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21. 发明授权

US08112152B2 Feedthrough apparatus with noble metal-coated leads 有权
公开(公告)号：US08112152B2
公开(公告)日：2012-02-07
申请号：US12397774
申请日：2009-03-04
申请人： William J. Taylor , Lynn M. Seifried , William D. Wolf , Andrew J. Ries , John E. Kast
发明人： William J. Taylor , Lynn M. Seifried , William D. Wolf , Andrew J. Ries , John E. Kast
IPC分类号： A61N1/375
CPC分类号： A61N1/3754
摘要： Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.

22. 发明授权

US07560318B2 Process for forming an electronic device including semiconductor layers having different stresses 有权
标题翻译：用于形成包括具有不同应力的半导体层的电子器件的工艺
公开(公告)号：US07560318B2
公开(公告)日：2009-07-14
申请号：US11374372
申请日：2006-03-13
申请人： Mariam G. Sadaka , Venkat R. Kolagunta , William J. Taylor , Victor H. Vartanian
发明人： Mariam G. Sadaka , Venkat R. Kolagunta , William J. Taylor , Victor H. Vartanian
IPC分类号： H01L21/84
CPC分类号： H01L21/84 , H01L21/76256 , H01L27/1203 , H01L29/7842 , H01L29/785 , H01L29/78687
摘要： An electronic device can have an insulating layer lying between a first semiconductor layer and a base layer. A second semiconductor layer, having a different composition and stress as compared to the first semiconductor layer, can overlie at least a portion of the first semiconductor layer. In one embodiment, a first electronic component can include a first active region that includes a first portion of the first and the second semiconductor layers. A second electronic component can include a second active region that can include a second portion of the first semiconductor layer. Different processes can be used to form the electronic device. In another embodiment, annealing a workpiece can be performed and the stress of at least one of the semiconductor layers can be changed. In a different embodiment, annealing the workpiece can be performed either before or after the formation of the second semiconductor layer.
摘要翻译：电子设备可以具有位于第一半导体层和基底层之间的绝缘层。与第一半导体层相比具有不同组成和应力的第二半导体层可以覆盖在第一半导体层的至少一部分上。在一个实施例中，第一电子部件可以包括第一有源区，其包括第一和第二半导体层的第一部分。第二电子部件可以包括可以包括第一半导体层的第二部分的第二有源区。可以使用不同的过程来形成电子设备。在另一个实施例中，可以执行退火工件，并且可以改变至少一个半导体层的应力。在不同的实施例中，退火工件可以在第二半导体层的形成之前或之后进行。

23. 发明申请

US20090163974A1 FEEDTHROUGH APPARATUS WITH NOBLE METAL-COATED LEADS 有权
标题翻译：具有金属涂层导线的特殊设备
公开(公告)号：US20090163974A1
公开(公告)日：2009-06-25
申请号：US12397774
申请日：2009-03-04
申请人： William J. Taylor , Lynn M. Seifried , William D. Wolf , Andrew J. Ries , John E. Kast
发明人： William J. Taylor , Lynn M. Seifried , William D. Wolf , Andrew J. Ries , John E. Kast
IPC分类号： A61N1/02
CPC分类号： A61N1/3754
摘要： Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.
摘要翻译：提供了一种电气装置的方法和装置，其采用包括密封电气装置的内部区域的气密密封件的馈通。电气装置包括设置在电气装置的内部区域内的电触点，以及包括由馈通环绕的环绕部分的电线端子以及与所述电接触件电连接的第一端。当电气设备构造时，电线端子的第一端涂覆有比电线端子更耐氧化的导电金属。电线端子的第一端使用诸如压接连接器或弹簧连接器的机械装置固定到电触头。

24. 发明授权

US6076017A Method of centerless ground finishing of feedthrough pins for an implantable medical device 失效
标题翻译：用于可植入医疗装置的馈通针的无心磨削整理方法
公开(公告)号：US6076017A
公开(公告)日：2000-06-13
申请号：US22321
申请日：1998-02-11
申请人： William J. Taylor , John D. Wright , Joseph F. Lessar , Gary F. LaBree
发明人： William J. Taylor , John D. Wright , Joseph F. Lessar , Gary F. LaBree
IPC分类号： A61N1/375 , H01M2/06 , H01M2/10 , H01M2/30 , H01M6/16
CPC分类号： H01M2/065 , A61N1/3752 , H01M6/16 , H01M2/1022 , H01M2/1066 , H01M2/30
摘要： A centerless grinding method of finishing feedthrough pins and corresponding devices for use in implantable medical devices and for components such as batteries in implantable medical devices is disclosed. The method provides certain advantages, including the elimination of longitudinal anomalies in drawn wire to thereby improve the hermeticity of implantable medical devices. In one of the preferred methods, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground using an abrasive wheel and suitable coolant to a layer past which those anomalies disappear.
摘要翻译：公开了一种用于可植入医疗装置和诸如可植入医疗装置中的电池的部件的整流穿通销和相应装置的无心磨削方法。该方法提供了一些优点，包括消除拉丝中的纵向异常，从而提高可植入医疗装置的气密性。在优选的方法之一中，具有已知异常深度的超大尺寸医用级线材的表面是使用砂轮和适当的冷却剂进行无心磨削，通过这些异常消失的层。

25. 发明授权

US5294241A Method for making glass to metal seals 失效
标题翻译：制造玻璃到金属密封件的方法
公开(公告)号：US5294241A
公开(公告)日：1994-03-15
申请号：US019946
申请日：1993-02-19
申请人： William J. Taylor , Joseph F. Lessar , Weiss J. Douglas , Charles N. Wilson
发明人： William J. Taylor , Joseph F. Lessar , Weiss J. Douglas , Charles N. Wilson
IPC分类号： C03C27/04
CPC分类号： C03C27/044 , Y10S228/903
摘要： A method for making a seal between a sealing glass and titanium by forming a nitride layer on the titanium and then sealing the glass to the nitrided titanium. The formation of the nitride layer can be accomplished by the steps of placing the titanium in a substantially oxygen-free atmosphere comprising a major amount of an inert gas and a minor amount of nitrogen and heating the titanium in that atmosphere to a temperature of at least 300.degree. C. The method allows for the formation of the nitride layer and the glass seal in a single operation. The method works well in the manufacture of feedthroughs with conventional processing equipment.
摘要翻译：一种通过在钛上形成氮化物层然后将玻璃密封到氮化钛上而在密封玻璃和钛之间进行密封的方法。可以通过以下步骤来实现氮化物层的形成：将钛置于包含大量惰性气体和少量氮气的基本上无氧的气氛中，并将该气氛中的钛加热到至少该方法允许在单次操作中形成氮化物层和玻璃密封件。该方法在具有常规加工设备的馈通制造中工作良好。

26. 发明授权

US09375180B2 Universal pressure transducer mounting device 有权
标题翻译：通用压力传感器安装装置
公开(公告)号：US09375180B2
公开(公告)日：2016-06-28
申请号：US13800204
申请日：2013-03-13
申请人： John Russell , William J. Taylor
发明人： John Russell , William J. Taylor
IPC分类号： G01L7/00 , A61B5/00 , G01L7/18 , A61B5/0215 , A61M5/00 , G01L19/14 , A61B5/03
CPC分类号： A61B5/6887 , A61B5/0215 , A61B5/036 , A61B2505/05 , A61M5/007 , G01L7/00 , G01L7/182 , G01L19/14
摘要： A pressure transducer mounting device may include a support member and a pressure transducer holder. In use, the support member may attach to a support surface, such as a housing of a power injection device, while the pressure transducer holder is moveably connected to the support member. The pressure transducer holder may expand open to receive one of a plurality of different sized pressure transducers and bias closed to hold a received one of the plurality of different sized pressure transducers. In addition, the pressure transducer holder may move relative to the support member to one of a plurality of different vertically elevated positions. The pressure transducer mounting device may accommodate different pressure transducers, providing a universal mounting device that can adapt to different medical provider preferences and different pressure transducer sourcing options.
摘要翻译：压力传感器安装装置可以包括支撑构件和压力换能器支架。在使用中，支撑构件可以附接到诸如动力注射装置的壳体的支撑表面，同时压力换能器支架可移动地连接到支撑构件。压力传感器保持器可以膨胀以接收多个不同尺寸的压力传感器中的一个，并且偏压闭合以保持所接收的多个不同尺寸的压力传感器中的一个。此外，压力传感器保持器可以相对于支撑构件移动到多个不同的垂直升高位置中的一个。压力传感器安装装置可以适应不同的压力传感器，提供通用安装装置，其可以适应不同的医疗提供者偏好和不同的压力传感器采购选项。

27. 发明授权

US08569633B2 Feedthrough for microelectromechanical system 有权
标题翻译：微机电系统馈通
公开(公告)号：US08569633B2
公开(公告)日：2013-10-29
申请号：US11949005
申请日：2007-11-30
申请人： Rogier Receveur , Michael A. Schugt , William J. Taylor , Brad C. Tischendorf
发明人： Rogier Receveur , Michael A. Schugt , William J. Taylor , Brad C. Tischendorf
IPC分类号： H05K7/00
CPC分类号： A61N1/05 , A61N1/3754
摘要： A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate.
摘要翻译：介绍了一种用于可植入医疗器械的气密密封微机电系统（MEMS）封装。 MEMS包括包括孔的第一衬底。馈通组件联接到孔，馈通组件包括容纳在玻璃绝缘体构件中的导电元件。第二衬底耦合到第一衬底。

28. 发明授权

US08285379B2 Electrical interconnection structures and method 有权
标题翻译：电互连结构及方法
公开(公告)号：US08285379B2
公开(公告)日：2012-10-09
申请号：US11343107
申请日：2006-01-30
申请人： Rajesh V. Iyer , William J. Taylor , Joseph F. Lessar , Mark D. Breyen , Daniel J. Koch
发明人： Rajesh V. Iyer , William J. Taylor , Joseph F. Lessar , Mark D. Breyen , Daniel J. Koch
IPC分类号： A61N1/00 , H01G4/35
CPC分类号： A61N1/3754
摘要： An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.
摘要翻译：用于可植入医疗装置的电互连结构包括具有从其延伸的销的馈通。销定义第一端和中间部分。在销的第一端形成接合表面，并且接合表面的表面积大于其中间部分的销的横截面面积。

29. 发明申请

US20110192645A1 Feedthrough Apparatus with Noble Metal-Coated Leads 审中-公开
标题翻译：具有贵金属涂层引线的馈通装置
公开(公告)号：US20110192645A1
公开(公告)日：2011-08-11
申请号：US13089393
申请日：2011-04-19
申请人： William J. Taylor , Gonzalo Martinez
发明人： William J. Taylor , Gonzalo Martinez
IPC分类号： H02G3/18 , B23K20/00 , B24B1/00 , H01R43/00
CPC分类号： A61N1/3754 , Y10T29/49117
摘要： The present invention relates to formation of a feedthrough associated with an implantable medical device. A conductive element is formed of at least one refractory metal. A portion of the conductive element is cladded with a noble metal. A portion of the noble metal clad is removed through an electrochemical process or through a grinding operation. Alternatively, noble metal is introduced to preselected areas of the conductive element, which avoids removal of a portion of the noble metal from the conductive element.
摘要翻译：本发明涉及与可植入医疗装置相关联的馈通的形成。导电元件由至少一种难熔金属形成。导电元件的一部分用贵金属包覆。通过电化学过程或通过研磨操作去除贵金属包层的一部分。或者，将贵金属引入到导电元件的预选区域中，这避免了从导电元件去除一部分贵金属。

30. 发明申请

US20100298628A1 STRESS URINARY INCONTINENCE TREATMENT 审中-公开
标题翻译：应激性尿失禁治疗
公开(公告)号：US20100298628A1
公开(公告)日：2010-11-25
申请号：US12647900
申请日：2009-12-28
申请人： William J. Taylor , Kipling Thacker
发明人： William J. Taylor , Kipling Thacker
IPC分类号： A61F2/02 , A61K31/728 , A61K38/44 , A61P13/00
CPC分类号： A61K31/728 , A61L27/20 , A61L27/24 , A61L27/52 , A61L2400/06 , C08L5/08
摘要： A method for stabilizing a urethra in a female patient having stress urinary incontinence caused by stretching of a pubourethral ligament includes filling a substantial portion of the pubourethral space. The method includes injecting precursor materials for a cross-linked hyaluronic acid (HA) into a pubourethral space the PUL and allowing the precursor materials to form a cross-linked hyaluronic acid such that the cross-linked hyaluronic acid fills a substantial portion of the pubourethral space.
摘要翻译：一种用于稳定尿道的方法，所述尿道具有通过拉伸尿道韧带引起的压力性尿失禁的女性患者，包括填充大部分的尿道尿道空间。该方法包括将用于交联的透明质酸（HA）的前体材料注射到PULA尿道空间中，并允许前体材料形成交联的透明质酸，使得交联的透明质酸填充大部分的尿道尿道空间。

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