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21. 发明专利

JPH11271351A Piezoelectric detecting element 失效
标题翻译：压电检测元件
公开(公告)号：JPH11271351A
公开(公告)日：1999-10-08
申请号：JP7027398
申请日：1998-03-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UMEMURA TOSHIO , YAMADA AKIRA , MAEDA CHISAKO , SATO TAKEHIKO , UCHIKAWA HIDEFUSA
IPC分类号： G01L1/16 , G01P15/09 , G01R33/038
摘要： PROBLEM TO BE SOLVED: To enable the highly sensitive measurement of physical quantity, by fixing a metal film so as to cover an opening part provided at the center part of a substrate, providing an acting body and a piezoelectric film for the metal film, and directly deforming the metal film. SOLUTION: A metal film 2 is formed so as to cover an opening part 100 provided at the center part of a substrate 1, and a cylindrical acting body 6 to deform the metal film 2 in response to acceleration impressed on a piezoelectric film (piezoelectric element) 3 is provided on the lower surface of the metal film 2. As the metal film 2 is deformed by an extremely small force in response to an impressed force in this constitution, there is no need for enlarging the acting body 6. and it is possible to form a compact and highly sensitive piezoelectric detecting element. In addition, the electrode 4 of the piezoelectric element and a pad electrode 7 for connection to a control circuit provided outside the opening part 100 are connected by the air bridge wiring of wiring metal 5, and nothing except the piezoelectric film 3 is formed at the movable part of the metal film 2. Therefore, nothing prevents the deformation of the metal film 2 at the time of impression of an external force, and it is possible to detect an external force effectively and accurately.
摘要翻译：要解决的问题为了实现物理量的高灵敏度测量，通过固定金属膜以覆盖设置在基板的中心部分的开口部分，为金属膜提供作用体和压电膜，以及直接使金属膜变形。解决方案：金属膜2形成为覆盖设置在基板1的中心部分的开口部分100，并且圆柱形作用体6响应于施加在压电膜（压电元件）上的加速度而使金属膜2变形）3设置在金属膜2的下表面上。由于在该构造中金属膜2响应于施加的力而以非常小的力而变形，因此不需要放大作用体6.它是可能形成紧凑且高灵敏度的压电检测元件。此外，压电元件的电极4和用于连接到设置在开口部分100外部的控制电路的焊盘电极7通过布线金属5的空气桥接线连接，除了压电膜3之外没有形成因此，没有什么可以防止在外力压缩时金属膜2的变形，能够有效且准确地检测外力。

22. 发明专利

JPH09130200A THIN FILM PIEZOELECTRIC ELEMENT AND ITS PRODUCTION 失效
公开(公告)号：JPH09130200A
公开(公告)日：1997-05-16
申请号：JP28062895
申请日：1995-10-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： WAKOU SHIYUUZOU , MISU KOICHIRO , NAGATSUKA TSUTOMU , KIMURA TOMONORI , KAMEYAMA SHUNPEI , MAEDA CHISAKO , YAMADA AKIRA , HONDA TOSHIHISA
IPC分类号： H01L41/08 , H01L41/187 , H01L41/22 , H03B5/30 , H03B5/32 , H03H3/02 , H03H9/02 , H03H9/05 , H03H9/13 , H03H9/145 , H03H9/17 , H03H9/25 , H03H9/54 , H03H9/56
摘要： PROBLEM TO BE SOLVED: To provide a thin film piezoelectric element which has good characteristics and is small-sized and has a low production cost by integrating a wide-band filter or a resonator having a wide oscillation frequency range with a semiconductor circuit. SOLUTION: A dielectric layer 4 is provided on a semiconductor substrate 1, and a foundation conductor layer 5 is provided on the dielectric layer 4, and a piezoelectric ceramic thin film 27 is provided on the foundation conductor layer, and a conductive electrode pattern 6 is provided on the piezoelectric ceramic thin film 27, and they are so constituted that kh

23. 发明专利

JPH08148968A THIN FILM PIEZOELECTRIC ELEMENT 失效
公开(公告)号：JPH08148968A
公开(公告)日：1996-06-07
申请号：JP28980494
申请日：1994-11-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： MISU KOICHIRO , WAKOU SHIYUUZOU , NAGATSUKA TSUTOMU , KIMURA TOMONORI , YAMADA AKIRA , MAEDA CHISAKO , HONDA TOSHIHISA
IPC分类号： H03B5/32 , H03F3/195 , H03H9/00 , H03H9/02 , H03H9/05 , H03H9/17 , H03H9/19
摘要： PURPOSE: To provide the filter of a wide band and a resonator whose oscillation frequency range is wide, to mitigate limitation conditions to film formation conditions at the time of a film formation process and to provide a thin film piezoelectric element provided with the piezoelectric thin film of better quality by using piezoelectric ceramic for a piezoelectric body material. CONSTITUTION: This element is provided with a semiconductor substrate 1, a dielectric thin film 9, a base electrode 10, a piezoelectric ceramic thin film 11 and an upper side electrode 12 and the lower side of the base electrode 10 is turned to a void 13. In this piezoelectric element, the dielectric thin film 9 is constituted on the semiconductor substrate 1 and the surface of the semiconductor substrate 1 is protected. Simultaneously, by constituting the base electrode 10 on the dielectric thin film 9 in an area wider than the piezoelectric ceramic thin film 11, between the piezoelectric ceramic thin film 11 and the semiconductor substrate 1 before constituting the void 13, a damage to the semiconductor substrate 1 by the piezoelectric ceramic thin film 11 is prevented by the two- layer structure of the dielectric thin film 9 and the base electrode 10. Thus, even under the strict film formation process, the piezoelectric ceramic thin film 11 of the good quality is prepared.

24. 发明专利

JPH05232966A 失效
公开(公告)号：JPH05232966A
公开(公告)日：1993-09-10
申请号：JP3759092
申请日：1992-02-25
申请人： MITSUBISHI ELECTRIC CORP
发明人： HONDA TOSHIHISA , MAEDA CHISAKO , WAKOU SHIYUUZOU , WATAI HISAO
IPC分类号： G10K11/02
摘要： PURPOSE:To obtain optimum acoustic impedance by adding high molecular resin or carbon to the same material as an ultrasonic oscillation element to form an acoustic impedance converter. CONSTITUTION:An ultrasonic probe is constituted of an acoustic impedance converter 1 to be a matching material, an ultrasonic oscillation element 2 stuck to one face of the converter 1, a packing material 4 stuck to the other face, and a case 4 storing respective materials 1 to 3. A subject to be tested is stuck to the other face of the element 2. The element 2 consists of a PZT group piezo-electric ceramics. A material obtained by adding polyvinyl butyral(PVB) resin grains or carbon grains to the same piezo-electric ceramics as the material of the element 2 is used for the material of the converter 1. The density and speed of the converter 1 can be adjusted by adjusting the quantity of addition of PVB resin grains or carbon grains.

25. 发明专利

JP2004319960A Method of manufacturing a multilayer ceramic package 审中-公开
公开(公告)号：JP2004319960A
公开(公告)日：2004-11-11
申请号：JP2003393902
申请日：2003-11-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMASHITA HIDE , YAMADA AKIRA , NOZAKI AYUMI , SAITO KIYOSHI , KAWAMATA SUSUMU , MAEDA CHISAKO
IPC分类号： B28B1/30 , B28B11/00 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic package which can reduce a decline of pattern accuracy caused by inner electrode pattern deformation due to a contraction in a outside direction in forming, form a inside circuit pattern with high accuracy, improve productivity, and operate as confirming the position accuracy in visual observation. SOLUTION: The method for manufacturing a multilayer package composed of processes forms a paste film to be an inner circuit pattern on a ceramic green sheet 6, then, laminates the ceramic green sheet 6, and confires the ceramic green sheet 6 and the paste film. Particularly, the method includes a forming process which forms the ceramic green sheet 6 where the same shaped hollow pattern to the pattern of the paste film is formed on the surface and a paste filling process which fills pastes 7, 9 into the hollow pattern. COPYRIGHT: (C)2005,JPO&NCIPI

26. 发明专利

JP2004158665A Substrate for package and its manufacturing method 审中-公开
公开(公告)号：JP2004158665A
公开(公告)日：2004-06-03
申请号：JP2002323547
申请日：2002-11-07
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： USAMI AKIRA , OHASHI HIDEMASA , NISHINO TAMOTSU , OWADA SATORU , MAEDA CHISAKO , YOSHIDA YUKIHISA
IPC分类号： H01L23/12 , H01L23/13
摘要： PROBLEM TO BE SOLVED: To provide a substrate for a package of high performance in which components formed of a metal conductor or a resistor of high dimensional precision are built. SOLUTION: The substrate for package is formed by laminating dielectrics and at least one out of the conductor or the resistor, and performing the firing thereof. Components including either of a substrate wherein the resistor or the conductor is previously deposited, metal strips and an MEMS device are built in the substrate for package, thereby enabling manufacture of a substrate for package with high dimensional precision. COPYRIGHT: (C)2004,JPO

27. 发明专利

JP2003347883A Piezoelectric thin-film element and manufacturing method thereof 审中-公开
标题翻译：压电薄膜元件及其制造方法
公开(公告)号：JP2003347883A
公开(公告)日：2003-12-05
申请号：JP2002152870
申请日：2002-05-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMADA AKIRA , MAEDA CHISAKO , NOZAKI AYUMI , MIYASHITA SHOJI , YAMASHITA HIDE
IPC分类号： H03H9/17 , H03H3/04 , H03H9/02 , H03H9/58
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric thin-film element which has superior dimensional accuracy of a frequency adjusting film, has less variations in production lots or fluctuation in a wafer substrate, and can execute frequency adjustment which is inexpensive and superior in mass productivity, and to provide a manufacturing method thereof.
SOLUTION: The piezoelectric thin-film element comprises a lower electrode film 4, a piezoelectric film 5, and a plurality of upper electrode films 6a, 6b and the like. A frequency adjusting film 11 made of a metal oxide, such as a silicon oxide or aluminum oxide or a composite resin, such as an acryl-based resin, is formed with a predetermined area and film thickness on one film 6b. In a second piezoelectric resonance section to which the film 11 is added, a resonance frequency shifts to a slightly low direction.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种具有优异的频率调节膜的尺寸精度的压电薄膜元件，其制造批次的变化或晶片基板的波动变小，并且可以执行便宜且优越的频率调节并且提供其制造方法。解决方案：压电薄膜元件包括下电极膜4，压电膜5和多个上电极膜6a，6b等。在一个膜6b上形成具有预定面积和膜厚度的诸如氧化硅或氧化铝的金属氧化物的频率调节膜11或诸如丙烯酸类树脂的复合树脂。在添加有膜11的第二压电共振部中，共振频率向稍微低的方向移动。版权所有（C）2004，JPO

28. 发明专利

JP2002344280A PIEZOELECTRIC THIN-FILM ELEMENT AND MANUFACTURING METHOD 失效
公开(公告)号：JP2002344280A
公开(公告)日：2002-11-29
申请号：JP2001148997
申请日：2001-05-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAMADA AKIRA , MAEDA CHISAKO , MIYASHITA SHOJI , MISU KOICHIRO , NOZAKI AYUMI
IPC分类号： H01L41/08 , H01L41/18 , H01L41/22 , H01L41/253 , H03H3/04 , H03H9/02 , H03H9/17
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric thin-film element having a small loss, and small variations in element characteristics and is capable of minute regulation of the resonance frequency, and to provide its manufacturing method. SOLUTION: The piezoelectric thin-film element is made to oscillated by applying a field to its piezoelectric film; the piezoelectric thin-film element includes a recessed part, in which the rear face of a support film under the piezoelectric film is exposed, by removing a part of the substrate from the rear face of the substrate; and then the resonance frequency of the piezoelectric thin-film element is regulated, by reducing the film thickness of the support film which is exposed in the recessed part.

29. 发明专利

JP2001332956A MEMBRANE PIEZOELECTRIC ELEMENT SUBSTRATE 失效
公开(公告)号：JP2001332956A
公开(公告)日：2001-11-30
申请号：JP2000148317
申请日：2000-05-19
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAMADA AKIRA , MAEDA CHISAKO , MIYASHITA SHOJI , MISU KOICHIRO
IPC分类号： C23C14/06 , H01L41/08 , H01L41/18 , H03H3/02 , H03H9/17
摘要： PROBLEM TO BE SOLVED: To provide a membrane piezoelectric substrate, capable of easily and speedily polarizing a membrane piezoelectric element, while using a ferroelectric piezoelectric body. SOLUTION: For the membrane piezoelectric element substrate provided with plural membrane piezoelectric elements, the membrane piezoelectric element is held between almost parallel provided first and second dicing lines, the lower electrode pads of the respective membrane piezoelectric elements are provided along the first dicing line, and the upper electrode pads of the respective membrane piezoelectric elements are provided along the second dicing line.

30. 发明专利

JP2001332947A METHOD FOR MANUFACTURING PIEZOELECTRIC THIN FILM ELEMENT, AND PIEZOELECTRIC THIN-FILM ELEMENT 失效
公开(公告)号：JP2001332947A
公开(公告)日：2001-11-30
申请号：JP2000151307
申请日：2000-05-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： YAMADA AKIRA , MAEDA CHISAKO , MIYASHITA SHOJI
IPC分类号： H01L41/09 , H01L21/316 , H01L41/18 , H01L41/22 , H01L41/338 , H03H3/02 , H03H9/17
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric thin film element which suppresses the distribution of resonance frequencies among elements, concerning a plurality of piezoelectric thin film elements formed on the same substrate. SOLUTION: A method for producing a piezoelectric thin-film element having an operating part formed on a base part includes preparatory processes (a)-(d) for preparing base parts 1 and 2 having the front and the rear faces; a process for forming a plurality of operating parts including the laminated structure of a lower electrode, piezoelectric film and upper electrode in a prescribed area on the front face of the base part; and a process for forming a plurality of piezoelectric thin-film elements by cutting the base part for each of the individual operating parts. The preparatory processes include element-introducing processes (b)-(d) for introducing an element to the base part, so as to almost fix the acoustic propagation distance of acoustic waves on each piezoelectric thin film element.

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