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21. 发明授权

US08496159B2 Injection molded solder process for forming solder bumps on substrates 失效
标题翻译：用于在基板上形成焊料凸块的注塑焊接工艺
公开(公告)号：US08496159B2
公开(公告)日：2013-07-30
申请号：US13154412
申请日：2011-06-06
申请人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
发明人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
IPC分类号： B23K3/00 , B23K3/06
CPC分类号： B23K1/0016 , B23K1/20 , B23K3/0623 , B23K2101/42 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68372 , H01L2224/03464 , H01L2224/0401 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11002 , H01L2224/11312 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11902 , H01L2224/13023 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14505 , H01L2224/16237 , H01L2224/94 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.
摘要翻译：通过使用注射成型的焊料在基板上设置均匀高度的焊料凸块。在图案化的光致抗蚀剂层的通道内的I / O焊盘上形成铜柱或极限极限冶金。焊料注入柱子或BLM，填充通道。允许不含焊剂的焊料固化。它形成相同高度的多个焊料结构（凸块）。焊接注入和固化优选在氮气环境或形成气体环境中进行。可以使用容纳这种晶片和填充头的载体组件将熔融焊料注入到以圆形晶片形成的通道中而不会溢出。

22. 发明授权

US08408448B1 Forming constant diameter spherical metal balls 失效
标题翻译：形成恒定直径球形金属球
公开(公告)号：US08408448B1
公开(公告)日：2013-04-02
申请号：US13371431
申请日：2012-02-11
申请人： Claudius Feger , Peter Alfred Gruber , Mark Harrison McLeod , Jae-Woong Nah
发明人： Claudius Feger , Peter Alfred Gruber , Mark Harrison McLeod , Jae-Woong Nah
IPC分类号： B23K31/02
CPC分类号： B23K3/0623 , B23K3/08 , B23K35/0244
摘要： A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.
摘要翻译：描述了用于形成球形金属球的工艺和工具，其包括模具，注射成型焊料，液体或气体环境以减少或去除金属氧化物和金属在加热的液体或气体中的无约束回流以及熔融金属在较冷液体中的固化或气体。

23. 发明申请

US20120305631A1 INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES 有权
标题翻译：注射成型焊接工艺，用于在基材上形成焊膏
公开(公告)号：US20120305631A1
公开(公告)日：2012-12-06
申请号：US13525855
申请日：2012-06-18
申请人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
发明人： Claudius Feger , Mark H. McLeod , Jae-Woong Nah , Eric D. Perfecto
IPC分类号： B23K31/02 , B23K1/20
CPC分类号： B23K1/0016 , B23K1/20 , B23K3/0623 , B23K2101/42 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68372 , H01L2224/03464 , H01L2224/0401 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11002 , H01L2224/11312 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11902 , H01L2224/13023 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14505 , H01L2224/16237 , H01L2224/94 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.
摘要翻译：通过使用注射成型的焊料在基板上设置均匀高度的焊料凸块。在图案化的光致抗蚀剂层的通道内的I / O焊盘上形成铜柱或极限极限冶金。焊料注入柱子或BLM，填充通道。允许不含焊剂的焊料固化。它形成相同高度的多个焊料结构（凸块）。焊接注入和固化优选在氮气环境或形成气体环境中进行。可以使用容纳这种晶片和填充头的载体组件将熔融焊料注入到以圆形晶片形成的通道中而不会溢出。

24. 发明授权

US07776993B2 Underfilling with acid-cleavable acetal and ketal epoxy oligomers 有权
标题翻译：用酸可分解的缩醛和缩酮环氧低聚物填充
公开(公告)号：US07776993B2
公开(公告)日：2010-08-17
申请号：US11154794
申请日：2005-06-15
申请人： Stephen Leslie Buchwalter , Claudius Feger , Gareth Hougham , Nancy LaBianca , Hosadurga Shobha
发明人： Stephen Leslie Buchwalter , Claudius Feger , Gareth Hougham , Nancy LaBianca , Hosadurga Shobha
IPC分类号： C07D303/32 , C08G2/30 , C08K3/36 , C08L59/00 , C08L61/02 , C08L63/00 , H01L21/56
CPC分类号： C08G65/2654 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/16225 , H01L2224/274 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/94 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , Y10T428/12528 , Y10T428/31511 , H01L2924/00 , H01L2224/27 , H01L2224/11 , H01L2224/0401
摘要： A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.
摘要翻译：可重复使用的热固性环氧树脂材料，其允许可重复组装，例如可再加工的晶片级底部填充的微电子封装。使用该材料在形成微电子封装中使用可再加工热固性材料的方法。

25. 发明申请

US20090181476A1 Assembly Method For Reworkable Chip Stacking With Conductive Film 审中-公开
标题翻译：带导电膜的可重复芯片堆叠的装配方法
公开(公告)号：US20090181476A1
公开(公告)日：2009-07-16
申请号：US11972129
申请日：2008-01-10
申请人： Stephen L. Buchwalter , Bing Dang , Claudius Feger , Peter A. Gruber , John Knickerbocker
发明人： Stephen L. Buchwalter , Bing Dang , Claudius Feger , Peter A. Gruber , John Knickerbocker
IPC分类号： H01L21/02
CPC分类号： H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06596 , H01L2924/0002 , H01L2924/00
摘要： A method of stacking a chip, including an integrated circuit, onto a substrate including applying an anisotropic conductive film (ACF) or a solder-filled conductive film onto a surface thereof, the surface being configured to electrically couple to the film, placing the chip onto the film, the chip being configured to electrically couple to the film, compressively pressurizing the chip, the film and the surface such that the chip is electrically coupled to the surface via the film,, testing the chip to determine whether the chip is operating normally, reworking the placement of the chip onto the film and repeating the compressive pressurization if the chip is determined to not be operating normally, repeating the testing to determine whether the chip is operating normally, and once the chip is determined to be operating normally, bonding the chip, the film and the surface.
摘要翻译：一种将包括集成电路的芯片堆叠在基板上的方法，包括将各向异性导电膜（ACF）或焊料填充导电膜施加到其表面上，该表面被配置为电耦合到膜，将芯片芯片被配置为电耦合到膜，对芯片，膜和表面进行压缩加压，使得芯片经由膜电耦合到表面，测试芯片以确定芯片是否正在操作通常，如果芯片被确定为不正常工作，重复测试以确定芯片是否正常工作，并且一旦芯片确定正常工作，则将芯片放置在膜上并重复压缩加压，粘合芯片，薄膜和表面。

26. 发明申请

US20090032962A1 CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WITH POWDERED MATERIALS FOR CIRCUIT FORMATION 有权
标题翻译：用于电路形成的粉末状材料填充高倍率微孔玻璃的离心方法
公开(公告)号：US20090032962A1
公开(公告)日：2009-02-05
申请号：US12247894
申请日：2008-10-08
申请人： Gareth Hougham , Leena P. Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
发明人： Gareth Hougham , Leena P. Buchwalter , Stephen L. Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey D. Gelorme , Kathleen C. Hinge , Anurag Jain , Sung K. Kang , John U. Knickerbocker
IPC分类号： H01L23/52 , H01L21/44 , B04B11/00
CPC分类号： H05K3/4053 , B05D1/002 , H01L21/486 , H01L21/76898 , H05K2201/09509 , H05K2203/1554
摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
摘要翻译：本公开一般涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，糊料，材料悬浮液，用作导电，结构支撑或电子部件的保护构件。

27. 发明申请

US20070025669A1 Apparatus and methods for remakeable connections to optical waveguides 失效
标题翻译：用于与光波导重新连接的装置和方法
公开(公告)号：US20070025669A1
公开(公告)日：2007-02-01
申请号：US11540268
申请日：2006-09-30
申请人： Claudius Feger , Philip Hobbs , Maurice McGlashan-Powell
发明人： Claudius Feger , Philip Hobbs , Maurice McGlashan-Powell
IPC分类号： G02B6/44 , G02B6/34
CPC分类号： G02B6/2821 , G02B6/02 , G02B6/02033 , G02B6/03622 , G02B6/283 , G02B6/29316 , G02B6/421 , G02B6/4249
摘要： A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要翻译：描述了具有由包含内软层和外硬层的覆层围绕的芯的单模光波导。外层在其内表面具有光栅结构，其空间频率与导向模式相同。内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，使得通常不会导致光的外耦合。通过将两个这样的波导以一定角度交叉并将它们压在一起而形成连接。这导致两个波导的变形，使得光栅与芯接近。光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。

28. 发明授权

US07116865B2 Apparatus and methods for remakeable connections to optical waveguides 失效
标题翻译：用于与光波导重新连接的装置和方法
公开(公告)号：US07116865B2
公开(公告)日：2006-10-03
申请号：US10315766
申请日：2002-12-10
申请人： Claudius Feger , Philip O. D. Hobbs , Maurice McGlashan-Powell
发明人： Claudius Feger , Philip O. D. Hobbs , Maurice McGlashan-Powell
IPC分类号： G02B6/16
CPC分类号： G02B6/2821 , G02B6/02 , G02B6/02033 , G02B6/03622 , G02B6/283 , G02B6/29316 , G02B6/421 , G02B6/4249
摘要： A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要翻译：描述了具有由包含内软层和外硬层的覆层围绕的芯的单模光波导。外层在其内表面具有光栅结构，其空间频率与导向模式相同。内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，使得通常不会导致光的外耦合。通过将两个这样的波导以一定角度交叉并将它们压在一起而形成连接。这导致两个波导的变形，使得光栅与芯接近。光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。

29. 发明授权

US06929900B2 Tamper-responding encapsulated enclosure having flexible protective mesh structure 失效
标题翻译：具有灵活保护网格结构的防篡改封装外壳
公开(公告)号：US06929900B2
公开(公告)日：2005-08-16
申请号：US10704021
申请日：2003-11-07
申请人： Donald S. Farquhar , Claudius Feger , Voya Markovich , Konstantinos I. Papathomas , Mark D. Poliks , Jane M. Shaw , George Szeparowycz , Steve H. Weingart
发明人： Donald S. Farquhar , Claudius Feger , Voya Markovich , Konstantinos I. Papathomas , Mark D. Poliks , Jane M. Shaw , George Szeparowycz , Steve H. Weingart
IPC分类号： G06F12/14 , G06F1/00 , G06F21/00 , G06F21/06 , G06F21/22 , H01L23/58 , H05K1/00 , H05K1/02 , H05K1/09 , H05K1/16 , G03F7/00
CPC分类号： H01L23/57 , G06F21/87 , H01L2924/0002 , H05K1/0275 , H05K1/0393 , H05K1/095 , H05K1/167 , H05K2201/0352 , H05K2201/10151 , H05K2203/1572 , H01L2924/00
摘要： A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
摘要翻译：用于形成包括集成电路结构的篡改应答电子电路外壳的结构和方法，围绕集成电路结构的网格结构以及围绕网格结构的密封外壳。网格结构包括具有第一侧和第二侧的柔性电介质层，在第一侧上形成第一电阻器网络的柔性导电第一电路线的丝网印刷图案，以及柔性电光刻形成的图案导电的第二电路线在第二侧上形成第二电阻网络。

30. 发明授权

US06217185B1 Efficient backlighting for a portable display 失效
标题翻译：便携式显示器的高效背光
公开(公告)号：US06217185B1
公开(公告)日：2001-04-17
申请号：US09265137
申请日：1999-03-08
申请人： Claudius Feger , Robert Lee Sandstrom
发明人： Claudius Feger , Robert Lee Sandstrom
IPC分类号： F21V704
CPC分类号： G02B6/0021 , G02B6/0036 , G02B6/0046
摘要： Efficiency in light transfer between a light source and a viewing screen is attained in the invention by positioning a small diameter source of light at a position of highest light transfer intensity within an essentially semicircular reflector interfacing at the wide portion of a wedge shaped light pipe light transfer member and minimizing reflection losses at every optical interface in the light path between the light source and the viewer. A wedge shaped light pipe light transfer member of the invention has attached a light source with unit diameter light bulb positioned off center of a four unit diameter semicircular solid reflector of a transparent material that is closely index of refraction matched with index of refraction of a wedge shaped light pipe light transfer member on the upper face of which is positioned the addressable viewing screen and, the portion of the wedge shape light pipe light transfer member being terminated in a reflection preventing face that is at about 45 degrees from the centerline of the wedge shaped member.
摘要翻译：在本发明中，通过将小直径光源定位在光学传输强度最高的位置，在楔形光管的宽部分内的基本上半圆形的反射器内部接合，实现了光源和观察屏幕之间的光传输效率并且在光源和观察者之间的光路中的每个光学界面处的反射损失最小化。本发明的楔形光管光传输部件安装了一个光源，其中单位直径的灯泡位于透明材料的四个单位直径的半圆形固体反射器的中心的外侧，该透明材料的折射率与楔形的折射率匹配形状的光管光传输构件，其上表面位于可寻址的观察屏幕上，并且楔形光管光传输构件的部分终止于与楔形件的中心线成约45度的防反射面形状的成员。

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