专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20060208255A1 Stressed organic semiconductor 审中-公开
标题翻译：强调有机半导体
公开(公告)号：US20060208255A1
公开(公告)日：2006-09-21
申请号：US11439935
申请日：2006-05-24
申请人： Klyotaka Mori , Daniel Hogan
发明人： Klyotaka Mori , Daniel Hogan
IPC分类号： H01L29/08
CPC分类号： H01L51/0096 , H01L51/0012 , H01L51/0508 , H01L51/0575 , Y02E10/549 , Y02P70/521
摘要： A semiconductor device and method of manufacturing the semiconductor device. The semiconductor device includes: a substrate; an organic semiconductor material coupled to the substrate at an interface therebetween; and an actuator provided for use with the substrate and/or the organic semiconductor. The actuator applies a mechanical force to the substrate and/or the organic semiconductor with which it is used when it is actuated. This mechanical force varies the carrier mobility of the organic semiconductor. The actuator is selected from the group comprising: piezoelectric actuators; piezomagnetic actuators; electrostrictive actuators; magnetostrictive actuators; electrostatic actuators; magnetostatic actuators; shape memory alloy actuators; magnetic shape memory alloy actuators; and electroactive polymer actuators.
摘要翻译：半导体器件及其制造方法。半导体器件包括：衬底; 在它们之间的界面处耦合到所述衬底的有机半导体材料; 以及与基板和/或有机半导体一起使用的致动器。致动器在其被致动时对其使用的衬底和/或有机半导体施加机械力。该机械力改变有机半导体的载流子迁移率。致动器从包括：压电致动器的组中选择; 压电致动器; 电致伸缩执行器; 磁致伸缩致动器; 静电执行器; 静磁致动器; 形状记忆合金致动器; 磁形记忆合金致动器; 和电活性聚合物致动器。

22. 发明授权

US07040130B2 Method and apparatus for forming discrete microcavities in a filament wire using microparticles 有权
标题翻译：使用微粒在丝线中形成离散微腔的方法和装置
公开(公告)号：US07040130B2
公开(公告)日：2006-05-09
申请号：US10685262
申请日：2003-10-14
申请人： Xinbing Liu , Ming Li , Makoto Ishizuka , Daniel Hogan , Kazuaki Ohkubo , Mitsuhiko Kimoto
发明人： Xinbing Liu , Ming Li , Makoto Ishizuka , Daniel Hogan , Kazuaki Ohkubo , Mitsuhiko Kimoto
IPC分类号： B21J1/00 , B24C11/00
CPC分类号： B21F99/00 , B21C37/045 , B21F45/00 , B24C1/10 , B24C3/12
摘要： A microcavity forming device is provided for making microcavities in a tungsten wire. The microcavity forming device includes a source of particles; a housing for receiving a heated tungsten wire; and a plurality of jet nozzles disposed in the housing for spraying the particles toward the heated tungsten wire. The particles are 0.35–0.75 micron in diameter. The heated tungsten wire is received in the housing and the jet nozzles spray the particles toward the tungsten wire to form the microcavities in the tungsten wire.
摘要翻译：提供了一种用于在钨丝中制造微腔的微腔形成装置。微腔形成装置包括颗粒源; 用于接收加热的钨丝的外壳; 以及设置在壳体中的多个喷嘴，用于将颗粒喷射到加热的钨丝上。颗粒直径为0.35-0.75微米。加热的钨丝被容纳在壳体中，喷嘴将颗粒喷射到钨丝上以形成钨丝中的微腔。

23. 发明申请

US20050076689A1 Method and apparatus for forming discrete microcavities in a filament wire using microparticles 有权
标题翻译：使用微粒在丝线中形成离散微腔的方法和装置
公开(公告)号：US20050076689A1
公开(公告)日：2005-04-14
申请号：US10685262
申请日：2003-10-14
申请人： Xinbing Liu , Ming Li , Makoto Ishizuka , Daniel Hogan , Kazuaki Ohkubo , Mitsuhiko Kimoto
发明人： Xinbing Liu , Ming Li , Makoto Ishizuka , Daniel Hogan , Kazuaki Ohkubo , Mitsuhiko Kimoto
IPC分类号： H01K1/14 , B21C37/04 , B21F45/00 , B21F99/00 , B24C1/10 , B24C3/12 , H01K3/02 , H01K3/04 , B21J1/00
CPC分类号： B21F99/00 , B21C37/045 , B21F45/00 , B24C1/10 , B24C3/12
摘要： A microcavity forming device is provided for making microcavities in a tungsten wire. The microcavity forming device includes a source of particles; a housing for receiving a heated tungsten wire; and a plurality of jet nozzles disposed in the housing for spraying the particles toward the heated tungsten wire. The particles are 0.35-0.75 micron in diameter. The heated tungsten wire is received in the housing and the jet nozzles spray the particles toward the tungsten wire to form the microcavities in the tungsten wire.
摘要翻译：提供了一种用于在钨丝中制造微腔的微腔形成装置。微腔形成装置包括颗粒源; 用于接收加热的钨丝的外壳; 以及设置在壳体中的多个喷嘴，用于将颗粒喷射到加热的钨丝上。颗粒直径为0.35-0.75微米。加热的钨丝被容纳在壳体中，喷嘴将颗粒喷射到钨丝上以形成钨丝中的微腔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式