专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US08287990B2 Radio wave transmission cover and method of manufacturing the same 有权
标题翻译：无线电波传输盖及其制造方法
公开(公告)号：US08287990B2
公开(公告)日：2012-10-16
申请号：US12076523
申请日：2008-03-19
申请人： Hideto Maeda , Daiichiro Kawashima , Kimihiro Iimura , Koji Kuno , Mamoru Kato , Takayasu Ido , Muneo Furutani , Tetsuya Fujii
发明人： Hideto Maeda , Daiichiro Kawashima , Kimihiro Iimura , Koji Kuno , Mamoru Kato , Takayasu Ido , Muneo Furutani , Tetsuya Fujii
IPC分类号： B32B3/00 , B05D5/12
CPC分类号： H01Q1/40 , B29C45/1671 , B29C2045/1673 , B29K2995/0025 , B29K2995/0026 , B60R19/483 , G01S7/03 , G01S2013/9371 , G01S2013/9375 , H01Q1/3233 , H01Q1/42 , H01Q1/422 , Y10T428/24802 , Y10T428/24851
摘要： The present invention provides a radio wave transmission cover, which is provided in front of a radar device for vehicles, and a method of manufacturing the radio wave transmission cover. In the radio wave transmission cover, cover-side wall surfaces (50) are formed in a second cover layer (35) at positions adjacent to each other. Furthermore, substrate-side wall surfaces (60), which have shapes complementary to the cover-side wall surfaces (50), are formed in a substrate layer (4), which is provided on the rear surface of the second cover layer (35). The cover-side wall surfaces (50) and the corresponding substrate-side wall surfaces (60) are engaged to each other.
摘要翻译：本发明提供一种无线电波传输盖，其设置在用于车辆的雷达装置的前方，以及制造无线电波传输盖的方法。在无线电波传输盖中，在彼此相邻的位置处，在第二覆盖层（35）中形成盖侧壁面（50）。此外，在设置在第二覆盖层（35）的后表面上的基板层（4）中形成具有与盖侧壁面（50）互补的形状的基板侧壁面（60））。盖侧壁面（50）和相应的基板侧壁面（60）彼此接合。

22. 发明申请

US20100240159A1 MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT 有权
标题翻译：半导体激光元件的制造方法
公开(公告)号：US20100240159A1
公开(公告)日：2010-09-23
申请号：US12676666
申请日：2008-09-02
申请人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
发明人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
IPC分类号： H01L21/304
CPC分类号： B23K26/0624 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C03B33/0222 , H01L21/78 , H01S5/0201 , Y02P40/57
摘要： Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.
摘要翻译：最初在被加工物1中形成沿切割线5a，5b延伸的用于切割的切割8a，8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b，同时定位在物体1内的会聚点，并且形成为沿着切割线的线延伸的部分，除了与切割线5a相交的部分34b。这样，从切点8a的起点区域切断物体1时，能够切割8b的起点区域的影响更小，从而可以可靠地获得具有精确的切割面的条。因此，不需要在多个条中形成沿着切割线5b切割的起点区域，从而可以提高半导体激光元件的生产率。

23. 发明申请

US20090231570A1 CONCAVE-CONVEX SURFACE INSPECTION APPARATUS 有权
标题翻译： CONCAVE-CONVEX表面检查装置
公开(公告)号：US20090231570A1
公开(公告)日：2009-09-17
申请号：US12400140
申请日：2009-03-09
申请人： Masataka Toda , Toshihiko Yoshikawa , Katsuya Inuzuka , Koji Kuno
发明人： Masataka Toda , Toshihiko Yoshikawa , Katsuya Inuzuka , Koji Kuno
IPC分类号： G01C3/00
CPC分类号： G01B11/25
摘要： A concave-convex surface inspection apparatus includes a slit light source unit emitting a slit light to a concave-convex surface of an object to be inspected, an image-taking unit taking an image of the concave-convex surface illuminated by the emitted slit light with an imaging optical axis intersecting with an optical axis of the slit light with a narrow-angle equal to or narrower than 30 degrees, and an evaluation section obtaining a three dimensional shape of the concave-convex surface and evaluating the obtained three dimensional shape, wherein the slit light source unit includes a slit light source and a cylindrical lens, the image-taking unit includes a telecentric lens unit, an image-taking section having an imaging surface tilted relative to the imaging optical axis for increasing a focusing range of the concave-convex surface, and a P polarizer.
摘要翻译：凹凸表面检查装置包括将狭缝光发射到被检查物体的凹凸面的狭缝光源单元，摄像单元拍摄由发射的狭缝光照射的凹凸面的图像具有与狭缝等于或小于30度的狭缝光的光轴相交的成像光轴和获得凹凸表面的三维形状的评估部分，并评估所获得的三维形状，其中所述狭缝光源单元包括狭缝光源和柱面透镜，所述摄像单元包括远心透镜单元，摄像部分具有相对于成像光轴倾斜的成像表面，用于增加所述摄像部分的聚焦范围凹凸表面和P偏振器。

24. 发明授权

US08846194B2 Electromagnetic wave-permeable brilliant coated resin product and manufacturing method therefor 有权
标题翻译：电磁波透光光亮涂层树脂产品及其制造方法
公开(公告)号：US08846194B2
公开(公告)日：2014-09-30
申请号：US12458715
申请日：2009-07-21
申请人： Yosuke Maruoka , Hiroshi Watarai , Takayasu Ido , Koji Kuno , Osamu Koyanaka
发明人： Yosuke Maruoka , Hiroshi Watarai , Takayasu Ido , Koji Kuno , Osamu Koyanaka
IPC分类号： H01B3/04 , C09D5/36
CPC分类号： C09D5/36 , Y10T428/12014 , Y10T428/251 , Y10T428/265
摘要： The present invention provides an electromagnetic wave-permeable brilliant coated resin product which has a brilliant coating film formed by applying a coating composition that includes a planar brightening material formed from aluminum, on a resin substrate. Within the brilliant coating film, the brightening material is oriented in a state such that a plane thereof is biased toward a direction that follows a surface of the brilliant coating film, and an average overlapping quantity (y), which is an average of a quantity of brightening material that crosses one orthogonal line that is orthogonal to the surface of the brilliant coating film, and an average inter-brightening material distance (x), which is an average of distances on the orthogonal line between adjacent brightening materials that cross said orthogonal line, satisfy the following two formulae: y≧0.5 (formula 1), and y≦0.3969x+0.594 (formula 2), where, the unit for x is μm.
摘要翻译：本发明提供了一种电磁波透光性光亮涂层树脂产品，其具有通过将由铝形成的平面增亮材料涂覆在树脂基板上而形成的辉光涂膜。在光亮的涂膜内，亮化材料被取向为使得其平面朝着辉光涂膜的表面的方向偏压，平均重叠量（y）为平均重量穿过与正亮涂膜的表面正交的一条正交线的增白材料，以及平均透光材料距离（x），其是在相交的所述正交的相邻的增亮材料之间的正交线上的距离的平均值线满足以下两个公式：y≥0.5（式1），y＆nlE; 0.3969x + 0.594（式2），其中x的单位为μm。

25. 发明授权

US08110422B2 Manufacturing method of semiconductor laser element 有权
标题翻译：半导体激光元件的制造方法
公开(公告)号：US08110422B2
公开(公告)日：2012-02-07
申请号：US12676666
申请日：2008-09-02
申请人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
发明人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
IPC分类号： H01L21/00
CPC分类号： B23K26/0624 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C03B33/0222 , H01L21/78 , H01S5/0201 , Y02P40/57
摘要： Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.
摘要翻译：最初在被加工物1中形成沿切割线5a，5b延伸的用于切割的切割8a，8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b，同时定位在物体1内的会聚点，并且形成为沿着切割线的线延伸的部分，除了与切割线5a相交的部分34b。这样，从切点8a的起点区域切断物体1时，能够切割8b的起点区域的影响更小，从而可以可靠地获得具有精确的切割面的条。因此，不需要在多个条中形成沿着切割线5b切割的起点区域，从而可以提高半导体激光元件的生产率。

26. 发明授权

US07608214B2 Laser beam machining method 有权
标题翻译：激光束加工方法
公开(公告)号：US07608214B2
公开(公告)日：2009-10-27
申请号：US11665263
申请日：2005-10-05
申请人： Koji Kuno , Tatsuya Suzuki
发明人： Koji Kuno , Tatsuya Suzuki
IPC分类号： H01L21/268
CPC分类号： B23K26/40 , B23K26/0665 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions 71 to 77 to become a starting point region for cutting along lines to cut 5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut 5 extend over a depressed area surface r2 and a protruded area surface r1 in the entrance surface r. The modified region 71 is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part 51a on the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region 72 is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part 51b on the depressed area surface r2, the light-converging point is located on the outside of the object.
摘要翻译：提供一种可以高精度地切割具有不规则表面的待处理平面物体作为处理激光的入射面的激光加工方法。这种激光加工方法在将聚光点定位在物体内的同时用激光照射待处理的平面物体，从而形成改质区域71〜77，成为沿切割线5切割的起点区域。入射面r 对于物体中的激光是不规则的表面。切割线5在入口面r的凹陷区域表面r2和突出区域表面r1上延伸。改质区域71形成在与凹陷区域表面r2相距预定距离的内侧。在沿着突出区域表面r1上的部分51a照射激光时，聚光点位于物体的外侧。改质区域72形成在与突出面r1相距预定距离的内侧。在沿着凹陷区域表面r2上的部分51b照射激光时，聚光点位于物体的外侧。

27. 发明申请

US20060144828A1 Device and method for laser processing 审中-公开
标题翻译：用于激光加工的装置和方法
公开(公告)号：US20060144828A1
公开(公告)日：2006-07-06
申请号：US10537510
申请日：2003-12-04
申请人： Kenshi Fukumitsu , Fumitsugu Fukuyo , Koji Kuno
发明人： Kenshi Fukumitsu , Fumitsugu Fukuyo , Koji Kuno
IPC分类号： B23K26/16
CPC分类号： B23K26/046 , B23K26/048 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D1/221
摘要： A laser processing apparatus and a laser processing method which can accurately converge processing laser light at a predetermined position are provided. In the laser processing apparatus, a condenser lens 31 converges processing laser light L1 and rangefinding laser light L2 onto an object to be processed 1 on the same axis. Here, light-converging point position control means 40 detects reflected light L3 of the rangefinding laser light reflected by the front face 3 of the object 1, and places a light-converging point P1 of the processing laser light L1 at a predetermined position. Since the processing by the processing laser light L1 and the measurement of displacement of the front face 3 by the rangefinding laser light L2 are carried out on the same axis as such, the light-converging point P1 of processing laser light L1 can be prevented from shifting from the predetermined position because of vibrations of the stage 21 and the like. Therefore, the processing laser light L1 can accurately be converged at the predetermined position.
摘要翻译：提供了能够将处理激光准确地收敛在预定位置的激光加工装置和激光加工方法。在激光加工装置中，聚光透镜31将加工用激光L1和测距激光L 2在同一轴上会聚在待处理对象物1上。这里，聚光点位置控制装置40检测由物体1的正面3反射的测距激光的反射光L 3，并将处理用激光L 1的聚光点P1置于规定的位置。由于通过加工用激光L 1的处理和通过测距激光L 2进行的前面3的位移测量在同一轴上进行，因此处理用激光L 1的聚光点P 1 可以防止由于台架21等的振动而从预定位置移动。因此，处理用激光L 1能够精确地会聚在预定位置。

28. 发明授权

US08604383B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08604383B2
公开(公告)日：2013-12-10
申请号：US11659376
申请日：2005-07-27
申请人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
发明人： Koji Kuno , Tatsuya Suzuki , Takeshi Sakamoto
IPC分类号： B23K26/42 , H01L21/301
CPC分类号： H01L23/562 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D1/221 , B28D5/0011 , C03B33/0222 , H01L2924/0002 , H01L2924/00
摘要： This laser processing method irradiates a substrate 4 with laser light L while locating a light-converging point P within the substrate 4, so as to form a quality modified region 71 to become a starting point region for cutting within the substrate 4 along a line to cut 5. Here, the laser light L is oscillated pulsewise along a desirable part RP in the line to cut 5, and continuously in a predetermined part RC in the line to cut 5. Consequently, the quality modified region 71 is formed within the substrate 4 along the desirable part RP in the line to cut 5, whereas no quality modified region 71 is formed within the substrate 4 along the predetermined part RC in the line to cut 5.
摘要翻译：该激光加工方法在将聚光点P定位在基板4内的状态下照射激光L的基板4，从而形成质量改质区域71，成为基板4内的切割起点区域，这里，激光L沿着要切割的线5中的期望部分RP脉动地沿着切割线5中的预定部分RC连续振荡。因此，质量改质区域71形成在基板内沿着要切割的线5中的期望部分RP 4，而沿着切割线5中的预定部分RC，在基板4内不形成质量改质区域71。

29. 发明申请

US20110193952A1 DEFECT DETECTION APPARATUS AND DEFECT DETECTION METHOD 审中-公开
标题翻译：缺陷检测装置和缺陷检测方法
公开(公告)号：US20110193952A1
公开(公告)日：2011-08-11
申请号：US13018817
申请日：2011-02-01
申请人： Akira KOZAKAI , Masataka Toda , Koji Kuno
发明人： Akira KOZAKAI , Masataka Toda , Koji Kuno
IPC分类号： G06K9/00 , H04N7/18
CPC分类号： G01N21/8851 , G01N21/474 , G01N21/8806 , G01N21/95 , G01N2021/8918
摘要： A defect detection apparatus, detecting a defect on an inspection surface of an inspection object, includes a table including a table surface, a lighting device emitting a light to the inspection surface, an image capturing device capturing an image of the inspection surface, a displacement mechanism changing a direction of at least of one of a relative direction of an optical axis of the lighting device relative to the table surface and a relative direction of an optical axis of the image capturing device relative to the table surface, an image data obtaining portion obtaining an image data from images captured by the image capturing device while changing the relative direction, a feature extracting portion extracting a feature representing a reflection characteristic of the inspection surface from the image data, and a defect specification portion specifying a type of the defect on the inspection surface based on the extracted feature.
摘要翻译：一种检测检查对象的检查面上的缺陷的缺陷检测装置，包括：台面，向检查面发射光的照明装置，摄像检查面的图像的摄像装置，位移改变照明装置的光轴相对于台面的相对方向和摄像装置相对于台面的相对方向中的至少一个的方向的机构，图像数据取得部在改变相对方向的同时从图像捕获装置拍摄的图像中获取图像数据，从图像数据中提取表示检查表面的反射特性的特征的特征提取部分，以及指定缺陷类型的缺陷指定部分基于提取的特征的检查表面。

30. 发明申请

US20090039559A1 Laser Beam Machining Method 有权
标题翻译：激光束加工方法
公开(公告)号：US20090039559A1
公开(公告)日：2009-02-12
申请号：US11665263
申请日：2005-10-05
申请人： Koji Kuno , Tatsuya Suzuki
发明人： Koji Kuno , Tatsuya Suzuki
IPC分类号： B29C67/00
CPC分类号： B23K26/40 , B23K26/0665 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： To provide a laser processing method which can highly accurately cut a planar object to be processed having an irregular surface as an entrance surface for processing laser light.This laser processing method irradiates a planar object to be processed with laser light while locating a light-converging point within the object, thereby forming modified regions 71 to 77 to become a starting point region for cutting along lines to cut 5. The entrance surface r for the laser light in the object is an irregular surface. The lines to cut 5 extend over a depressed area surface r2 and a protruded area surface r1 in the entrance surface r. The modified region 71 is formed inside by a predetermined distance from the depressed area surface r2. At the time of irradiation with laser light along a part 51a on the protruded area surface r1, the light-converging point is located on the outside of the object. The modified region 72 is formed inside by a predetermined distance from the protruded area surface r1. At the time of irradiation with laser light along a part 51b on the depressed area surface r2, the light-converging point is located on the outside of the object.
摘要翻译：提供一种可以高精度地切割具有不规则表面的待处理平面物体作为处理激光的入射面的激光加工方法。这种激光加工方法在将聚光点定位在物体内的同时用激光照射待处理的平面物体，从而形成改质区域71〜77，成为沿切割线5切割的起点区域。入射面r 对于物体中的激光是不规则的表面。切割线5在入口面r的凹陷区域表面r2和突出区域表面r1上延伸。改质区域71形成在与凹陷区域表面r2相距预定距离的内侧。在沿着突出区域表面r1上的部分51a照射激光时，聚光点位于物体的外侧。改质区域72形成在与突出面r1相距预定距离的内侧。在沿着凹陷区域表面r2上的部分51b照射激光时，聚光点位于物体的外侧。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式