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    • 21. 发明申请
    • Semiconductor light-emitting device
    • 半导体发光装置
    • US20090206354A1
    • 2009-08-20
    • US12230234
    • 2008-08-26
    • Nobuaki KitanoMasahiro AraiKazuyuki Iizuka
    • Nobuaki KitanoMasahiro AraiKazuyuki Iizuka
    • H01L33/00
    • H01L33/405H01L33/0079H01L33/387H01L2924/0002H01L2924/00
    • A semiconductor light-emitting device includes a support structure, and a light-emitting structure. The support structure includes a support substrate, and a support substrate side bonding layer disposed on one surface of the support substrate. The light-emitting structure includes a light-emitting structure side bonding layer bonded to the support substrate side bonding layer, a reflection region disposed on the support substrate side bonding layer opposite the support substrate, and a semiconductor multilayer structure including a light-emitting layer disposed on the reflection region opposite the light-emitting structure side bonding layer for emitting a light with a predetermined wavelength, and a light-extraction surface disposed on the light-emitting layer opposite the reflection region for reflecting diffusely the light. The reflection region includes a transparent layer of a material with a lower refractive index than that of the semiconductor multilayer structure, and a reflection layer of a metallic material. The transparent layer has such a thickness that interference caused by multiple reflection of light inputted to the transparent layer can be suppressed.
    • 半导体发光器件包括支撑结构和发光结构。 支撑结构包括支撑基板和设置在支撑基板的一个表面上的支撑基板侧接合层。 发光结构包括结合到支撑基板侧接合层的发光结构侧接合层,设置在与支撑基板相对的支撑基板侧接合层上的反射区域,以及包括发光层 设置在与发光结构侧接合层相对的反射区域,用于发射具有预定波长的光;以及光提取表面,设置在与反射区域相对的发光层上,用于漫反射地反射光。 反射区域包括具有比半导体多层结构的折射率低的材料的透明层和金属材料的反射层。 透明层具有能够抑制由输入到透明层的光的多次反射引起的干涉的厚度。
    • 22. 发明申请
    • Semiconductor light emitting element
    • 半导体发光元件
    • US20100301362A1
    • 2010-12-02
    • US12662645
    • 2010-04-27
    • Kazuyuki IizukaMasahiro Watanabe
    • Kazuyuki IizukaMasahiro Watanabe
    • H01L33/46
    • H01L33/387H01L33/0079H01L33/22H01L33/405H01L33/42
    • A semiconductor light emitting element includes a group III-V compound semiconductor layer, a first main surface and a second main surface, a reflection metal film formed on the second main surface, a front surface electrode formed on the first main surface, and an ohmic contact joint part formed between the reflection metal film and the group III-V compound semiconductor layer except a region directly under the front surface electrode. The ohmic contact joint part is disposed in a side of an outer peripheral part of the semiconductor light emitting element, formed so as to surround the front surface electrode when the ohmic contact joint part is viewed from a side of the front surface electrode, and disposed so that distance from each location of outer edge parts of the front surface electrode to the ohmic contact joint part nearest to the each location becomes equal to each other.
    • 半导体发光元件包括III-V族化合物半导体层,第一主表面和第二主表面,形成在第二主表面上的反射金属膜,形成在第一主表面上的前表面电极和欧姆 接触部分形成在反射金属膜和III-V族化合物半导体层之外,除了正面电极正下方的区域。 欧姆接触部分设置在半导体发光元件的外周部分的一侧,当从前表面电极的一侧观察欧姆接触部分时,形成为围绕前表面电极,并且设置 使得从前表面电极的外边缘部分的每个位置到最接近每个位置的欧姆接触部分的距离彼此相等。
    • 27. 发明授权
    • Method for producing nitride semiconductor crystal, and nitride semiconductor wafer and nitride semiconductor device
    • 氮化物半导体晶体的制造方法以及氮化物半导体晶片和氮化物半导体装置
    • US07294200B2
    • 2007-11-13
    • US10396831
    • 2003-03-26
    • Hajime FujikuraKazuyuki Iizuka
    • Hajime FujikuraKazuyuki Iizuka
    • C30B23/00H01L21/00H01L29/221
    • C30B25/02C30B25/18C30B29/403C30B29/406
    • A method for producing a nitride semiconductor crystal comprising steps (a), (b) and (c), which steps follow in sequence as follows: a step (a) for forming fine crystal particles made of a nitride semiconductor on a substrate; a step (b) for forming a nitride semiconductor island structure having a plurality of facets inclined relative to a surface of the substrate using the fine crystal particles as nuclei; and a step (c) for causing the nitride semiconductor island structure to grow in a direction parallel with a surface of the substrate to merge a plurality of the nitride semiconductor island structures with each other, thereby forming a nitride semiconductor crystal layer having a flat surface; the steps (a)-(c) being continuously conducted in the same growing apparatus.
    • 一种制造氮化物半导体晶体的方法,其包括步骤(a),(b)和(c),其顺序如下:步骤(a)用于在衬底上形成由氮化物半导体制成的微细晶粒; 用于形成氮化物半导体岛结构的步骤(b),所述氮化物半导体岛结构具有使用所述细晶粒子作为核的相对于所述衬底的表面倾斜的多个面; 以及用于使氮化物半导体岛结构在与衬底的表面平行的方向上生长以使多个氮化物半导体岛结构彼此合并从而形成具有平坦表面的氮化物半导体晶体层的步骤(c) ; 步骤(a) - (c)在相同的生长装置中连续进行。
    • 28. 发明授权
    • Semiconductor light emitting element
    • 半导体发光元件
    • US08120051B2
    • 2012-02-21
    • US12662645
    • 2010-04-27
    • Kazuyuki IizukaMasahiro Watanabe
    • Kazuyuki IizukaMasahiro Watanabe
    • H01L29/22
    • H01L33/387H01L33/0079H01L33/22H01L33/405H01L33/42
    • A semiconductor light emitting element includes a group III-V compound semiconductor layer, a first main surface and a second main surface, a reflection metal film formed on the second main surface, a front surface electrode formed on the first main surface, and an ohmic contact joint part formed between the reflection metal film and the group III-V compound semiconductor layer except a region directly under the front surface electrode. The ohmic contact joint part is disposed in a side of an outer peripheral part of the semiconductor light emitting element, formed so as to surround the front surface electrode when the ohmic contact joint part is viewed from a side of the front surface electrode, and disposed so that distance from each location of outer edge parts of the front surface electrode to the ohmic contact joint part nearest to the each location becomes equal to each other.
    • 半导体发光元件包括III-V族化合物半导体层,第一主表面和第二主表面,形成在第二主表面上的反射金属膜,形成在第一主表面上的前表面电极和欧姆 接触部分形成在反射金属膜和III-V族化合物半导体层之外,除了正面电极正下方的区域。 欧姆接触部分设置在半导体发光元件的外周部分的一侧,当从前表面电极的一侧观察欧姆接触部分时,形成为围绕前表面电极,并且设置 使得从前表面电极的外边缘部分的每个位置到最接近每个位置的欧姆接触部分的距离彼此相等。