会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 21. 发明专利
    • Method of producing fluorinated alkene
    • 生产氟化碱的方法
    • JP2012131731A
    • 2012-07-12
    • JP2010284558
    • 2010-12-21
    • Nippon Zeon Co Ltd日本ゼオン株式会社
    • SUGIMOTO TATSUYA
    • C07C17/23C07C21/18
    • PROBLEM TO BE SOLVED: To provide a method of producing a fluorinated alkene useful as: a plasma reaction gas for etching, CVD and the like useful in a production field of a semiconductor device; a monomer as a raw material for a fluorine-containing polymer; or raw materials of a fluorine-containing pharmaceutical intermediate and a hydrofluoro carbon solvent.SOLUTION: A halogen atom is reduced to be converted into the fluorinated alkene, by bringing a halogen-containing fluorinated olefin into contact with zinc and/or magnesium at 0°C or less of temperature in the presence of an acid. The fluorinated alkene of an objective product is easily refined and a yield is enhanced, by adding a dienophile compound to a reaction liquid from which a metal residue is removed, after the reaction, to subject a fluorine-containing butadiene compound to cyclization reaction.
    • 解决问题的方法:提供可用作以下的氟化烯烃的制造方法:用于半导体装置的制造领域的用于蚀刻的等离子体反应气体,CVD等; 作为含氟聚合物的原料的单体; 或含氟药物中间体和氢氟碳溶剂的原料。 解决方案:在酸的存在下,通过使含卤素的氟化烯烃在0℃或更低的温度下与锌和/或镁接触,将卤素原子还原成转化为氟化烯烃。 通过在去除金属残留物的反应液中添加亲二烯体化合物,反应后,使含氟丁二烯化合物进行环化反应,容易地精制目的产物的氟化烯并提高产率。 版权所有(C)2012,JPO&INPIT
    • 22. 发明专利
    • Fluorine-containing alkene compound and method for producing the same
    • 含氟的烯烃化合物及其生产方法
    • JP2009269891A
    • 2009-11-19
    • JP2008124375
    • 2008-05-12
    • Nippon Zeon Co Ltd日本ゼオン株式会社
    • NAKASUGI SHIGEMASAISHIMURA TAKAYUKISUGIMOTO TATSUYA
    • C07C21/18C07B61/00C07C17/20C07C17/23C07C17/25C07C21/22
    • PROBLEM TO BE SOLVED: To provide a new fluorine-containing alkene compound which is a useful precursor for producing a perfluoroalkyne compound efficiently, and the new compound.
      SOLUTION: This fluorine-containing alkene compound is obtained by reacting a chlorine-containing alkene compound with sodium borohydride, and also the fluorine-containing alkene compound can be obtained by reacting hydrogen fluoride with a halogen-containing alkene compound or a halogen-containing alkane compound in the presence of a fluorination catalyst. From thus obtained fluorine-containing alkene compound, the perfluoroalkyne compound can be obtained in a high yield and in good productivity by removing hydrochloric acid by using a method of reacting with an aqueous alkaline solution, etc.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种新的含氟烯烃化合物,其是有效地生产全氟炔烃化合物的有用前体和新的化合物。 解决方案:该含氟烯烃化合物是通过使含氯烯烃化合物与硼氢化钠反应得到的,并且含氟烯烃化合物可以通过使氟化氢与含卤素的烯烃化合物或卤素 在氟化催化剂存在下进行烷基化。 通过这样得到的含氟烯烃化合物,可以通过使用与碱性水溶液等反应的方法除去盐酸,以高产率和高生产率获得全​​氟炔化合物。(C)2010 ,JPO&INPIT
    • 24. 发明专利
    • Etching method
    • 蚀刻方法
    • JP2008300616A
    • 2008-12-11
    • JP2007144870
    • 2007-05-31
    • Nippon Zeon Co Ltd日本ゼオン株式会社
    • SUGIMOTO TATSUYANAKASUGI SHIGEMASANAKAMURA MASAHIRO
    • H01L21/3065H01L21/027
    • PROBLEM TO BE SOLVED: To provide an etching method etching a laminated film containing a silicon oxide-film layer in at least one layer and a silicon nitride-film layer in at least one layer by a single treating gas. SOLUTION: In the etching method, a body to be treated with the laminated film containing the silicon oxide-film layer in at least one layer and the silicon nitride-film layer in at least one layer is fitted into a treating chamber, the treating gas is introduced and both the silicon oxide-layer film and the silicon nitride-film layer in the laminated film are etched. In the etching method, the treating gas contains C a H b F c (a=3 to 5, b=1 to 2 and c=3 to 10). COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种蚀刻方法,通过单个处理气体在至少一层中蚀刻含有氧化硅膜层的层叠膜和至少一层的氮化硅膜层。 解决方案:在蚀刻方法中,将至少一层中含有氧化硅膜层的叠层膜和至少一层中的氮化硅膜层处理的物体装配到处理室中, 导入处理气体,并对层叠膜中的氧化硅层和氮化硅膜层进行蚀刻。 在蚀刻方法中,处理气体含有C(a = 3〜5,b = 1〜2,c = 3〜10)。 版权所有(C)2009,JPO&INPIT
    • 25. 发明专利
    • Liquid and method for cleaning semiconductor substrate
    • 用于清洁半导体基板的液体和方法
    • JP2005079239A
    • 2005-03-24
    • JP2003306019
    • 2003-08-29
    • Nippon Zeon Co Ltd日本ゼオン株式会社
    • NAKAMURA MASAHIROSUGIMOTO TATSUYA
    • C11D7/26C11D7/30C11D7/50H01L21/304
    • PROBLEM TO BE SOLVED: To provide a semiconductor substrate cleaning liquid which is for cleaning a semiconductor substrate that has been applied with a chemical-mechanical polishing treatment and which has an excellent cleaning performance.
      SOLUTION: The semiconductor substrate cleaning liquid is a cleaning liquid for cleaning a semiconductor substrate which has been applied with a chemical-mechanical polishing treatment. The semiconductor substrate cleaning liquid is mainly made of fluorinated hydrocarbon including 4-6 carbons expressed by a formula (I): Rf1-CHF-CF2-Rf2, where Rf1 and Rf2 are independent perfluoroalkyl groups, but could be bonded together to form a ring. A semiconductor substrate cleaning method includes a process wherein the semiconductor substrate cleaning liquid kept at 35°C or above is brought into contact with the surface of a semiconductor substrate polished with a chemical-mechanical polishing agent to remove metal impurities and particle contamination.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种半导体衬底清洗液,用于清洁已经进行了化学机械抛光处理的半导体衬底并具有优异的清洁性能。 解决方案:半导体衬底清洗液是用于清洁已经进行化学机械抛光处理的半导体衬底的清洗液。 半导体基板清洗液主要由包含4-6个碳原子的氟化烃构成,式(I)表示:Rf1-CHF-CF2-Rf2,其中Rf1和Rf2是独立的全氟烷基,但可以结合在一起形成环 。 半导体衬底清洁方法包括使保持在35℃以上的半导体衬底清洁液体与用化学机械抛光剂抛光的半导体衬底的表面接触以除去金属杂质和颗粒污染的过程。 版权所有(C)2005,JPO&NCIPI
    • 27. 发明专利
    • Gas for plasma reaction, method for forming fluorine- containing organic film, and fluorine-containing organic film
    • 用于等离子体反应的气体,形成含氟的有机膜的方法和含氟的有机膜
    • JP2003286576A
    • 2003-10-10
    • JP2002091349
    • 2002-03-28
    • Nippon Zeon Co Ltd日本ゼオン株式会社
    • SUGIMOTO TATSUYATANAKA KIMIAKI
    • C23C16/50H01L21/312
    • PROBLEM TO BE SOLVED: To provide a gas for plasma reaction, which makes handling for a source gas easy, and forms a fluorine-containing organic film having a low relative permittivity at a high deposition rate, and to provide a method for forming the fluorine-containing organic film with the use of the gas, and the fluorine-containing organic film obtained by the forming method.
      SOLUTION: The method for forming the fluorine-containing organic film on a substrate with a chemical vapor deposition method, is characterized by using the gas for the plasma reaction, which includes at least one sort of a 3-8C unsaturated cyclic hydrofluorocarbon. The fluorine-containing organic film is characterized by being formed by the forming method.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种用于等离子体反应的气体,这使得易于处理源气体,并且以高沉积速率形成具有低相对介电常数的含氟有机膜,并且提供一种方法 通过使用气体形成含氟有机膜,以及通过形成方法获得的含氟有机膜。 解决方案:通过化学气相沉积法在基板上形成含氟有机膜的方法的特征在于使用用于等离子体反应的气体,其包括至少一种3-8C不饱和环状氢氟烃 。 含氟有机膜的特征在于通过成型方法形成。 版权所有(C)2004,JPO
    • 28. 发明专利
    • High-purity 2,2-difluorobutane
    • 高纯度2,2-DIFLUOROBUTANE
    • JP2014185111A
    • 2014-10-02
    • JP2013061453
    • 2013-03-25
    • Nippon Zeon Co Ltd日本ゼオン株式会社
    • SUGIMOTO TATSUYA
    • C07C19/08C09K13/08
    • PROBLEM TO BE SOLVED: To provide a high-purity 2,2-difluorobutane suitable as a gas for plasma reactions targeting semiconductors.SOLUTION: A high-purity 2,2-difluorobutane suitable as a gas for plasma reactions can be acquired past a rectifying step of purifying a crude 2,2-difluorobutane included within a crude reaction product until the purity thereof and combined contents of fluorobutenes and 2-butyne therein become 99.9 vol.% or above and 800 vol.ppm or below, respectively, a step of removing water from the purified product based on the contact thereof with an adsorbent, and a step of abating, by simple-distilling the 2,2-difluorobutane, nitrogen and oxygen concentrations within the 2,2-difluorobutane to 100 vol.ppm or below and 50 vol.ppm or below, respectively.
    • 要解决的问题:提供适合作为靶向半导体的等离子体反应气体的高纯度2,2-二氟丁烷。解决方案:适合作为等离子体反应气体的高纯度2,2-二氟丁烷可以通过整流 纯化包含在粗反应产物中的粗制2,2-二氟丁烷的步骤,直到其纯度和其中的氟代丁烯和2-丁炔的组合含量分别为99.9vol。%或更高,并且分别为800vol.ppm或更低,步骤 基于其与吸附剂的接触从净化产物中除去水,以及通过简单蒸馏2,2-二氟丁烷将2,2-二氟丁烷中的氮和氧浓度降至100体积ppm以下来减轻的步骤 和50体积ppm以下。