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21. 发明授权

US11235598B2 Apparatus, inlet air unit and liquid discharging apparatus 有权
公开(公告)号：US11235598B2
公开(公告)日：2022-02-01
申请号：US16804235
申请日：2020-02-28
申请人： Toshiya Satoh , Teiichiro Ishikawa , Masaya Hamaguchi , Yusuke Komine , Huizee Then , Naohiro Toda , Hidehisa Shibasaki
发明人： Toshiya Satoh , Teiichiro Ishikawa , Masaya Hamaguchi , Yusuke Komine , Huizee Then , Naohiro Toda , Hidehisa Shibasaki
IPC分类号： B41J13/00
摘要： An apparatus according to one aspect of the present disclosure includes a temperature controlling member configured to heat or cool a conveyed substrate to which a liquid is applied, the conveyed substrate contacting an outer peripheral surface of the temperature controlling member; and an upstream inlet air unit configured to draw air between the substrate and the temperature controlling member, the upstream inlet air unit being provided upstream of a contact location of the substrate with the temperature controlling member, in a conveying direction.

22. 发明授权

US09433134B2 Power semiconductor module and power converter using the same 有权
标题翻译：功率半导体模块和功率转换器使用相同
公开(公告)号：US09433134B2
公开(公告)日：2016-08-30
申请号：US14126955
申请日：2012-06-15
申请人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Tokihito Suwa
发明人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Tokihito Suwa
IPC分类号： H05K7/20 , H05K7/14 , H01L25/11 , H01L25/18 , H01L23/367 , H01L23/433 , H01L23/00 , H02M7/00 , H01L23/473
CPC分类号： H05K7/2089 , H01L23/367 , H01L23/4334 , H01L23/473 , H01L24/33 , H01L25/115 , H01L25/18 , H01L2224/32245 , H01L2924/07802 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H02M7/003 , H05K7/1432 , H05K7/209 , H01L2924/00 , H01L2924/00012
摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.
摘要翻译：功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口，以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。

23. 发明授权

US07535106B2 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate 失效
标题翻译：用于将半导体芯片连接到印刷布线基板的布线玻璃基板和具有布线玻璃基板的半导体模块
公开(公告)号：US07535106B2
公开(公告)日：2009-05-19
申请号：US11657280
申请日：2007-01-24
申请人： Osamu Shiono , Takao Ishikawa , Takashi Namekawa , Yasutaka Suzuki , Takashi Naito , Hiroki Yamamoto , Daigorou Kamoto , Ken Takahashi , Tadanori Segawa , Toshiya Satoh , Takao Miwa , Shigehisa Motowaki
发明人： Osamu Shiono , Takao Ishikawa , Takashi Namekawa , Yasutaka Suzuki , Takashi Naito , Hiroki Yamamoto , Daigorou Kamoto , Ken Takahashi , Tadanori Segawa , Toshiya Satoh , Takao Miwa , Shigehisa Motowaki
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/4061 , H01L21/486 , H01L23/49816 , H01L23/49827 , H01L23/49883 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01057 , H01L2924/01063 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/19011 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2924/30107 , H05K1/0306 , H05K1/113 , H05K3/426 , H05K2201/0116 , H05K2201/0367 , H05K2201/09563 , H05K2201/09581 , H05K2201/09827 , H05K2201/09981 , H01L2924/00014 , H01L2924/00
摘要： A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.
摘要翻译：布线玻璃基板包括由玻璃形成的玻璃基板，在预定位置形成有多个孔，凸起形成为与填充孔的导电材料连接，形成在与形成有凸点的表面相对的表面上的布线并且将与间隔不同的间隔布置的多个连接端子电连接到导电材料上。导电材料的形状是多孔的，并且多孔电极通过锚固效应结合到孔的内壁表面，以增加玻璃基底的强度。

24. 发明授权

US07294905B2 Thin film capacitor and electronic circuit component 有权
标题翻译：薄膜电容器和电子电路元件
公开(公告)号：US07294905B2
公开(公告)日：2007-11-13
申请号：US10483378
申请日：2002-07-12
申请人： Masahiko Ogino , Toshiya Satoh , Takao Miwa , Toshihide Nabatame , Satoru Amou
发明人： Masahiko Ogino , Toshiya Satoh , Takao Miwa , Toshihide Nabatame , Satoru Amou
IPC分类号： H01L29/00
CPC分类号： H01L27/0805 , H01L23/49822 , H01L2924/0002 , H01L2924/15311 , H05K1/162 , H01L2924/00
摘要： A thin film capacitor comprising a lower electrode formed on a predetermined surface, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, wherein the end portion of the lower electrode is further covered by an insulator other than the dielectric layer.
摘要翻译：一种薄膜电容器，包括形成在预定表面上的下电极，形成在下电极上的电介质层和形成在电介质层上的上电极，其中下电极的端部进一步被绝缘体覆盖，电介质层。

25. 发明申请

US20050245061A1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050245061A1
公开(公告)日：2005-11-03
申请号：US11168460
申请日：2005-06-29
申请人： Toshiya Satoh , Masahiko Ogino , Tadanori Segawa , Yoshihide Yamaguchi , Hiroyuki Tenmei , Atsushi Kazama , Ichiro Anjo , Asao Nishimura
发明人： Toshiya Satoh , Masahiko Ogino , Tadanori Segawa , Yoshihide Yamaguchi , Hiroyuki Tenmei , Atsushi Kazama , Ichiro Anjo , Asao Nishimura
IPC分类号： H01L23/29 , H01L21/301 , H01L21/3205 , H01L21/56 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/485 , H01L23/52 , H01L23/522 , H01L21/50
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/0236 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05548 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： The present invention is a semiconductor device having the semiconductor element obtained by cutting a semiconductor wafer with the electrode pad formed on one side along a scribe line, a semiconductor element protective layer on the semiconductor element which has a opening on the pad, a stress cushioning layer on the layer which has the opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and the conductor protective layer on the layers, the layer and the conductor protective layer forming the respective end faces on the end surface of the semiconductor element inside the scribe line and exposing the range from the end face of the end surface to the inside of the scribe line.
摘要翻译：本发明是一种具有半导体元件的半导体器件，该半导体器件通过沿着划线在一侧形成电极焊盘切割半导体晶片而获得，半导体元件保护层在半导体元件上具有在该焊盘上的开口，应力缓冲在该焊盘上具有开口的层上的引线部分，经由开口从电极焊盘到达层的引线部分，引线部分上的外部电极和层上的导体保护层，层和导体保护层层，形成在划线内的半导体元件的端面上的各个端面，并露出从端面的端面到划线的内侧的范围。

26. 发明授权

US06933601B2 Semiconductor connection substrate 失效
标题翻译：半导体连接基板
公开(公告)号：US06933601B2
公开(公告)日：2005-08-23
申请号：US10483383
申请日：2002-07-12
申请人： Toshiya Satoh , Masahiko Ogino , Takao Miwa , Takashi Naitou , Takashi Namekawa
发明人： Toshiya Satoh , Masahiko Ogino , Takao Miwa , Takashi Naitou , Takashi Namekawa
IPC分类号： H01L23/498 , H05K1/16 , H05K3/46 , H01L23/04 , H01L23/48
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L23/49894 , H01L2924/0002 , H01L2924/12044 , H01L2924/19011 , H01L2924/3011 , H05K1/162 , H05K3/4602 , H05K2201/09509 , H05K2201/09763 , H01L2924/00
摘要： A semiconductor connection substrate which connects a semiconductor element to a mounting substrate such as a printed substrate comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.
摘要翻译：将半导体元件连接到诸如印刷基板的安装基板的半导体连接基板包括绝缘体基板，设置在绝缘体基板上的具有不同区域的多个电极，一个或多个元件，它们被选自介于电极，电感器元件和电阻器元件，连接元件的金属布线，金属布线的一部分的金属端子部分和覆盖元件的有机绝缘体材料以及除了金属端子部分之外的金属布线部分的周边。

27. 发明授权

US5508138A Fixing device for electrophotography and electrophotographic apparatus incorporating the fixing device 失效
公开(公告)号：US5508138A
公开(公告)日：1996-04-16
申请号：US313801
申请日：1994-09-28
申请人： Ryuuichi Shimizu , Tsuneaki Kawanishi , Toshiya Satoh , Teruaki Mitsuya , Takashi Suzuki
发明人： Ryuuichi Shimizu , Tsuneaki Kawanishi , Toshiya Satoh , Teruaki Mitsuya , Takashi Suzuki
IPC分类号： G03G9/087 , G03G15/20 , G03G13/20
CPC分类号： G03G15/2064 , G03G15/2053 , G03G15/2057 , G03G2215/2016 , G03G2215/2035 , G03G2215/2038
摘要： Image fixing device for use in electrophotographic apparatus, capable of suppressing gloss of fixed toner image, thus stably producing images of high quality and high level of fixing intensity over a long period of time. The fixing device has a fixing roller and a pressing roller which are contacted with each other and rotate to form therebetween a nip through which a paper supporting unfixed toner image is passed to have the toner image fixed to the paper. The fixing roller has a cylindrical core having fine irregularities formed on its surface and a surface layer made of a resin. The surface of the cylindrical core has a greater elastic modulus than that of the surface layer.

28. 发明申请

US20220274434A1 COATING DEVICE, LIQUID DISCHARGE APPARATUS, AND PRINTER 有权
公开(公告)号：US20220274434A1
公开(公告)日：2022-09-01
申请号：US17578333
申请日：2022-01-18
申请人： Jun Matsushima , Yuji Karikusa , Keisuke Yuasa , Teiichiro Ishikawa , Toshiya Satoh , Tetsuya Ohba
发明人： Jun Matsushima , Yuji Karikusa , Keisuke Yuasa , Teiichiro Ishikawa , Toshiya Satoh , Tetsuya Ohba
IPC分类号： B41M7/00
摘要： A coating device includes a coating roller configured to rotate in a rotation direction to apply a treatment liquid onto a sheet at an application position, and a contacting member in contact with a peripheral surface of the coating roller at a position downstream of the application position in the rotation direction.

29. 发明授权

US09563167B2 Image forming apparatus performing a corona products removal mode 有权
标题翻译：执行电晕产物去除模式的图像形成装置
公开(公告)号：US09563167B2
公开(公告)日：2017-02-07
申请号：US15016372
申请日：2016-02-05
申请人： Daisuke Tomita , Toshiya Satoh , Norio Kudoh , Hiroyuki Uenishi , Tomohiko Saito
发明人： Daisuke Tomita , Toshiya Satoh , Norio Kudoh , Hiroyuki Uenishi , Tomohiko Saito
IPC分类号： G03G15/00 , G03G21/00
CPC分类号： G03G21/00 , G03G21/0005 , G03G21/0035 , G03G21/203
摘要： An image forming apparatus includes an image bearer; a charger to charge a surface of the image bear; a developing device to develop a toner image on the surface of the image bearer; an image bearer cleaner to remove residual toner remaining on the surface of the image bearer after a transfer process; and a controller to cause the image forming apparatus to perform, before a start of printing operation, a corona products removal mode. In the image forming apparatus further including a temperature and humidity sensor to measure temperature and humidity of an ambient environment of the image bearer, the controller to cause the image forming apparatus to perform, before a start of an image forming operation, a corona products removal mode based on an absolute humidity obtained by the temperature and humidity detected by the temperature and humidity sensor.
摘要翻译：图像形成装置包括图像载体; 充电器对图像的表面进行充电; 显影装置，用于在图像载体的表面上显影调色剂图像; 图像载体清洁器，用于去除在传送处理之后残留在图像承载体的表面上的残留调色剂; 以及控制器，用于使图像形成装置在开始打印操作之前执行电晕产品移除模式。在还包括温度和湿度传感器以测量图像承载体的周围环境的温度和湿度的图像形成装置中，控制器使图像形成装置在图像形成操作开始之前执行电晕产物去除基于由温度和湿度传感器检测到的温度和湿度获得的绝对湿度的模式。

30. 发明授权

US09246408B2 Power conversion apparatus 有权
标题翻译：电力转换装置
公开(公告)号：US09246408B2
公开(公告)日：2016-01-26
申请号：US14122800
申请日：2012-05-22
申请人： Ken Maeda , Toshiya Satoh , Hiroyuki Yamai
发明人： Ken Maeda , Toshiya Satoh , Hiroyuki Yamai
IPC分类号： H02M7/537 , H02M7/5387 , H02M7/00 , H05K7/14
CPC分类号： H02M7/5387 , H02M7/003 , H05K7/1432
摘要： The power conversion apparatus includes an inverter circuit which converts a DC current into an AC current and have a U-phase, V-phase, and w-phase power semiconductor modules, and a capacitor module for smoothing the DC current. Each of the power semiconductor modules is configured separately and connected to a first bus bar. The first bus bar is configured with a first positive side bus bar, a first negative side bus bar, and a first insulation member arranged between the first positive side bus bar and the first negative side bus bar. The first bus bar includes a first to third terminals to which the U-phase, V-phase, and W-phase power semiconductor modules are connected, respectively, and a fourth terminal connected to a terminal of the second bus bar protruding from a surface of sealing material of a second bus bar.
摘要翻译：电力转换装置包括将DC电流转换为AC电流并具有U相，V相和w相功率半导体模块的逆变器电路以及用于平滑DC电流的电容器模块。每个功率半导体模块分别配置并连接到第一母线。第一汇流条配置有第一正侧汇流条，第一负侧汇流条和布置在第一正侧汇流条和第一负侧汇流条之间的第一绝缘构件。第一母线包括分别连接有U相，V相和W相功率半导体模块的第一至第三端子，以及连接到从表面突出的第二母线的端子的第四端子的第二母线的密封材料。

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