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    • 21. 发明授权
    • Electronic device cooling with autonomous fluid routing and method of assembly
    • 具有自主流体路线的电子设备冷却和组装方法
    • US09035452B2
    • 2015-05-19
    • US13568667
    • 2012-08-07
    • Stanton Earl WeaverHendrik Pieter Jacobus De Bock
    • Stanton Earl WeaverHendrik Pieter Jacobus De Bock
    • H01L23/473H01L23/38B23P15/26
    • B23P15/26F28F2260/02H01L23/473H01L2924/0002Y10T29/4935H01L2924/00
    • An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.
    • 提供集成电路装置。 集成电路器件包括具有第一表面和与第一表面相对的第二表面的管芯。 模具具有至少一个位于其第一表面上的电路元件。 在模具的第二表面中限定至少一个微通道。 集成电路装置包括附接到模具的第二表面的冷却基板。 在冷却衬底中限定至少一个流体路线通道。 所述至少一个流体路由通道连接到在所述管芯中限定的所述至少一个微通道。 另外,冷却基板具有位于至少一个流体路由通道内的至少一个阀。 所述至少一个阀被配置为自主地调节流过所述至少一个流体路由通道的冷却流体的流量。