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21. 发明授权

US07745374B2 Thermal transfer receiving sheet, production method thereof and image forming method using the sheet 有权
标题翻译：热转印接收片材，其制造方法和使用该片材的成像方法
公开(公告)号：US07745374B2
公开(公告)日：2010-06-29
申请号：US10566202
申请日：2004-08-04
申请人： Yoshimasa Tanaka , Masato Kawamura , Chikara Tsukada , Kyoko Uchida , Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Hideaki Shinohara
发明人： Yoshimasa Tanaka , Masato Kawamura , Chikara Tsukada , Kyoko Uchida , Toshikazu Onishi , Toru Nakai , Kazuyuki Tachibana , Hideaki Shinohara
IPC分类号： B41M5/035 , B41M5/50
CPC分类号： B41M5/42 , B41M5/44 , B41M2205/32 , B41M2205/36 , B41M2205/38
摘要： A thermal transfer receiving sheet comprising a sheet-like support having sequentially formed on at least one surface thereof a hollow particle-containing intermediate layer and an image receiving layer, wherein the hollow particles have an average particle diameter of 0.2 to 35 μm and a hollow percentage by volume of 30 to 97% and the printing smoothness (Rp value) on the surface of the thermal transfer receiving sheet, as measured by using a Microtopograph under an applied pressure of 0.1 MPa 10 m-seconds after the initiation of pressure application, is 1.5 μm or less. A production method of the thermal transfer receiving sheet is also provided.
摘要翻译：一种热转印接收片材，其包含片状载体，所述片状载体在其至少一个表面上依次形成有中空颗粒的中间层和图像接收层，其中所述中空颗粒的平均粒径为0.2〜35μm，在热压接受片的表面上的印刷平滑度（Rp值）在压力施加开始后的0.1MPa的施加压力下使用微图形仪测量，为1.5μm以下。还提供了热转印接收片材的制造方法。

22. 发明授权

US07655347B2 Battery and method of assembling battery 失效
标题翻译：电池和组装电池的方法
公开(公告)号：US07655347B2
公开(公告)日：2010-02-02
申请号：US11655995
申请日：2007-01-22
申请人： Yukimasa Nishide , Toru Nakai , Hiroshi Ueshima
发明人： Yukimasa Nishide , Toru Nakai , Hiroshi Ueshima
IPC分类号： H01M2/12
CPC分类号： H01M2/08 , H01M2/021 , H01M2/1241 , Y10T29/49108
摘要： A battery includes a casing made of metal; and a safety valve made of a thin plate. The casing includes a vent hole that provides communication between the inside of the battery and the outside of the battery. A seal member made of synthetic resin is provided between the peripheral edge portion around the vent hole and the peripheral edge portion of the safety valve. The seal member connects the peripheral edge portion around the vent hole to the peripheral edge portion of the safety valve such that the peripheral edge portion around the vent hole does not contact the peripheral edge portion of the safety valve.
摘要翻译：电池包括由金属制成的外壳; 以及由薄板制成的安全阀。壳体包括提供电池内部和电池外部之间的连通的通气孔。在通气孔周围的周缘部与安全阀的周缘部之间设置有合成树脂制的密封部件。密封构件将周围边缘部分围绕通气孔连接到安全阀的周缘部分，使得围绕通气孔的周缘部分不接触安全阀的周缘部分。

23. 发明申请

US20090107847A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20090107847A1
公开(公告)日：2009-04-30
申请号：US12342866
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.
摘要翻译：电镀方法包括在镀浴中提供物品，在电镀槽中用绝缘构件覆盖制品的表面，以及在使绝缘构件和制品相对于彼此移动中的同时对制品进行电解电镀。

24. 发明申请

US20090107711A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20090107711A1
公开(公告)日：2009-04-30
申请号：US12342772
申请日：2008-12-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K1/11 , H05K1/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer and the second conductor layer. The filled vias have upper surfaces, respectively, and each of the upper surfaces is made such that a difference between a lowest point and a highest point of each of the upper surfaces is less than or equal to about 7 μm.
摘要翻译：多层印刷电路板具有绝缘层，设置在绝缘层的第一侧上的第一导体层，设置在与第一侧相反的绝缘层的第二侧上的第二导体层，以及多个填充的通孔，第一导体层和第二导体层。填充的通孔分别具有上表面，并且每个上表面被制成使得每个上表面的最低点和最高点之间的差小于或等于约7μm。

25. 发明授权

US07481909B2 Plating apparatus, plating method and multilayer printed circuit board 有权
标题翻译：电镀装置，电镀方法和多层印刷电路板
公开(公告)号：US07481909B2
公开(公告)日：2009-01-27
申请号：US11232906
申请日：2005-09-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D17/02 , B05C3/02 , C25D7/12
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.
摘要翻译：电镀装置包括镀浴，设置在电镀槽中的部件和移动装置。该构件构造成覆盖待镀表面。移动装置构造成使构件或表面相对移动以改变由构件覆盖的表面的区域。

26. 发明申请

US20090012054A1 Cephem Compounds and Use as Antimicrobial Agents 审中-公开
标题翻译：头孢烯化合物和用作抗微生物剂
公开(公告)号：US20090012054A1
公开(公告)日：2009-01-08
申请号：US12280419
申请日：2007-03-16
申请人： Toshio Yamanaka , Ayako Toda , Hidenori Ohki , Shinya Okuda , Kohji Kawabata , Kenji Murano , Kazuo Hatano , Shinobu Takeda , Toru Nakai , Masaru Oogaki , Satoshi Inoue , Keiji Misumi , Kenji Itoh
发明人： Toshio Yamanaka , Ayako Toda , Hidenori Ohki , Shinya Okuda , Kohji Kawabata , Kenji Murano , Kazuo Hatano , Shinobu Takeda , Toru Nakai , Masaru Oogaki , Satoshi Inoue , Keiji Misumi , Kenji Itoh
IPC分类号： A61K31/546 , C07D501/16 , A61P31/00
CPC分类号： C07D501/46
摘要： The present invention provides a compound of the formula [I]: wherein R1 is lower alkyl, etc. and R2 is hydrogen, etc., or R1 and R2 are bonded together to form lower alkylene; R3 is a group represented by wherein R6 and R7 are independently optionally protected amino, etc.; m and n are independently an integer of 0 to 6; R8 and R9 are independently optionally protected amino, etc., and q and r are independently an integer of 0 to 6, or R8 and R9, together with the adjacent alkylene(s) and the nitrogen atom, form saturated nitrogen-containing heterocycle optionally having substituent(s); R4 is lower alkyl, etc.; and R5 is amino, etc., or a pharmaceutically acceptable salt thereof.
摘要翻译：本发明提供式[I]化合物：其中R1是低级烷基等，R2是氢等，或者R1和R2键合在一起形成低级亚烷基; R3是由R6和R7独立地是任意保护的氨基等表示的基团。 m和n分别为0〜6的整数。 R8和R9独立地是任选被保护的氨基等，q和r独立地是0-6的整数，或者R8和R9与相邻的亚烷基和氮原子一起形成饱和的含氮杂环，具有取代基; R4是低级烷基等; R5为氨基等，或其药学上可接受的盐。

27. 发明申请

US20060065534A1 Plating apparatus, plating method and multilayer printed circuit board 有权
公开(公告)号：US20060065534A1
公开(公告)日：2006-03-30
申请号：US11232906
申请日：2005-09-23
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： C25D5/02 , C25D17/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A plating apparatus includes a plating bath, a member provided in the plating bath and a moving device. The member is configured to cover a surface to be plated. A moving device is configured to relatively move the member or the surface to change an area of the surface covered by the member.

28. 发明授权

US08878078B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US08878078B2
公开(公告)日：2014-11-04
申请号：US13213240
申请日：2011-08-19
申请人： Toru Nakai
发明人： Toru Nakai
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , C23C18/54 , H01L21/486 , H01L23/498 , H01L23/49816 , H01L23/49822 , H01L23/538 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/16237 , H01L2224/45144 , H01L2224/81026 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01061 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H05K1/112 , H05K3/244 , H05K3/28 , H05K3/3463 , H05K3/383 , H05K3/4602 , H05K3/4644 , Y10T29/49147 , H01L2924/00 , H01L2224/05599
摘要： A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.
摘要翻译：提供了包括频率特性优异的焊盘的印刷线路板。为此，通过在导体电路158或通孔160上设置单个锡层74来形成每个焊盘73.因此，与现有技术的印刷电路板相比，可以增加信号传播速率形成两个金属层。此外，由于缺乏镍层，可以降低制造成本，并且可以提高电特性。

29. 发明申请

US20140141296A1 SEALED-TYPE CELL 有权
标题翻译：密封型细胞
公开(公告)号：US20140141296A1
公开(公告)日：2014-05-22
申请号：US14115776
申请日：2011-07-27
申请人： Toru Nakai
发明人： Toru Nakai
IPC分类号： H01M2/34
CPC分类号： H01M2/345 , H01M2/1229 , H01M2/305 , H01M10/0525 , H01M2200/20 , H01M2220/20 , Y02E60/122
摘要： A cell has: a pole terminal placed on outside of a cell case; a deformed terminal fixing the pole terminal to the case by a base surface portion and a protruding portion; an inversion plate attached to the base surface portion and interrupting conduction between the internal terminal and the deformed terminal by inversion deforming away from the internal terminal at least at a portion when the internal pressure of the case increases beyond working pressure; and a shaft member having at least a part of the top portion placed in the protruding portion, and reestablishing conduction between the internal terminal and the deformed terminal after the inversion plate inverted by the top portion being pressed from the outside and thereby being moved inside the protruding section to press the inversion plate inward. A sealed space is provided between the deformed terminal and the inversion plate.
摘要翻译：电池具有：极端子放置在电池壳体的外部; 变形端子，通过基面部分和突出部分将极端子固定到壳体; 安装在所述基面部上的反转板，并且当所述壳体的内压增加超过工作压力时，至少在所述壳体的内部压力的一部分处，通过反转而从所述内部端子变形而中断所述内部端子与所述变形端子之间的导通; 以及轴构件，其具有顶部的至少一部分放置在突出部分中，并且在由顶部反转的反转板从外部按压之后重新建立内部端子与变形端子之间的导通，从而在内部端子和变形端子之间移动突出部分将反转板向内压。在变形端子和反转板之间设有密封空间。

30. 发明授权

US08419924B2 Wiring substrate and method for manufacturing wiring substrate 有权
标题翻译：布线基板及其制造方法
公开(公告)号：US08419924B2
公开(公告)日：2013-04-16
申请号：US12827343
申请日：2010-06-30
申请人： Toru Nakai , Liyi Chen
发明人： Toru Nakai , Liyi Chen
IPC分类号： C25F3/14 , C25D11/02
CPC分类号： C25D1/04 , C25D5/022 , C25D11/02 , C25D11/026 , H05K1/0306 , H05K3/06 , H05K3/244 , H05K3/3484 , H05K3/4038 , H05K3/4605 , H05K2201/0116 , H05K2201/0209 , H05K2203/0315 , H05K2203/043 , H05K2203/1142 , H05K2203/1147
摘要： [Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum.[Solution(s)] Aluminum oxide insulative portion 24 is formed on aluminum plate 20 as shown in FIG. 1(A) through anodic oxidation (FIG. 1(C)). Then, holes (nano-holes) (24h) in aluminum oxide 24 are filled with resin 30 (FIG. 1(E)). Accordingly, the rigidity (strength) of insulative portion 24 will be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes 26 (aluminum portions) separated by aluminum oxide 24.
摘要翻译： [主题]提供一种制造在通过氧化铝制成的绝缘部分中提高刚性的布线基板的方法。 [解决方案]如图1所示，在铝板20上形成氧化铝绝缘部24。 1（A）通过阳极氧化（图1（C））。然后，在树脂30中填充氧化铝24中的孔（纳米孔）（24小时）（图1（E））。因此，绝缘部24的刚性（强度）提高，并且在热循环期间不会发生开裂。此外，氧化铝的绝缘可靠性将增加，并且可以防止由氧化铝24分离的通孔26（铝部分）的短路。

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