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21. 发明申请

US20120049882A1 SEMICONDUCTOR APPARATUS, INSPECTION METHOD THEREOF AND ELECTRIC DEVICE 有权
标题翻译：半导体设备及其检测方法及电气设备
公开(公告)号：US20120049882A1
公开(公告)日：2012-03-01
申请号：US13221007
申请日：2011-08-30
申请人： Masayuki OHTA , Masaki Tatsumi , Yoshiki Sota , Kazuo Tamaki , Shinji Yamaguchi , Masamichi Harada , Shin Ito , Tomoshi Kimura , Yoshifumi Inada
发明人： Masayuki OHTA , Masaki Tatsumi , Yoshiki Sota , Kazuo Tamaki , Shinji Yamaguchi , Masamichi Harada , Shin Ito , Tomoshi Kimura , Yoshifumi Inada
IPC分类号： H01L33/52 , G01R31/26
CPC分类号： H01L24/97 , H01L23/49827 , H01L24/32 , H01L24/48 , H01L24/73 , H01L33/62 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor apparatus according to the present invention with a semiconductor element implemented on an insulated substrate comprises: a substrate front surface electrode formed on a front surface side of the insulated substrate and connected with an element electrode of the semiconductor element; a substrate back surface electrode formed on a back surface side of the insulated substrate and electrically connected with the substrate front surface electrode; and a plurality of connection electrodes, extending in a thickness direction of the insulated substrate from one side to the other side of a front surface and a back surface thereof, for electrically connecting the substrate front surface electrode with the substrate back surface electrode, where the substrate front surface electrode or the substrate back surface electrode is formed to have a plane pattern separated for each of the plurality of connection electrodes.
摘要翻译：根据本发明的半导体器件具有实施在绝缘基板上的半导体元件，包括：基板前表面电极，形成在绝缘基板的前表面侧并与半导体元件的元件电极连接; 基板背面电极，其形成在所述绝缘基板的背面侧并与所述基板正面电极电连接; 以及多个连接电极，其在绝缘基板的厚度方向上从前表面和后表面的一侧延伸到另一侧，用于将基板正面电极与基板背面电极电连接，其中基板前表面电极或基板背面电极被形成为具有为多个连接电极中的每一个分开的平面图案。

22. 发明授权

US07741725B2 Semiconductor apparatus and method of producing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07741725B2
公开(公告)日：2010-06-22
申请号：US11854192
申请日：2007-09-12
申请人： Kazuo Tamaki
发明人： Kazuo Tamaki
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L21/561 , H01L24/45 , H01L24/48 , H01L24/97 , H01L25/105 , H01L2224/16 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/0401
摘要： With a semiconductor apparatus package of example embodiments of the technology disclosed herein and a method of producing the semiconductor apparatus package, the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin. The circuit board has a groove in a section of a surface of the circuit board. The section is outside of the resin sealing section, and the surface includes the resin sealing section. The groove is at least partially filled with sealing resin having seeped from a resin sealing section. Thus, in the semiconductor apparatus package including the circuit board, which is exposed from the resin sealing section, and the semiconductor device sealed on the circuit board with the sealing resin, the spread of a thin resin film onto that exposed circuit board resulting from seepage of resin sealing the semiconductor device is prevented.
摘要翻译：利用本文公开的技术的示例性实施例的半导体器件封装和半导体器件封装的制造方法，半导体器件封装包括电路板和用密封树脂密封的半导体器件。电路板在电路板的表面的一部分具有凹槽。该部分在树脂密封部分的外侧，表面包括树脂密封部分。凹槽至少部分地填充有从树脂密封部分渗出的密封树脂。因此，在由树脂密封部露出的电路基板和利用密封树脂密封在电路基板上的半导体装置的半导体装置封装中，由于渗漏而使薄树脂膜扩散到暴露的电路板上防止了半导体器件的树脂密封。

23. 发明申请

US20070252272A1 Bump structure, method of forming bump structure, and semiconductor apparatus using the same 失效
标题翻译：凸起结构，凸块结构的形成方法以及使用其的半导体装置
公开(公告)号：US20070252272A1
公开(公告)日：2007-11-01
申请号：US11790143
申请日：2007-04-24
申请人： Yuji Yano , Kazuo Tamaki
发明人： Yuji Yano , Kazuo Tamaki
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H01L24/78 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13012 , H01L2224/13016 , H01L2224/13017 , H01L2224/13099 , H01L2224/16106 , H01L2224/2919 , H01L2224/4809 , H01L2224/78301 , H01L2224/83851 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/00012 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A bump structure includes a squashed ball provided on an electrode pad, and a wire provided on the squashed ball. The wire is a wire loop that is loop-shaped and is formed so as to protrude from an end part of the squashed ball. This provides high bonding reliability between a bonding pad and the bump structure.
摘要翻译：凸起结构包括设置在电极垫上的挤压球，以及设置在挤压球上的线。导线是环形的线环，并且形成为从压扁球的端部突出。这在焊盘和凸块结构之间提供了高的焊接可靠性。

24. 发明授权

US4120928A Production of biaxially stretched film of polyamide blend 失效
标题翻译：生产聚酰胺共混物的双轴拉伸薄膜
公开(公告)号：US4120928A
公开(公告)日：1978-10-17
申请号：US788047
申请日：1977-04-15
申请人： Kaoru Furukawa , Koichi Matsunami , Toshihiko Ota , Tetsushi Murakami , Hiroshi Nagai , Kazuo Tamaki
发明人： Kaoru Furukawa , Koichi Matsunami , Toshihiko Ota , Tetsushi Murakami , Hiroshi Nagai , Kazuo Tamaki
IPC分类号： B29C47/00 , B29D7/24
CPC分类号： B29C47/0004 , B29C47/0021 , B29C47/0057 , B29K2077/00 , B29K2995/0072 , B29L2007/00
摘要： A process for preparing a biaxially stretched film of a polyamide blend, which comprises (1) melt extruding a polyamide blend to make an unstretched film and (2) stretching the unstretched film first in the machine direction and then in the transverse direction, or (2') stretching the unstretched film first to make a uniaxially stretched film having a plane orientation index of about 0.6 to 1.7 and then stretching the uniaxially stretched film in a direction substantially at a right angle to the direction at the previous stretching, said polyamide blend comprising 97 to 80% by weight of an .alpha.-type aliphatic polyamide (Component A) and 3 to 20% by weight of at least one polyamide (Component B) selected from the group consisting of (i) an .alpha.-type aliphatic polyamide different from the Component A, (ii) a .gamma.-type aliphatic polyamide, (iii) a non-crystalline aliphatic polyamide, and (iv) a ring-containing polyamide which contains in the molecule 0 to 50 mol % of repeating units comprising a xylylenediamine residue.
摘要翻译：一种制备聚酰胺共混物的双轴拉伸膜的方法，其包括（1）熔融挤出聚酰胺共混物以制备未拉伸膜和（2）首先在纵向然后沿横向拉伸未拉伸膜，或（ 2'）首先拉伸未拉伸薄膜以制备平面取向指数为约0.6至1.7的单轴拉伸薄膜，然后在与先前拉伸方向基本成直角的方向上拉伸单轴拉伸薄膜，所述聚酰胺共混物包含97至80重量％的α型脂族聚酰胺（组分A）和3至20重量％的至少一种聚酰胺（组分B），其选自（i）不同于（ii）γ型脂肪族聚酰胺，（iii）非结晶性脂肪族聚酰胺，和（iv）含有分子内的聚酰胺，其含有0〜50摩尔％的重复单元包括苯二甲胺残基。

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