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    • 24. 发明授权
    • Decoding circuit for runlength codes
    • 用于游程长码的解码电路
    • US5689254A
    • 1997-11-18
    • US540763
    • 1995-10-11
    • Mikio FujiwaraYoshiyuki GoiHideki Ishii
    • Mikio FujiwaraYoshiyuki GoiHideki Ishii
    • G06T9/00H03M7/46H04N7/26H04N7/30H04N1/41
    • H03M7/46H04N19/60H04N19/13H04N19/91
    • After all the data words stored in a first scan transform RAM are initialized to "0"s, only signed level data words are overwritten, based on zero runlength data words, on "0"s at the positions designated by zigzag scan addresses in the first scan transform RAM. Thus, while only non-zero components out of 8.times.8 components forming one block are written in the first scan transform RAM, a block stored in a second scan transform RAM is read and initialized. Further, while only non-zero components of the next block are written in the second scan transform RAM, the block stored in the first scan transform RAM is read and initialized. This achieves, in real time, highly efficient runlength decoding responsive to a picture element clock signal of high frequency.
    • 在存储在第一扫描变换RAM中的所有数据字被初始化为“0”之后,只有符号电平数据字被覆盖,基于零游程长度数据字,在由0字节中的Z字形扫描地址指定的位置处的“0” 第一次扫描变换RAM。 因此,虽然仅在形成一个块的8×8分量中的非零分量被写入第一扫描变换RAM中,但是存储在第二扫描变换RAM中的块被读取和初始化。 此外,只有下一块的非零分量被写入第二扫描变换RAM中时,读出并初始化存储在第一扫描变换RAM中的块。 实时地实现响应于高频的像素时钟信号的高效率的长度解码。
    • 25. 发明申请
    • ELECTROMAGNETIC VIBRATING DIAPHRAGM PUMP
    • 电磁振动膜片泵
    • US20140271274A1
    • 2014-09-18
    • US14117540
    • 2012-05-02
    • Hideki IshiiTsuyoshi Takamichi
    • Hideki IshiiTsuyoshi Takamichi
    • F04B43/02
    • F04B43/026F04B43/0054F04B43/04F04B45/04F04B45/043F04B45/047
    • An electromagnetic vibrating diaphragm pump enabling improvement of working efficiency in fitting center plates to a diaphragm, reduction of production cost and stabilization of performance between products. The disk-like second plate includes the cruciform rising portion having the concave portions, and the second ring rib. The first ring rib is formed at the center of the surface of the disk-like first plate coming into contact with the diaphragm, and a fitting groove provided with convex portions to be press-fitted to the concave portions is formed by this first ring rib. The diaphragm has the protrusions for preventing the diaphragm from being pressed out on the periphery of the through-hole at its center, and the protrusions are engaged with the ring ribs from the circumference of the protrusion.
    • 一种电磁振动隔膜泵,能够提高将中心板安装在隔膜上的工作效率,降低生产成本,并使产品之间的性能稳定。 盘状的第二板包括具有凹部的十字形上升部和第二环状肋。 第一环形肋形成在与隔膜接触的盘状第一板的表面的中心处,并且设置有压配合到凹部的凸部的嵌合槽由该第一环形肋 。 隔膜具有用于防止隔膜在其中心的通孔的周边上被压出的突起,并且突起从突起的周边与环形肋接合。
    • 28. 发明申请
    • Semiconductor device and manufacturing process thereof
    • 半导体装置及其制造方法
    • US20050258531A1
    • 2005-11-24
    • US11132292
    • 2005-05-19
    • Hideki Ishii
    • Hideki Ishii
    • H01L25/18H01L23/495H01L25/065H01L25/07H01L25/10
    • H01L25/0657H01L23/49575H01L24/45H01L24/48H01L24/49H01L25/03H01L2224/05554H01L2224/32145H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/49171H01L2224/73215H01L2225/06582H01L2924/01079H01L2924/10161H01L2924/14H01L2924/15311H01L2924/181H01L2924/19107H01L2924/00014H01L2924/00H01L2924/00012
    • One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor package on the first semiconductor chip, and a first molded resin encompassing the first semiconductor chip and the built-in semiconductor package. The built-in semiconductor package includes at least one second semiconductor chip mounted on a die pad, and the second semiconductor chip has a plurality of terminals. Also, the built-in semiconductor package includes a plurality of lead frames, and each of the lead frames is electrically connected with respective one of the terminals of the second semiconductor chip, and has a connection region on one side and a support region on the other opposing side. Further, the built-in semiconductor package a second molded resin encompassing the die pad, the second semiconductor chip, and the lead frames so that each of the connection regions is exposed and each of the support regions is covered. While the second molded resin has top and bottom surfaces, a plane flush with the connection region locates between the top and bottom surfaces of the second molded resin.
    • 本发明的一个方面是提供一种半导体器件,其包括电路板,安装在电路板上的第一半导体芯片,第一半导体芯片上的内置半导体封装以及包含第一半导体封装的第一模制树脂 第一个半导体芯片和内置半导体封装。 内置半导体封装包括安装在管芯焊盘上的至少一个第二半导体芯片,第二半导体芯片具有多个端子。 此外,内置的半导体封装包括多个引线框架,并且每个引线框架与第二半导体芯片的相应的一个端子电连接,并且在一侧具有连接区域和 其他对方。 此外,内置半导体封装包围芯片焊盘,第二半导体芯片和引线框架的第二模制树脂,使得每个连接区域都被暴露,并且每个支撑区域被覆盖。 当第二模制树脂具有顶表面和底表面时,与连接区域齐平的平面位于第二模塑树脂的顶表面和底表面之间。