带或薄片
公开(公告)号：JP2009091485A
公开(公告)日：2009-04-30
申请号：JP2007264643
申请日：2007-10-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NONAKA TAKAHIRO , DAIGAKU NORIJI , NAKAYAMA JUNICHI
IPC分类号： C09J7/00 , C09J7/02 , C09J7/04 , C09J9/02 , C09J133/00 , C09J165/00 , C09J193/04 , H05K1/03
CPC分类号： C09J133/02 , C08K3/04 , C08K3/08 , C08K5/13 , C08K5/37 , C09J7/10 , C09J7/21 , C09J7/38 , C09J7/385 , C09J9/02 , C09J11/04 , C09J11/06 , C09J11/08 , C09J2203/326 , C09J2205/102 , C09J2400/263 , C09J2433/00 , H05K3/0058 , Y10T428/24909
摘要： PROBLEM TO BE SOLVED: To provide a double-sided pressure-sensitive adhesive tape or sheet for a printed circuit board with electrical conductivity, and to provide a double-sided pressure-sensitive adhesive tape or sheet for the printed circuit board which is excellent in adhesiveness, manifesting an excellent anti-repulsion property after exposing to a high temperature process, and a double-sided pressure-sensitive adhesive tape or sheet for the printed circuit board suppressing or inhibiting mutual adhesion of cut faces after a cutting process and excellent in fine processability and to provide a printed circuit board using the double-sided pressure-sensitive adhesive tape or sheet for the printed circuit board. SOLUTION: The double-sided pressure-sensitive adhesive tape or sheet for a printed circuit board, which is a double-sided pressure-sensitive adhesive tape or sheet used for the printed circuit board, wherein the pressure-sensitive adhesive layer contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于具有导电性的印刷电路板的双面压敏粘合带或片材，并提供用于印刷电路板的双面压敏胶带或片材，粘合性优异，在暴露于高温工艺之后表现出优异的抗排斥性，以及用于印刷电路板的双面压敏粘合带或片材，其抑制或抑制切割后的切割面的相互粘合，精加工性优异，并且使用印刷电路板用双面粘合带或片材提供印刷电路板。解决方案：作为用于印刷电路板的双面粘合带或片材的印刷电路板用双面粘合带或片材，其中压敏粘合剂层含有丙烯酸类聚合物作为主要成分，并且除了导电填料之外，相对于100重量份的压敏粘合剂组合物中的总固体的比例，还含有5至100重量份的导电填料。版权所有（C）2009，JPO＆INPIT

28. 发明专利

JP2014167094A Thermally conductive adhesive sheet 有权
标题翻译：导热粘合片
公开(公告)号：JP2014167094A
公开(公告)日：2014-09-11
申请号：JP2013261727
申请日：2013-12-18
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TERADA YOSHIO , FURUTA KENJI , TOJO MIDORI
IPC分类号： C09J7/00 , C09J201/00
摘要： PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive sheet excellent in thermal conductivity and electric insulation.SOLUTION: A thermally conductive adhesive sheet has an adhesive layer, has a thermal conductivity of 0.5 W/mK or more, and has a relative permittivity of 30 or less measured at a frequency of 120 Hz after being left for one day in the atmosphere of 40°C and 92% RH. Preferably, the thermally conductive adhesive sheet has a relative permittivity of 30 or less measured at a frequency of 1 kHz after being left for one day in the atmosphere of 40°C and 92% RH.
摘要翻译：要解决的问题：提供导热性和电绝缘性优异的导热性粘合片。解决方案：导热性粘合片具有粘合剂层，导热率为0.5W / m·K以上，并且具有相对介电常数在40℃和92％RH的气氛中放置1天后以120Hz的频率测量30或更小。优选地，导热粘合片在40℃和92％RH的气氛中放置1天后，其频率为1kHz时的相对介电常数为30以下。

29. 发明专利

JP2013149952A Semiconductor device, optical semiconductor device and heat dissipation member 有权
标题翻译：半导体器件，光学半导体器件和散热器件
公开(公告)号：JP2013149952A
公开(公告)日：2013-08-01
申请号：JP2012265191
申请日：2012-12-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , KAWAMOTO YUSUKE , FURUTA KENJI , TOJO MIDORI , NAKAYAMA JUNICHI
IPC分类号： H01L23/373 , H01L23/36 , H01L33/64
CPC分类号： C09J133/066 , C08F222/1006 , H01L23/3737 , H01L23/4006 , H01L33/64 , H01L2924/0002 , H01L2933/0075 , C08F2220/1858 , C08F2220/281 , C08F226/08 , C08F220/58 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device including a semiconductor device which can effectively prevent uplift of a mounting substrate and a heat dissipation member; and provide a heat dissipation member used for the semiconductor device and the optical semiconductor device.SOLUTION: An optical semiconductor device 5 comprises: an optical semiconductor mounting substrate 6 on which an optical semiconductor element 8 is mounted; a heat sink 7 arranged at a distance from the optical semiconductor mounting substrate 6 in an opposed manner; and an adhesive heat dissipation sheet 1 which is sandwiched between the optical semiconductor mounting substrate 6 and the heat sink 7, and which adheres to the optical semiconductor mounting substrate 6 and the heat sink 7. The adhesive heat dissipation sheet has an interchuck distance of 20 mm, a tensile rate of 300 mm/min and tensile elasticity measured at 23°C of 600 MPa and under.
摘要翻译：要解决的问题：提供一种包括可以有效防止安装基板和散热构件的隆起的半导体装置的光学半导体装置; 并提供用于半导体器件和光学半导体器件的散热构件。解决方案：光学半导体器件5包括：安装有光学半导体元件8的光学半导体安装基板6; 以相对的方式与光半导体安装基板6一定距离配置的散热器7; 以及夹在光半导体安装基板6和散热器7之间并附着于光半导体安装基板6和散热片7的粘合性散热片1。粘合散热片的间隙距离为20 mm，拉伸速度为300mm / min，在23℃下测定的拉伸弹性为600MPa以下。

30. 发明专利

JP2013138105A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2013138105A
公开(公告)日：2013-07-11
申请号：JP2011288199
申请日：2011-12-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAYAMA JUNICHI , TERADA YOSHIO , HATA KENTA , FURUTA KENJI , TOJO MIDORI , FURUTA YOSHIHISA
IPC分类号： H01L33/48 , H01L33/64
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can manufacture a semiconductor device with excellent manufacturing efficiency and which can prevent deterioration in performance of the obtained semiconductor device; and provide a semiconductor device obtained by the manufacturing method.SOLUTION: A semiconductor device manufacturing method comprises: preparing a substrate 3 on which a light-emitting diode element 2 is mounted on a top face; installing a spacer member 4 thicker than a thickness T1 of the light-emitting diode element 2 on the top face of the substrate 3 exposed from the light-emitting diode element 2; and pressure bonding the substrate 3 on which the space member 4 is installed to a support medium 10 by a roller 9 via a pressure-sensitive adhesive sheet 7 to manufacture a light-emitting diode device 1.
摘要翻译：要解决的问题：提供一种半导体器件制造方法，其可以制造具有优异的制造效率并能够防止所获得的半导体器件的性能劣化的半导体器件; 并提供通过制造方法获得的半导体器件。解决方案：一种半导体器件制造方法，包括：准备在顶面上安装有发光二极管元件2的衬底3; 在从发光二极管元件2暴露的基板3的顶面上安装比发光二极管元件2的厚度T1厚的间隔件4; 并且通过压敏粘合片7通过辊9将其上安装有空间部件4的基板3压接到支撑介质10上，以制造发光二极管装置1。

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