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    • 23. 发明申请
    • MICROCHIP RESERVOIR DEVICES AND FACILITATED CORROSION OF ELECTRODES
    • 微电极储存器件和电极的腐蚀性腐蚀
    • WO0230401A3
    • 2003-01-16
    • PCT/US0142698
    • 2001-10-11
    • MICROCHIPS INC
    • SHEPPARD NORMAN F JRFEAKES CHRISTINA MSANTINI JOHN T JR
    • A61K9/00A61K9/22
    • A61K9/0024A61K9/0009A61K9/0097A61M5/14276A61M2205/0244
    • Methods and devices are provided for enhancing corrosion of an electrode in a biocompatible fluid. The method comprises (1) placing a primary electrode and a counter electrode in an electroconductive biocompatible fluid to form an electrochemical cell; and (2) applying a time-varying potential, through the electrochemical cell, to the primary electrode. In a preferred embodiment, the primary electrode is metal and comprises a reservoir cap of a microchip device for the release of molecules or exposure of device reservoir contents. The potential preferably is characterized by a waveform having a maximum potential effectively anodic to meet or exceed the corrosion potential of the primary electrode. Also, the minimum potential preferably is effectively cathodic to be below the value where redeposition of metal ions on the metal electrode can substantially occur, thereby corroding the metal electrode.
    • 提供了用于增强生物相容性流体中的电极腐蚀的方法和装置。 该方法包括(1)将主电极和对电极放置在导电生物相容性流体中以形成电化学电池; 和(2)通过电化学电池将时变电位施加到初级电极。 在优选实施例中,主电极是金属并且包括用于释放分子的微芯片装置的储存器盖或装置储存器内容物的暴露。 该电位优选的特征在于具有有效地阳极以满足或超过初级电极的腐蚀电位的最大电位的波形。 此外,最小电位优选有效地为阴极,低于金属电极上的金属离子可以基本上发生再沉积,从而腐蚀金属电极的值。
    • 25. 发明申请
    • METHODS FOR HERMETICALLY SEALING MICROCHIP RESERVOIR DEVICES
    • 用于密封微孔储存器件的方法
    • WO03032957A9
    • 2004-05-06
    • PCT/US0220490
    • 2002-06-28
    • MICROCHIPS INC
    • UHLAND SCOTT APOLITO BENJAMIN FHERMAN STEPHEN JSANTINI JOHN T JRMALONEY JOHN M
    • B81C3/00A61K9/00A61K9/22B23K1/06B23K26/00B81B1/00H01L27/14
    • A61K9/0097
    • Methods are provided for hermetically sealing the reservoirs of microchip devices and for hermetically sealing the substrate assemblies in a hermetic packaging structure. In one embodiment, the method comprises (1) providing a primary substrate having a front side and a back side, the substrate comprising a plurality of reservoirs positioned between the front side and the back side, each reservoir being loaded with molecules or a secondary device for controlled release or exposure, the reservoirs having at least one opening in need of sealing, the primary substrate including one or more hermetic sealing materials; (2) providing a hermetic sealing substrate having a surface composed of one or more hermetic sealing materials; (3) positioning the hermetic sealing substrate over the reservoir openings and contacting said hermetic sealing materials of the primary substrate with said hermetic sealing materials of the hermetic sealing substrate; and (4) applying energy or a mechanical force to the contacted sealing materials effective to form a hermetic seal between the hermetic sealing substrate and the primary substrate to hermetically seal the reservoir openings.
    • 提供了用于气密地密封微芯片装置的储存器的方法,以及用于密封密封封装结构中的基板组件。 在一个实施例中,该方法包括(1)提供具有前侧和后侧的主基底,所述基底包括位于前侧和后侧之间的多个储存器,每个储存器装载有分子或辅助装置 为了控制释放或暴露,储存器具有至少一个需要密封的开口,主基底包括一个或多个气密密封材料; (2)提供具有由一种或多种密封材料构成的表面的气密密封基材; (3)将气密密封基板定位在储存器开口上,并使主基板的气密密封材料与气密密封基板的气密密封材料接触; 和(4)将能量或机械力施加到接触的密封材料上,以有效地在气密密封基底和初级基底之间形成气密密封,从而气密地密封储层开口。