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21. 发明授权

US08445807B2 Electrode wire for wire electrical discharge machining, method for manufacturing the same, and method for electrical discharge machining using the same 有权
标题翻译：线放电加工用电极线及其制造方法以及使用其的放电加工方法
公开(公告)号：US08445807B2
公开(公告)日：2013-05-21
申请号：US13233303
申请日：2011-09-15
申请人： Koichi Hashizume , Masakazu Yoshimoto , Nobuyuki Washio , Yoichiro Kimoto , Hiroshi Sato , Isao Izui
发明人： Koichi Hashizume , Masakazu Yoshimoto , Nobuyuki Washio , Yoichiro Kimoto , Hiroshi Sato , Isao Izui
IPC分类号： B23H7/08 , B23H1/04 , B23H1/06
CPC分类号： B21C1/003 , B21C9/00 , B23H7/08 , Y10T428/12903
摘要： A wire material having a copper-zinc alloy layer, which is formed by action of thermal diffusion, and a zinc layer on its circumference surface is subjected to processes, including from a step of drawing the wire material to a step of reducing the diameter of the product, to reliably crash the copper-zinc alloy layer into particles. The particles are embedded in the circumference surface of a core to integrate the diffusion alloy layer and zinc layer with the core and prevent the diffusion alloy layer and zinc layer from falling off from the core. In addition, in order to cover cracks formed in the copper-zinc alloy layer during wire drawing with a zinc thin film, wire drawing is performed at temperatures appropriate for maintaining good malleability and ductility of zinc.
摘要翻译：对具有由热扩散作用形成的铜 - 锌合金层和其周面上的锌层的线材进行处理，其中包括从将线材拉丝至减小直径的步骤该产品可以将铜 - 锌合金层可靠地碰撞成颗粒。将颗粒嵌入芯的圆周表面，使扩散合金层和锌层与芯体结合，防止扩散合金层和锌层从芯脱落。此外，为了覆盖用锌薄膜拉丝时在铜 - 锌合金层中形成的裂纹，在适于维持锌的良好延展性和延展性的温度下进行拉丝。

22. 发明申请

US20120217556A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20120217556A1
公开(公告)日：2012-08-30
申请号：US13459839
申请日：2012-04-30
申请人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
发明人： Ryoichi Kajiwara , Masahiro Koizumi , Toshiaki Morita , Kazuya Takahashi , Munehisa Kishimoto , Shigeru Ishii , Toshinori Hirashima , Yasushi Takahashi , Toshiyuki Hata , Hiroshi Sato , Keiichi Ookawa
IPC分类号： H01L29/78
CPC分类号： H01L23/49555 , H01L21/4814 , H01L21/56 , H01L21/561 , H01L21/565 , H01L23/28 , H01L23/3107 , H01L23/495 , H01L23/4952 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/83 , H01L24/84 , H01L24/97 , H01L29/7833 , H01L2224/0401 , H01L2224/04026 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16245 , H01L2224/29011 , H01L2224/29015 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/45139 , H01L2224/73253 , H01L2224/75251 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/83101 , H01L2224/83138 , H01L2224/83191 , H01L2224/83825 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18301 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H05K3/3426 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2224/29139 , H01L2924/3512 , H01L2224/48 , H01L2924/00012
摘要： A semiconductor device featuring a semiconductor chip having a first main surface and a second, opposing main surface and including a MOSFET having source and gate electrodes formed on the first main surface and a drain electrode thereof formed on the second main surface, first and second conductive members acting as lead terminals for the source and gate electrodes, respectively, are disposed over the first main surface, each of the first and second conductive members has a part overlapped with the chip in a plan view, a sealing body sealing the chip and parts of the first and second conductive members such that a part of the first conductive member is projected outwardly from a first side surface of the sealing body and parts of the first and second conductive members are projected outwardly from the opposing second side surface of the sealing body in a plan view.
摘要翻译：一种具有半导体芯片的半导体器件，具有第一主表面和第二相对的主表面，并且包括形成在第一主表面上的源极和栅电极的MOSFET，以及形成在第二主表面上的漏电极，第一和第二导电作为源电极和栅电极的引线端子的部件分别设置在第一主表面上，第一和第二导电部件中的每一个在平面图中与芯片重叠，密封体密封芯片和部件的第一和第二导电构件，使得第一导电构件的一部分从密封体的第一侧表面向外突出，并且第一和第二导电构件的部分从密封体的相对的第二侧表面向外突出在平面图中。

23. 发明授权

US08253247B2 Semiconductor device and method for manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US08253247B2
公开(公告)日：2012-08-28
申请号：US12756208
申请日：2010-04-08
申请人： Noriko Numata , Hiroshi Sato , Toru Ueguri
发明人： Noriko Numata , Hiroshi Sato , Toru Ueguri
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L29/7813 , H01L23/4824 , H01L23/49524 , H01L23/49562 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/77 , H01L24/78 , H01L24/84 , H01L24/85 , H01L24/97 , H01L29/41766 , H01L29/4236 , H01L29/42372 , H01L29/42376 , H01L29/456 , H01L29/66719 , H01L29/7811 , H01L2223/54486 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/32245 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48132 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/73219 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/78 , H01L2224/83801 , H01L2224/8385 , H01L2224/85205 , H01L2224/85399 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30105 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00012
摘要： In a method for manufacturing a semiconductor device involving the step of bonding a metallic ribbon to a pad of a semiconductor chip, breakage of the metallic ribbon is to be prevented while ensuring the bonding strength even when the metallic ribbon becomes thin with reduction in size of the semiconductor chip. In bonding an Al ribbon to a pad of a semiconductor chip by bringing a pressure bonding surface of a wedge tool into pressure contact with the Al ribbon while applying ultrasonic vibration to the ribbon positioned over the pad, recesses 10a are formed beforehand at both end portions respectively of the wedge tool lest both end portions in the width direction of the Al ribbon bonded to the pad should contact the pressure bonding surface of the wedge tool.
摘要翻译：在涉及将金属带接合到半导体芯片的焊盘的步骤的半导体器件的制造方法中，即使当金属带变薄时，也可以确保金属带的断裂，同时确保接合强度，同时尺寸减小半导体芯片。通过使楔形工具的压接面与Al带压接，同时对位于焊盘上的带施加超声波振动，将Al带接合到半导体芯片的焊盘，在两端部预先形成有凹部10a 分别与楔形工具接合的Al带的宽度方向上的两个端部应接触楔形工具的压接表面。

24. 发明授权

US08239894B2 Electronic apparatus, display controlling method for electronic apparatus and graphical user interface 有权
标题翻译：电子设备，电子设备的显示控制方法和图形用户界面
公开(公告)号：US08239894B2
公开(公告)日：2012-08-07
申请号：US11177363
申请日：2005-07-11
申请人： Shingo Utsuki , Kazuto Nishizawa , Daisuke Inaishi , Ko Kusanagi , Hiroshi Sato , Daisuke Sato , Kenichi Moriwaki , Satoshi Kanda , Yuji Ishimura , Shimon Sakai , Masahiro Urano
发明人： Shingo Utsuki , Kazuto Nishizawa , Daisuke Inaishi , Ko Kusanagi , Hiroshi Sato , Daisuke Sato , Kenichi Moriwaki , Satoshi Kanda , Yuji Ishimura , Shimon Sakai , Masahiro Urano
IPC分类号： G06F3/00 , G06F13/00 , G06F3/048 , H04N5/445
CPC分类号： H04N5/44543 , G06F3/0485 , H04N5/44591 , H04N21/4312 , H04N21/4622 , H04N21/47 , H04N21/482 , H04N21/84
摘要： A graphical user interface is disclosed which achieves an easy search for a desired item upon scrolling. A plurality of representation images individually representing different selection object items are displayed in an array along one direction of a display screen. A noticed representation image selected from among the representation images is displayed emphatically at a fixed position on the display screen, and explanation information of the noticed representation image is displayed in the proximity of the noticed representation image. If a scrolling information for the array of representation images is issued, then scrolling is executed such that explanation information also of the representation images other than the noticed representation image is displayed. Further, a bar display including a mark representing the position and the group of the noticed representation image in the array of representation images is displayed together.
摘要翻译：公开了一种图形用户界面，其在滚动时实现对期望项目的容易搜索。分别表示不同选择对象项目的多个表示图像以显示屏幕的一个方向在阵列中显示。在显示屏幕上的固定位置处强调地显示从表示图像中选择的注意到的表示图像，并且在注意到的表示图像附近显示注意的表示图像的说明信息。如果发出用于表示图像数组的滚动信息，则执行滚动，使得显示除了被注意的表示图像之外的表示图像的说明信息。此外，一起显示包括表示图像阵列中的注意的表示图像的位置和组的标记的标记。

25. 发明申请

US20120122289A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD 失效
标题翻译：半导体器件制造方法
公开(公告)号：US20120122289A1
公开(公告)日：2012-05-17
申请号：US13356812
申请日：2012-01-24
申请人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato
发明人： Kenji Matsumoto , Hitoshi Itoh , Hiroshi Sato
IPC分类号： H01L21/02
CPC分类号： H01L21/31604 , H01L21/3145 , H01L28/40
摘要： Provided is a semiconductor device manufacturing method for a capacitor having a dielectric film which can be formed into a thin film, can be formed at a low temperature, and has a readily controllable property. The manufacturing method includes: forming, on a conductor for serving as one electrode of a capacitor, a manganese oxide film for serving as a dielectric film of the capacitor; and forming, on the manganese oxide film, a conductive film for serving as the other electrode of the capacitor.
摘要翻译：提供一种具有可形成为薄膜的电介质膜的电容器的半导体器件制造方法，可以在低温下形成，并具有容易控制的特性。制造方法包括：在用作电容器的一个电极的导体上形成用作电容器的电介质膜的氧化锰膜; 在氧化锰膜上形成用作电容器的另一个电极的导电膜。

26. 发明授权

US08111869B2 Speaker device 失效
标题翻译：扬声器装置
公开(公告)号：US08111869B2
公开(公告)日：2012-02-07
申请号：US12515112
申请日：2006-11-17
申请人： Minoru Horigome , Hiroshi Sato , Takuei Nagasawa , Hiroya Oizumi
发明人： Minoru Horigome , Hiroshi Sato , Takuei Nagasawa , Hiroya Oizumi
IPC分类号： H04R1/00 , H04R9/06 , H04R11/02
CPC分类号： H04R9/043 , H04R2307/207 , H04R2499/13
摘要： A speaker device includes a damper allowing high linearity. The speaker device includes a vibration body including a damper and a voice coil bobbin (bobbin), and a magnetic circuit having a plate. The damper has a first member arranged opposite the plate, and a second member projecting on a side of the plate from the first member. The first member has a movable part elastically supporting the bobbin. The movable part is a flat plate, and behaves with respect to a bent part provided between the movable part and the second member with movement of the bobbin in an acoustic radiation direction and reverse. Therefore, when a constant force is given to the damper via the voice coil, a displacement of the damper with respect to a rest position can be substantially similar in such a case that the damper behaves in the acoustic radiation direction and the reverse.
摘要翻译：扬声器装置包括允许高线性度的阻尼器。扬声器装置包括具有阻尼器和音圈管架（绕线管）的振动体和具有板的磁路。阻尼器具有与板相对设置的第一构件和从第一构件突出于板的一侧的第二构件。第一构件具有弹性地支撑线轴的可动部。可移动部分是平板，并且相对于设置在可移动部分和第二部件之间的弯曲部分，在线轴在声辐射方向和相反方向上运动。因此，当通过音圈向阻尼器施加恒定的力时，阻尼器相对于静止位置的位移在阻尼器在声辐射方向和相反方向上的行为的情况下可以基本相似。

27. 发明授权

US08077246B2 Method and apparatus for controlling imaging direction and magnification of camera 有权
标题翻译：用于控制摄像机成像方向和放大倍率的方法和装置
公开(公告)号：US08077246B2
公开(公告)日：2011-12-13
申请号：US11376882
申请日：2006-03-15
申请人： Katsuhiko Mori , Masakazu Matsugu , Masami Kato , Yusuke Mitarai , Yuji Kaneda , Hiroshi Sato
发明人： Katsuhiko Mori , Masakazu Matsugu , Masami Kato , Yusuke Mitarai , Yuji Kaneda , Hiroshi Sato
IPC分类号： H04N5/225
CPC分类号： G03B17/00 , G01S3/7864 , G06T3/40 , G06T7/73 , G06T7/80 , H04N5/232
摘要： At least one exemplary embodiment is directed to an imaging processing method where a plurality of images are picked up while an imaging direction of a camera is being changed. The images are combined into a composite image. A target region is specified within the composite image. An imaging direction and an imaging magnification for imaging an object included in the target region in a predetermined size are calculated based on a position and a size of the target region in the composite image and an imaging parameter set for the camera when the plurality of images are picked up. Accordingly, the imaging direction and the imaging magnification for imaging the object to be imaged can be set easily.
摘要翻译：至少一个示例性实施例涉及其中在改变相机的成像方向的同时拾取多个图像的成像处理方法。图像被组合成合成图像。在合成图像中指定目标区域。基于所述合成图像中的目标区域的位置和大小以及当所述多个图像中的所述相机的成像参数设定时，计算用于对包括在所述目标区域中的对象进行成像的成像方向和成像倍率被拾起因此，可以容易地设定用于对待成像对象进行成像的成像方向和成像倍率。

28. 发明授权

US08073184B2 Speaker device 有权
标题翻译：扬声器装置
公开(公告)号：US08073184B2
公开(公告)日：2011-12-06
申请号：US12514872
申请日：2006-11-17
申请人： Minoru Horigome , Michiro Matsuda , Hiroshi Sato
发明人： Minoru Horigome , Michiro Matsuda , Hiroshi Sato
IPC分类号： H04R1/02
CPC分类号： H04R9/02 , H04R1/06
摘要： In a speaker device, cutting wiring electrically connected to a conductive wire of an electronic component and a voice coil, and the conductive wire and the wiring are electrically connected without a speaker terminal lug. The speaker device includes wiring electrically connected to the voice coil, an electronic component having a component wire, and a frame. The frame has a conductive wire fixing part for fixing the conductive wire, and the conductive wire is fixed to the conductive wire fixing part to be directly connected to the wiring. Thereby, even if a vibration is transmitted to the frame at the time of driving the speaker device, the conductive wire never vibrates, and the conductive wire does not pull the wiring. Therefore, the conductive wire and wiring are not cut. Also, since the conductive wire is the speaker terminal lug, cost of the speaker device can be reduced.
摘要翻译：在扬声器装置中，电连接到电子部件和音圈的导线的切割布线和导线和布线电连接而没有扬声器端子凸耳。扬声器装置包括电连接到音圈的布线，具有部件导线的电子部件和框架。框架具有用于固定导线的导电线固定部分，并且导线固定到导电线固定部分以直接连接到布线。因此，即使在驱动扬声器装置时振动传递到框架，导线也不会振动，并且导线不拉动布线。因此，导线和布线不被切割。此外，由于导线是扬声器端子凸耳，所以可以降低扬声器装置的成本。

29. 发明申请

US20110224862A1 VEHICULAR CONTROL OBJECT DETERMINATION SYSTEM AND VEHICULAR TRAVEL LOCUS ESTIMATION SYSTEM 失效
标题翻译：车辆控制对象确定系统和车辆行驶位置估计系统
公开(公告)号：US20110224862A1
公开(公告)日：2011-09-15
申请号：US13114663
申请日：2011-05-24
申请人： Kiichiro Sawamoto , Shigeru Inoue , Hiroshi Sato
发明人： Kiichiro Sawamoto , Shigeru Inoue , Hiroshi Sato
IPC分类号： G06F7/00
CPC分类号： B60W40/02 , B60W10/06 , B60W30/16 , B60W2550/20 , G08G1/16
摘要： In a vehicular control object determination system, locus correlation degree calculator calculates a degree of correlation between a future travel locus of a vehicle estimated by first travel locus estimator based on a vehicle speed and a yaw rate and a future travel locus of the vehicle estimated by second travel locus estimator based on a past travel locus of the vehicle calculated by travel locus calculator. When control object determiner determines a control object based on the travel locus estimated by the first travel locus estimator and predetermined control object determination conditions, the control object determination conditions are modified according to the degree of correlation, that is, the degree of reliability of the travel locus estimated by the first travel locus estimator, thereby achieving both accuracy with which the control object is determined and determination of the control object at a distance.
摘要翻译：在车辆控制对象确定系统中，轨迹相关度计算器基于车速和横摆率来计算由第一行驶轨迹估计器估计出的车辆的未来行驶轨迹与由基于由行驶轨迹计算器计算的车辆的过去行驶轨迹的第二行驶轨迹估计器。当控制对象确定器基于由第一行进轨迹估计器估计的行驶轨迹和预定控制对象确定条件来确定控制对象时，根据相关程度，即相关度的可靠度来修改控制对象确定条件由第一行进轨迹估计器估计的行驶轨迹，从而获得确定控制对象的精度和距离上的控制对象的确定。

30. 发明授权

US07986346B2 Image capturing apparatus, control method therefor, program, and storage medium 有权
标题翻译：图像捕获装置，其控制方法，程序和存储介质
公开(公告)号：US07986346B2
公开(公告)日：2011-07-26
申请号：US11935803
申请日：2007-11-06
申请人： Yuji Kaneda , Masakazu Matsugu , Katsuhiko Mori , Hiroshi Sato
发明人： Yuji Kaneda , Masakazu Matsugu , Katsuhiko Mori , Hiroshi Sato
IPC分类号： H04N5/228 , G06K9/46 , G03B17/00
CPC分类号： H04N5/772 , H04N5/23212 , H04N5/23216 , H04N5/23219 , H04N5/23222 , H04N5/235 , H04N5/85
摘要： An image capturing apparatus includes an image input unit which photo-electrically converts an object image to generate an image signal, a status determination unit which determines an object status in an image generated by the image input unit, an automatic image capturing instruction unit which starts an automatic image capturing operation as an operation to automatically store the image generated by the image input unit in the first storage unit when the object status determined by the status determination unit satisfies a predetermined automatic image capturing condition, and a shooting control unit which automatically stores the image generated by the image input unit in the second storage unit when the object status does not satisfy the automatic image capturing condition even upon the lapse of a predetermined time after the automatic image capturing instruction unit designates the automatic image capturing operation.
摘要翻译：一种摄像装置包括：图像输入单元，其对物体图像进行光电转换以产生图像信号;状态确定单元，确定由图像输入单元生成的图像中的对象状态;自动图像捕获指令单元，其启动自动图像拍摄操作，用于当由状态确定单元确定的对象状态满足预定的自动图像拍摄条件时，自动将由图像输入单元生成的图像存储在第一存储单元中的操作;以及拍摄控制单元，其自动存储当自动图像拍摄指令单元指定自动图像捕获操作时，即使经过了预定时间，当物体状态不满足自动图像拍摄条件时，由第二存储单元中的图像输入单元生成的图像。

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