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21. 发明授权

US07867782B2 Nanoscale moiety placement methods 有权
标题翻译：纳米级部分放置方法
公开(公告)号：US07867782B2
公开(公告)日：2011-01-11
申请号：US11583285
申请日：2006-10-19
申请人： Phillip W. Barth
发明人： Phillip W. Barth
IPC分类号： G01N33/543
CPC分类号： G01N33/54353
摘要： Methods and structures for placing nanoscale moieties on substrates are provided.
摘要翻译：提供了将纳米级部分置于底物上的方法和结构。

22. 发明申请

US20100147050A1 Choked Flow Isolator for Noise Reduction in Analytical Systems 有权
标题翻译：扼流流量隔离器用于分析系统中的降噪
公开(公告)号：US20100147050A1
公开(公告)日：2010-06-17
申请号：US12335842
申请日：2008-12-16
申请人： Phillip W. Barth
发明人： Phillip W. Barth
IPC分类号： G01N30/04
CPC分类号： G01N30/32 , G01N2030/324
摘要： An apparatus and a method of making a measurement using the same. The apparatus includes a channel through which a fluid flows, a detector, and a choked flow channel. The detector measures a property of the fluid by generating a signal that depends on that property. The signal generated also depends on a pressure of the fluid in the detector. The choked flow channel receives the fluid at a first pressure after the fluid has been measured by the detector, and then transmits the fluid to a downstream location at a second pressure. The fluid reaches a supersonic velocity at one point in the choked flow channel. The choked flow channel may include a convergent-divergent nozzle or an orifice in a structure located in the choked flow channel.
摘要翻译：使用其进行测量的装置和方法。该装置包括流体流过的通道，检测器和阻塞流动通道。检测器通过产生取决于该特性的信号来测量流体的性质。产生的信号也取决于检测器中的流体的压力。扼流流路在流体被检测器测量之后以第一压力接收流体，然后将流体以第二压力传递到下游位置。流体在扼流流道中的一个点处达到超音速。阻塞的流动通道可以包括位于扼流流动通道中的结构中的会聚发散喷嘴或孔口。

23. 发明申请

US20080096287A1 Nanoscale moiety placement methods 有权
标题翻译：纳米级部分放置方法
公开(公告)号：US20080096287A1
公开(公告)日：2008-04-24
申请号：US11583285
申请日：2006-10-19
申请人： Phillip W. Barth
发明人： Phillip W. Barth
IPC分类号： G01N33/543 , B41J2/01
CPC分类号： G01N33/54353
摘要： Methods and structures for placing nanoscale moieties on substrates are provided.
摘要翻译：提供了将纳米级部分置于底物上的方法和结构。

24. 发明授权

US07347921B2 Apparatus and method for threading a biopolymer through a nanopore 有权
标题翻译：通过纳米孔螺旋生物聚合物的装置和方法
公开(公告)号：US07347921B2
公开(公告)日：2008-03-25
申请号：US10622367
申请日：2003-07-17
申请人： Phillip W. Barth , Carl A. Myerholtz
发明人： Phillip W. Barth , Carl A. Myerholtz
IPC分类号： G01N27/447 , G01N27/453
CPC分类号： G01N33/48721 , B01L3/502761 , B01L2200/0647 , B01L2200/0663 , B01L2300/0816 , B01L2300/0896 , B01L2400/0421 , B82Y30/00 , C12Q1/6869 , C12Q2565/631
摘要： The present invention provides an apparatus and method for threading a biopolymer through a nanopore. The apparatus of the present invention provides a substrate having a channel with a channel wall and a nanopore in the channel wall. The channel and nanopore are designed for receiving a biopolymer. The apparatus includes at least one set of electrodes for moving the biopolymer in a first direction past the nanopore, and at least one set of electrodes for moving the biopolymer through the nanopore in a second direction.The invention also provides a method for threading a biopolymer through a nanopore. The method includes moving the biopolymer past the nanopore in a first direction, and threading the biopolymer through the nanopore in a second direction.
摘要翻译：本发明提供了一种通过纳米孔螺旋生物聚合物的装置和方法。本发明的装置提供了一种在通道壁中具有通道壁和纳米孔的通道的基底。通道和纳米孔被设计用于接收生物聚合物。该装置包括至少一组用于沿第一方向移动生物聚合物的一组电极通过纳米孔，以及至少一组用于沿第二方向移动生物聚合物通过纳米孔的电极。本发明还提供了一种通过纳米孔螺旋生物聚合物的方法。该方法包括沿着第一方向移动生物聚合物超过纳米孔，并沿着第二方向将生物聚合物穿过纳米孔。

25. 发明授权

US07095933B2 Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties 有权
公开(公告)号：US07095933B2
公开(公告)日：2006-08-22
申请号：US10118806
申请日：2002-04-09
申请人： Phillip W. Barth
发明人： Phillip W. Barth
IPC分类号： G02B1/10
CPC分类号： G02B6/132 , G02B6/12 , G02B2006/12038 , G02B2006/12061
摘要： Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties are provided. One embodiment of the present invention provides a multi-layer structure. Briefly described, one such multi-layer structure comprises a central layer, a first layer, and a second layer. The first layer is constrained to a first side of the central layer and has a first thickness. The first layer comprises a first material having a first value for a thermal expansion property. The second layer is constrained to a second side of the central layer and has a second thickness. The second layer comprises a second material having a second value for a thermal expansion property. The second thickness and the second value for the thermal expansion property and the first thickness and the first value for the thermal expansion property are such that, upon a change in temperature, the net change in the strain energy in the first layer and the net change in the strain energy in the second layer are substantially equal.

26. 发明授权

US06843281B1 Methods and apparatus for introducing liquids into microfluidic chambers 失效
标题翻译：将液体引入微流体室的方法和装置
公开(公告)号：US06843281B1
公开(公告)日：2005-01-18
申请号：US10632175
申请日：2003-07-30
申请人： Phillip W. Barth , George E. Yefchak
发明人： Phillip W. Barth , George E. Yefchak
IPC分类号： B01D19/00 , B01L3/00 , B01L3/02 , G01N35/10 , B65B1/04
CPC分类号： B01L3/0268 , B01D19/00 , B01L3/502723 , B01L2200/0642 , B01L2200/0684 , G01N2035/1018 , Y10T137/206
摘要： The present invention is directed to methods and apparatus for removing a gaseous bubble confined in a microvolume of liquid in a chamber. A source of liquid, a barrier region and an exit region are provided in fluid communication with the chamber. The source of liquid has an energy potential as regards movement of the gaseous bubble that is higher than the energy potential of the barrier region, the barrier region has a higher energy potential than the chamber, and the chamber has a higher energy potential than the exit region. The energy potential is reduced within the chamber, the source of liquid, the barrier region, and the exit region by an amount such that the energy within the gaseous bubble is sufficient to displace the gaseous bubble from the chamber through the barrier region and out the exit region and to fill the chamber with the liquid from the source.
摘要翻译：本发明涉及用于去除限制在室中的微量液体中的气泡的方法和装置。提供液体源，阻挡区域和出口区域与腔室流体连通。液体源对气泡的移动具有高于势垒区的能量势的能量势垒，势垒区具有比腔更高的能量势，并且腔具有比出口更高的能量势地区。在室内，液体源，阻挡区域和出口区域中的能量电位减小了一定量，使得气泡内的能量足以使气泡从室通过阻挡区域移出，出口区域并用来自源的液体填充室。

27. 发明授权

US06538207B1 Strain relief structures for lead connections 失效
标题翻译：用于引线连接的应变消除结构
公开(公告)号：US06538207B1
公开(公告)日：2003-03-25
申请号：US10053062
申请日：2002-01-18
申请人： Phillip W. Barth
发明人： Phillip W. Barth
IPC分类号： H05K102
CPC分类号： H05K1/118 , G02B6/4281 , H01R12/62 , H01R12/772 , H01R13/5833
摘要： A flex circuit system has a support member on which a first subsystem of the flex circuit system is mounted. A second subsystem of the flex circuit system is remote from the first subsystem. A lead is bonded to bonding points on the first and second subsystems and woven through apertures in the support member to secure the lead in relation to the first subsystem and minimize the tension and bending loads seen at the bonding points of the first subsystem.
摘要翻译：柔性电路系统具有支撑构件，柔性电路系统的第一子系统安装在该支撑构件上。柔性电路系统的第二子系统远离第一子系统。引线接合到第一和第二子系统上的接合点并通过支撑构件中的孔编织，以将引线相对于第一子系统固定，并使在第一子系统的接合点处看到的张力和弯曲载荷最小化。

28. 发明授权

US5062302A Laminated semiconductor sensor with overpressure protection 失效
标题翻译：具有超压保护功能的层压半导体传感器
公开(公告)号：US5062302A
公开(公告)日：1991-11-05
申请号：US574387
申请日：1990-08-27
申请人： Kurt E. Petersen , Phillip W. Barth , Janusz Bryzek , Joseph R. Mallon, Jr.
发明人： Kurt E. Petersen , Phillip W. Barth , Janusz Bryzek , Joseph R. Mallon, Jr.
IPC分类号： G01L9/00 , G01L19/06
CPC分类号： G01L19/0618 , G01L19/0636 , G01L9/0042 , G01L9/0054 , G01L9/0073 , Y10S73/04
摘要： An electromechanical sensor is provided which comprises: first semiconductor wafer including a first stop surface residing in a first shallow recessed region of the first wafer; a second semiconductor wafer; wherein the first and second semiconductor wafers are laminated together such that the first recessed region of the first wafer and the second wafer define a first chamber in which the first stop surface and the second wafer are disposed close enough together such that the first stop surface restrains the second wafer from deflecting beyond the first stop surface; and an apparatus for measuring deflection of the second wafer.
摘要翻译：提供了一种机电传感器，其包括：第一半导体晶片，其包括位于第一晶片的第一浅凹陷区域中的第一停止表面; 第二半导体晶片; 其中所述第一和第二半导体晶片被层压在一起，使得所述第一晶片和所述第二晶片的所述第一凹陷区域限定第一室，其中所述第一止动表面和所述第二晶片被设置得足够靠近在一起，使得所述第一止动表面限制所述第二晶片从所述第一止动表面偏转; 以及用于测量第二晶片的偏转的装置。

29. 发明授权

US5058856A Thermally-actuated microminiature valve 失效
标题翻译：热致动微型阀
公开(公告)号：US5058856A
公开(公告)日：1991-10-22
申请号：US697149
申请日：1991-05-08
申请人： Gary B. Gordon , Phillip W. Barth
发明人： Gary B. Gordon , Phillip W. Barth
IPC分类号： F16K31/70 , F15C5/00 , F16K99/00 , G01N30/20
CPC分类号： F16K99/0001 , F15C5/00 , F16K99/0009 , F16K99/0044 , F16K2099/0074 , F16K2099/008 , F16K2099/0084 , G01N30/20
摘要： A microminiature valve having radially spaced, layered spider legs, with each leg having first and second layers of materials having substantially different coefficients of thermal expansion. The legs include heating elements and are fixed at one end to allow radial compliance as selected heating of the legs causes flexure. Below the legs is a semiconductor substrate having a flow orifice aligned with a valve face. Flexure of the legs displaces the valve face relative to the flow orifice, thereby controlling fluid flow through the orifice.

30. 发明授权

US4904978A Mechanical sensor for high temperature environments 失效
标题翻译：用于高温环境的机械传感器
公开(公告)号：US4904978A
公开(公告)日：1990-02-27
申请号：US187687
申请日：1988-04-29
申请人： Phillip W. Barth , Kurt E. Petersen
发明人： Phillip W. Barth , Kurt E. Petersen
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84
CPC分类号： G01L9/0055 , G01L9/0042
摘要： A force or pressure sensor includes a monocrystalline silicon diaphragm coated with silicon dioxide upon which single crystalline silicon resistors are fused in a low profile pattern on the surface. The resistors are almost perfectly electrically isolated from each other and from the underlying silicon substrate. The structure is fabricated by forming resistors in a first wafer and then affixing that surface of the first wafer to the silicon dioxide layer on the second wafer. All of the first wafer except for the resistors has been removed, and metal contact capable of resisting elevated temperatures are formed to provide electrical connections to the resistors.

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