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21. 发明授权

US08054850B2 Communication control system 有权
标题翻译：通讯控制系统
公开(公告)号：US08054850B2
公开(公告)日：2011-11-08
申请号：US10584106
申请日：2004-08-11
申请人： Koji Demachi , Hiromichi Ebashi , Kuniharu Akabane , Takeshi Nakajima , Takeshi Hongo , Toyoaki Yokoi , Kenji Habaguchi , Masayuki Murakami
发明人： Koji Demachi , Hiromichi Ebashi , Kuniharu Akabane , Takeshi Nakajima , Takeshi Hongo , Toyoaki Yokoi , Kenji Habaguchi , Masayuki Murakami
IPC分类号： H04L12/16
CPC分类号： H04L12/4015 , H04L12/40 , H04L12/40032 , H04L12/4035
摘要： A communication control system is provided that satisfies the needs of industrial applications in terms of real time properties, scalability and flexibility. For this purpose, the invention causes a communication station performing communications in accordance with a standard protocol to perform multiplex communications based on time division of a communication band. Communication is performed by dividing a communication cycle into time slots, and assigning a set of communication stations and a type of a communication section to each of the time slots.
摘要翻译：提供一种满足工业应用在实时性，可扩展性和灵活性方面的需求的通信控制系统。为此，本发明使得根据标准协议执行通信的通信站基于通信频带的时分执行多路复用通信。通信是通过将通信周期划分成时隙来执行的，并且将一组通信站和通信部分的类型分配给每个时隙。

22. 发明申请

US20100198363A1 DISTRIBUTED CONTROL SYSTEM 有权
标题翻译：分布式控制系统
公开(公告)号：US20100198363A1
公开(公告)日：2010-08-05
申请号：US12700132
申请日：2010-02-04
申请人： Hideharu Yajima , Satoshi Kitamura , Senji Watanabe , Masafumi Kisa , Kazushi Sakamoto , Hiroyuki Takizawa , Kuniharu Akabane , Yoshinori Kobayashi , Kenji Habaguchi , Kiyotaka Kozakai , Mitsuhiro Kurono , Hiroaki Nakajima , Takeshi Hongo
发明人： Hideharu Yajima , Satoshi Kitamura , Senji Watanabe , Masafumi Kisa , Kazushi Sakamoto , Hiroyuki Takizawa , Kuniharu Akabane , Yoshinori Kobayashi , Kenji Habaguchi , Kiyotaka Kozakai , Mitsuhiro Kurono , Hiroaki Nakajima , Takeshi Hongo
IPC分类号： G06F1/12
CPC分类号： G05B19/042 , G05B19/05
摘要： There is provided a distributed control system including a plurality of field controllers which are connected through a control network. Each of the field controllers includes: a control clock that defines a control timing of the field controller; and an adjustment unit that adjusts a control time of the control clock depending on a network time obtained through the control network.
摘要翻译：提供了包括通过控制网络连接的多个现场控制器的分布式控制系统。每个现场控制器包括：定义现场控制器的控制定时的控制时钟; 以及调整单元，其根据通过控制网络获得的网络时间调整控制时钟的控制时间。

23. 发明授权

US07675752B2 Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US07675752B2
公开(公告)日：2010-03-09
申请号：US12356413
申请日：2009-01-20
申请人： Takeshi Hongo
发明人： Takeshi Hongo
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28F1/24 , G06F1/203 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a heat sink includes first and second fin units. Fins of the first fin unit are provided with a through-hole part in which a heat pipe is inserted. Fins of the second fin unit are provided with a cutout part cut out to avoid the heat pipe. The fins of the second fin unit are inserted in spaces between the fins of the first fin unit. The fins of the second fin unit reach to a region in which the fins of the second fin unit overlap the heat pipe in the first fin unit.
摘要翻译：根据一个实施例，散热器包括第一和第二鳍单元。第一翅片单元的叶片设置有插入热管的通孔部。第二翅片单元的叶片设置有切除部分以避开热管。第二翅片单元的翅片插入在第一翅片单元的翅片之间的空间中。第二翅片单元的翅片到达第二翅片单元的翅片与第一翅片单元中的热管重叠的区域。

24. 发明授权

US07649736B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US07649736B2
公开(公告)日：2010-01-19
申请号：US12338370
申请日：2008-12-18
申请人： Takeshi Hongo
发明人： Takeshi Hongo
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber.
摘要翻译：根据一个实施例，电子设备包括壳体，壳体包括开口，将壳体的内部分隔成第一室的分隔壁和通过开口向外部开口的第二室，第一和第二发热部分安装在所述第一室中的第一散热构件，位于所述第二室中的第一散热构件，传递由所述第一发热体产生的热量的传热构件;抽出外部空气并将空气排出所述第一散热构件的冷却风扇，第二散热构件，其暴露于壳体的外部并与第二发热部分热连接;以及覆盖该开口和第二散热构件的盖。盖在盖和壳体之间形成间隙。间隙与第二室连通。

25. 发明申请

US20090213550A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20090213550A1
公开(公告)日：2009-08-27
申请号：US12372468
申请日：2009-02-17
申请人： Takeshi Hongo
发明人： Takeshi Hongo
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , G06F1/203
摘要： According to one embodiment, an electronic device comprises a circuit component, a heat sink configured to dissipate heat generated by the circuit component to the outside, and a first heat transfer sheet and a second heat transfer sheet that are arranged adjacent to each other between the circuit component and the heat sink and have thermal conductivity for thermally connecting the circuit component to the heat sink. The second heat transfer sheet has a rigidity greater than that of the first heat transfer sheet and is provided with through-holes. The first heat transfer sheet has a thermal conductivity and an elasticity greater than those of the second heat transfer sheet, and is pushed into the through-holes to thermally connect the circuit component to the heat sink.
摘要翻译：根据一个实施例，电子设备包括电路部件，被配置为将由电路部件产生的热量散发到外部的散热器，以及在第二传热片和第二传热片之间彼此相邻布置的第一传热片和第二传热片电路元件和散热器，并且具有用于将电路部件热连接到散热器的热导率。第二传热片具有大于第一传热片的刚性，并且设置有通孔。第一传热片具有大于第二传热片的导热性和弹性，并且被推入通孔以将电路部件热连接到散热片。

26. 发明申请

US20080298011A1 ELECTRONIC APPARATUS AND COOLING UNIT 审中-公开
标题翻译：电子设备和冷却单元
公开(公告)号：US20080298011A1
公开(公告)日：2008-12-04
申请号：US12130935
申请日：2008-05-30
申请人： Takeshi Hongo
发明人： Takeshi Hongo
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： According to one embodiment, an electronic apparatus includes a first heat receiving plate opposed to one side of a circuit board and an exothermic component mounted on the circuit board, and thermally connected to the exothermic component, a second heat receiving plate opposed to another side of the circuit board, and a heat transfer member provided with a heat receiving end portion thermally connected to at least one of the first and second heat receiving plates. The first and second heat receiving plates each extend to a region outside the circuit board, and are joined to each other in the region outside the circuit board so as to be thermally connected to each other. The heat receiving end portion of the heat transfer member is located in a line to the circuit board along a direction parallel with a surface of the circuit board.
摘要翻译：根据一个实施例，电子设备包括与电路板的一侧相对的第一热接收板和安装在电路板上的放热部件，并与发热部件热连接;第二受热板，电路板和传热部件，其设置有热连接到第一和第二受热板中的至少一个的热接收端部。第一和第二热接收板各自延伸到电路板外部的区域，并且在电路板外部的区域中彼此接合以彼此热连接。传热部件的受热端部沿着与电路基板的表面平行的方向与电路基板配线。

27. 发明授权

US07405930B2 Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US07405930B2
公开(公告)日：2008-07-29
申请号：US11168368
申请日：2005-06-29
申请人： Takeshi Hongo , Hiroshi Nakamura
发明人： Takeshi Hongo , Hiroshi Nakamura
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： G06F1/203
摘要： An electronic apparatus has a housing which is formed with a suction port and an exhaust port. The interior of the housing is partitioned with a first chamber and a second chamber by a partition wall. The first chamber accommodates a CPU generating heat. The suction port and the exhaust port are open to the second chamber. A heat pipe which transfers a heat of the CPU from the first chamber to the second chamber is disposed pass through the partition wall. A fan is disposed in the second chamber. The fan suctions air from the suction ports and discharges the suctioned air from the exhaust port. The heat of the CPU transferred to the second chamber is emitted out of the housing. A part where the heat pipe pass through the partition wall is liquid-tightly sealed through a sealing member.
摘要翻译：电子设备具有形成有吸入口和排气口的壳体。壳体的内部由第一腔室和第二腔室通过分隔壁分隔开。第一个房间容纳一个产生热量的CPU。吸入口和排气口向第二室敞开。将CPU从第一室传递到第二室的热管设置穿过分隔壁。风扇设置在第二室中。风扇从吸入口吸入空气，并从排气口排出吸入的空气。传送到第二个室的CPU的热量被从外壳中排出。热管通过隔壁的部分通过密封构件液密地密封。

28. 发明申请

US20080019093A1 Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：US20080019093A1
公开(公告)日：2008-01-24
申请号：US11797158
申请日：2007-05-01
申请人： Takeshi Hongo
发明人： Takeshi Hongo
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber.
摘要翻译：根据一个实施例，电子设备包括壳体，壳体包括开口，将壳体的内部分隔成第一室的分隔壁和通过开口向外部开口的第二室，第一和第二发热部分安装在所述第一室中的第一散热构件，位于所述第二室中的第一散热构件，传递由所述第一发热体产生的热量的传热构件，抽出外部空气并将空气排出第一散热构件的冷却风扇，第二散热构件，其暴露于壳体的外部并与第二发热部分热连接;以及覆盖该开口和第二散热构件的盖。盖在盖和壳体之间形成间隙。间隙与第二室连通。

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