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    • 22. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06362514B1
    • 2002-03-26
    • US09352340
    • 1999-07-13
    • Yasuhiro IdoTakeshi IwamotoRui Toyota
    • Yasuhiro IdoTakeshi IwamotoRui Toyota
    • H01L2900
    • H01L23/5258H01L23/53228H01L2924/0002Y10S257/91H01L2924/00
    • There is described a semiconductor device having a copper fuse which prevents damage to a silicon substrate beneath the copper fuse, which would otherwise be caused by a laser beam radiated to blow the copper fuse. A light absorbing layer is formed on the copper fuse layer from material whose light absorption coefficient is greater than that of a copper wiring layer. Light absorbed by the light absorbing layer is transmitted, through heat conduction, to the copper wiring layer beneath the light absorbing layer and further to a barrier metal layer beneath the copper wiring layer. Even when the widely-used conventional laser beam of infrared wavelength is used, the copper fuse can be blown. Since a guard layer is formed below the fuse layer, there can be prevented damage to the silicon substrate, which would otherwise be caused by exposure to the laser beam of visible wavelength. Therefore, the copper fuse can be blown even by use of a laser beam of visible wavelength whose light absorption coefficient for copper is high.
    • 描述了具有铜熔丝的半导体器件,其防止对铜熔丝下方的硅衬底的损坏,否则这将由被辐射以吹制铜熔丝的激光束引起。 光吸收层由光吸收系数大于铜布线层的材料形成在铜熔丝层上。 由光吸收层吸收的光通过热传导传递到光吸收层下面的铜布线层,并且进一步传输到铜布线层下面的阻挡金属层。 即使使用广泛使用的红外波长的常规激光束,也可以熔断铜熔丝。 由于保护层形成在熔丝层的下面,所以可以防止对硅衬底的损坏,否则这将因暴露于可见波长的激光束而引起。 因此,即使通过使用铜的光吸收系数高的可见波长的激光束也能够熔断铜熔丝。
    • 23. 发明申请
    • BALL CHECK VALVE
    • 球检查阀
    • US20120048401A1
    • 2012-03-01
    • US13256350
    • 2010-03-24
    • Seiji YamashitaTakeshi Iwamoto
    • Seiji YamashitaTakeshi Iwamoto
    • F16K15/00
    • F16K15/04F16K47/02Y10T137/7904
    • A ball check valve that prevents vibration of the ball that occurs when fluids are conducted, so as to limit noise, without reducing the flow rate of the fluid includes a cylindrical valve main body having two opening parts and provided on an inner face with axially oriented elongate protrusions; a holding ring, which is held on the upstream opening part of the valve main body, abutting end faces of the elongate protrusions; a seat ring, which is disposed adjacent to or fitted with the holding ring; and a globular valve element, which is held so as to be able to reciprocate between stop faces on the elongate protrusions and a valve-closed position. When the globular valve element is abutting the stop faces of the elongate protrusions, the relationship between: the area S1 of a flow path opening formed between an outer circumferential line that is orthogonal to the axis at the center of gravity of the globular valve element and the inner circumferential face of the valve main body; and the area S2 of a flow path opening that is formed between the holding ring and the globular valve element at a line that connects the center of gravity of the globular valve element and the downstream inner circumferential line of the seat ring or the holding ring is S2=0.45 S1 to 0.65 S1.
    • 一种防止流体发生的球的振动的球止回阀,以便在不降低流体的流量的情况下限制噪音,包括具有两个开口部的圆筒形阀主体,并且设置在具有轴向定向的内表面 细长突起; 保持在阀主体的上游开口部上的保持环抵接在细长突起的端面上; 座圈,邻近或装配有固定环; 以及球形阀元件,其被保持以能够在细长突起上的止动面之间往复运动,并且具有阀关闭位置。 当球状阀元件与细长突起的止动面抵接时,形成在与球状阀元件的重心处的轴线正交的外周线之间形成的流路开口的面积S1与 阀主体的内周面; 并且在连接球状阀元件的重心与座环或保持环的下游内周线之间的线上形成在保持环和球形阀元件之间的流路开口的区域S2为 S2 = 0.45 S1〜0.65 S1。
    • 24. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07728406B2
    • 2010-06-01
    • US11584513
    • 2006-10-23
    • Yasuhiro IdoTakeshi Iwamoto
    • Yasuhiro IdoTakeshi Iwamoto
    • H01L29/00
    • H01L23/5258H01L2924/0002H01L2924/00
    • A semiconductor device of the present invention comprises: a substrate; a plurality of wiring layers formed over the substrate; a fuse formed in an uppermost one of the plurality of wiring layers; a first insulating film made up of a single film and formed on the uppermost wiring layer such that the first insulating film is in contact with a surface of the fuse; and a second insulating film formed on the first insulating film; wherein the second insulating film has an opening therein formed above a fuse region of the uppermost wiring layer such that only the first insulating film exists above the fuse region, the fuse region including the fuse and being irradiated with a laser beam when the fuse is blown.
    • 本发明的半导体器件包括:衬底; 形成在所述基板上的多个布线层; 形成在所述多个布线层的最上面的保险丝; 由单个膜构成的第一绝缘膜,形成在所述最上布线层上,使得所述第一绝缘膜与所述保险丝的表面接触; 以及形成在所述第一绝缘膜上的第二绝缘膜; 其中所述第二绝缘膜在其最上布线层的熔丝区域的上方形成有开口,使得只有所述第一绝缘膜存在于所述熔丝区域的上方,所述熔丝区域包括所述熔丝并且当所述熔丝被熔断时被照射激光束 。
    • 28. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20070102786A1
    • 2007-05-10
    • US11584513
    • 2006-10-23
    • Yasuhiro IdoTakeshi Iwamoto
    • Yasuhiro IdoTakeshi Iwamoto
    • H01L29/00
    • H01L23/5258H01L2924/0002H01L2924/00
    • A semiconductor device of the present invention comprises: a substrate; a plurality of wiring layers formed over the substrate; a fuse formed in an uppermost one of the plurality of wiring layers; a first insulating film made up of a single film and formed on the uppermost wiring layer such that the first insulating film is in contact with a surface of the fuse; and a second insulating film formed on the first insulating film; wherein the second insulating film has an opening therein formed above a fuse region of the uppermost wiring layer such that only the first insulating film exists above the fuse region, the fuse region including the fuse and being irradiated with a laser beam when the fuse is blown.
    • 本发明的半导体器件包括:衬底; 形成在所述基板上的多个布线层; 形成在所述多个布线层的最上面的保险丝; 由单个膜构成的第一绝缘膜,形成在所述最上布线层上,使得所述第一绝缘膜与所述保险丝的表面接触; 以及形成在所述第一绝缘膜上的第二绝缘膜; 其中所述第二绝缘膜在其最上布线层的熔丝区域的上方形成有开口,使得只有所述第一绝缘膜存在于所述熔丝区域的上方,所述熔丝区域包括所述熔丝并且当所述熔丝被熔断时被照射激光束 。
    • 29. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20060076642A1
    • 2006-04-13
    • US11237772
    • 2005-09-29
    • Yasuhiro IdoTakeshi Iwamoto
    • Yasuhiro IdoTakeshi Iwamoto
    • H01L29/00
    • H01L23/53238H01L23/5258H01L2924/0002H01L2924/00
    • The present invention provides a semiconductor device comprising: a substrate; a first insulating film formed on a principal surface of the substrate; a second insulating film formed on the first insulating film; a plurality of fuses formed on the second insulating film; and a blocking layer disposed in the first and second insulating films, the blocking layer being formed of a material capable of reflecting laser light irradiated to blow the plurality of fuses. The blocking layer overlaps a region in which the plurality of fuses are formed when viewed from the principal surface of the substrate. The plurality of fuses may be each formed in two or more insulating film layers laminated to one another on the second insulating film.
    • 本发明提供一种半导体器件,包括:衬底; 形成在所述基板的主表面上的第一绝缘膜; 形成在所述第一绝缘膜上的第二绝缘膜; 形成在所述第二绝缘膜上的多个保险丝; 以及设置在所述第一和第二绝缘膜中的阻挡层,所述阻挡层由能够反射照射以吹动所述多个保险丝的激光的材料形成。 当从基板的主表面观察时,阻挡层与形成有多个熔丝的区域重叠。 多个保险丝可以分别形成在第二绝缘膜上彼此层压的两个或更多个绝缘膜层中。