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21. 发明专利

JP2007124201A Antenna module 审中-公开
标题翻译：天线模块
公开(公告)号：JP2007124201A
公开(公告)日：2007-05-17
申请号：JP2005312578
申请日：2005-10-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： H01Q13/08 , H01Q1/24 , H01Q21/08
摘要： PROBLEM TO BE SOLVED: To provide an antenna module capable of suppressing radiation spurious electromagnetic waves caused by a surface wave, thereby reducing distortion in a radiation pattern.
SOLUTION: The antenna module is characterized in such that radiation elements (patches 12) are provided to the surface or the inside of an insulation board 11 and an antenna board 1 wherein the surface of surrounding parts of the insulation board 11 is tilted to the rear side toward ends is mounted on a module board 2.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够抑制由表面波引起的辐射杂散电磁波的天线模块，从而减少辐射图形的变形。解决方案：天线模块的特征在于，辐射元件（贴片12）设置在绝缘板11和绝缘板11的周围部分的表面倾斜的绝缘板11和天线板1的表面或内部到后端朝向端部安装在模块板2上。版权所有（C）2007，JPO＆INPIT

22. 发明专利

JP2006067375A Antenna module 审中-公开
标题翻译：天线模块
公开(公告)号：JP2006067375A
公开(公告)日：2006-03-09
申请号：JP2004249079
申请日：2004-08-27
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： H01Q23/00 , H01Q19/06
CPC分类号： H01L2223/6616 , H01L2223/6627 , H01L2223/6677 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H01L2924/15192 , H01L2924/15321 , H01L2924/16195
摘要： PROBLEM TO BE SOLVED: To provide an antenna module with an excellent antenna characteristic wherein crosstalks between wires and malfunction of circuits are reduced, by reducing the effect of the generation of spurious radiation on the antenna module. SOLUTION: The antenna module is provided with an antenna board 3 wherein one side or inside of an insulation board is provided with a single or a plurality of antenna elements 6, and the other side of the insulation board is mounted with a semiconductor element connected to the antenna elements 6; and a module board 4 mounted with the antenna board 3, and a frequency f 0 differs from the frequency f 1 , in particular, the relation 0.5×f 0 ≥f 1 holds between the f 0 and f 1 , wherein f 0 is the frequency of the signal emitted from or received by the antenna elements 6, and f 1 is the highest frequency of the signal communicated between the antenna board 3 and the module board 4. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过减少对天线模块产生杂散辐射的影响，提供具有优异的天线特性的天线模块，其中线路之间的串扰和电路的故障被减少。解决方案：天线模块设置有天线板3，其中绝缘板的一侧或内侧设置有单个或多个天线元件6，并且绝缘板的另一侧安装有半导体连接到天线元件6的元件; 和安装有天线板3的模块板4和频率f 0 不同于频率f 1 ，特别是关系0.5×f 0 ≥f 1 保持在f 0 和f 1 之间，其中f 0 由天线元件6发射或接收的信号，以及f 1 是在天线板3和模块板4之间传递的信号的最高频率。版权所有（C） 2006年，JPO＆NCIPI

23. 发明专利

JP2006042006A Antenna module 审中-公开
标题翻译：天线模块
公开(公告)号：JP2006042006A
公开(公告)日：2006-02-09
申请号：JP2004220056
申请日：2004-07-28
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI
IPC分类号： H01Q13/08 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To provide an antenna module excellent in antenna radiation characteristic and capable of preventing interference between wiring and the malfunction of a circuit at a low cost.
SOLUTION: The antenna module is configured in such a way that an antenna element and a semiconductor substrate are mounted on one surface or in a dielectric substrate on the surface of a module substrate. In this antenna module, an H value expressed by H=(B-C)/(A-D) is set at 0.5 or more, where a total area within a circle having a radius of r+2λ from the center is A where the longest distance from the center of an antenna element group to the end of the substrate is r and a signal wavelength is λ; a total area of a conductive pattern formed in an inner side region of a circle having a radius of r+2λ from the center out of the conductive pattern of the module substrate surface is B when viewing from the top surface of the antenna substrate; the total area of a portion overlapping the antenna pattern is C when viewing the portion where the antenna substrate is mounted from the top surface out of the conductive patterns of the module; and an area when viewing from the top surface of the antenna substrate is D.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供天线辐射特性优异的天线模块，并且能够以低成本防止布线与电路故障之间的干扰。解决方案：天线模块被配置成使得天线元件和半导体衬底被安装在模块衬底的表面上的一个表面上或电介质衬底中。在该天线模块中，由H =（BC）/（AD）表示的H值设定为0.5以上，其中，具有距离中心的半径为r +2λ的圆内的总面积为A，其中，天线元件组至基片末端的中心为r，信号波长为λ; 当从天线基板的顶表面观察时，形成在从模块基板表面的导电图案的中心以外的半径为r +2λ的圆的内侧区域中的导电图案的总面积为B; 当从模块的导电图案中的顶表面观察安装有天线基板的部分时，与天线图案重叠的部分的总面积为C; 并且从天线基板的顶面观察的区域为D.版权所有（C）2006，JPO＆NCIPI

24. 发明专利

JP2005101995A Wideband antenna 有权
标题翻译：宽带天线
公开(公告)号：JP2005101995A
公开(公告)日：2005-04-14
申请号：JP2003334389
申请日：2003-09-25
申请人： Kyocera Corp , 京セラ株式会社
发明人： UCHIMURA HIROSHI , SHINO NAOYUKI
IPC分类号： H01Q1/36 , H01Q9/38 , H01Q9/40
摘要： PROBLEM TO BE SOLVED: To provide a wideband antenna which is reduced in size and weight in comparison with a conventional discone antenna while maintaining an input impedance.
SOLUTION: The antenna is provided with a cone whose top is composed of a supply point, a radiating conductor composed of a structure which is formed by sequentially adhering and integrating m (m≥1) pieces of truncated cones and/or cylindrical objects to the bottom of the cone and a flat conductor including the supply point in the radiating conductor. Alternatively, the wideband antenna is provided with an n-angular pyramid (n≥3) whose top is composed of a supply point, a radiating conductor composed of a structure which is formed by sequentially adhering and integrating m (m≥1) pieces of frustums of n-angular pyramid and/or n-angular prisms to the bottom of the n-angular pyramid and a flat conductor including the supply point in the radiating conductor.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种与传统的discone天线相比尺寸和重量减小的宽带天线，同时保持输入阻抗。解决方案：天线设有锥体，其顶部由供电点组成，辐射导体由通过依次粘合和整合m（m≥1）个截顶锥体和/或圆柱形的结构而形成的结构物体到锥体的底部以及包括辐射导体中的供应点的扁平导体。或者，宽带天线设置有顶角由供电点构成的n角金字塔（n≥3），由通过顺序地粘合并整合m（m≥1）个片段而形成的结构构成的辐射导体 n角锥体的平头锥体和/或n角棱镜到n角锥体的底部，以及包括辐射导体中的供应点的扁平导体。版权所有（C）2005，JPO＆NCIPI

25. 发明专利

JP2004357042A Connection structure between dielectric waveguide line and waveguide, as well as antenna substrate and filter substrate using its structure 有权
公开(公告)号：JP2004357042A
公开(公告)日：2004-12-16
申请号：JP2003153190
申请日：2003-05-29
申请人： Kyocera Corp , 京セラ株式会社
发明人： SHINO NAOYUKI , UCHIMURA HIROSHI
IPC分类号： H01P1/04 , H01P3/12 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To provide a connection structure which can connect a dielectric waveguide line of a lamination type formed within a dielectric substrate and a square waveguide by reducing a reflection of a high frequency signal, with a low loss, and almost at the right angle.
SOLUTION: A dielectric waveguide line 6 having a pair of conductor layers 2 and 3 formed at both sides of an dielectric substrate and two rows of through-conductor group 4 formed by electrically connecting between the conductor layers 2 and 3 at repeated intervals of less than half of a signal wavelength in a direction of transmission of a high frequency signal, and a predetermined width in an orthogonal direction to the transmission direction is provided. A combining window 7 is provided to one of the pair of conductor layers 2 and 3, and a square metal waveguide 8 whose opening end faces are opposed is connected to the combining window 7 through a dielectric layer 16 so that a transmission direction of the high frequency signal may be different.
COPYRIGHT: (C)2005,JPO&NCIPI

26. 发明专利

JP2002050733A PACKAGE FOR HIGH FREQUENCY, WIRING BOARD, AND HIGH- FREQUENCY MODULE 失效
公开(公告)号：JP2002050733A
公开(公告)日：2002-02-15
申请号：JP2000231742
申请日：2000-07-31
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , KITAZAWA KENJI , SHINO NAOYUKI , NANJIYOU HIDEHIRO
IPC分类号： H05K1/18 , H01L23/02 , H01L23/12 , H01L23/52 , H01L25/00 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency module having a superior isolation characteristic, where packages, each housing a high-frequency element, are mounted on a wiring board. SOLUTION: A high-frequency module (A) is housed in a package (b) for high-frequency; the package (b) is provided on the surface of a wiring board (a), comprising a dielectric board and forming a circuitry layer 17 thereon for mounting high-frequency elements 2 to 6; and the package (b) is mounted onto the wiring board (a) by connecting the circuitry layer 17 to an input terminal 12a and an output terminal 12b to constitute the module (A). The module A is divided into a plurality of high-frequency blocks by a division boundary line L, which is so set as to cross between an input terminal 12a and an output terminal 12b of at least one package b1 for high-frequency packaged on the wiring board (a).

27. 发明专利

JP2002016408A WIRING BOARD AND STRUCTURE FOR CONNECTION WITH WAVEGUIDE THEREOF 失效
公开(公告)号：JP2002016408A
公开(公告)日：2002-01-18
申请号：JP2000197262
申请日：2000-06-29
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , KITAZAWA KENJI , KORIYAMA SHINICHI
IPC分类号： H01L23/12 , H01P5/107
摘要： PROBLEM TO BE SOLVED: To connect a wiring board, with which the dispersion of a conversion loss between a signal transmission line and a waveguide can be reduced efficiently with a low reflection, the degree of freedom in the wiring design of the wiring board is improved and further, the strength of the board can be improved, and the waveguide. SOLUTION: The wiring board is provided with a dielectric substrate 1, a signal transmission line 5 formed on one surface of the dielectric substrate 1 and a converting part for connecting the signal transmission line 5 and a waveguide B1. A ground layer 7 where the converting part is formed on the other surface of the dielectric substrate 1 and a slot hole 6 is formed at a position facing a terminal 5a of the signal transmission line 5, a first dielectric layer 10 having a dielectric area 9 formed on the surface where the slot hole 6 is formed on the ground layer 7 and a second dielectric layer 13 having a void part 12 just under the dielectric area 9 are laminated and the waveguide B1 is connected and fixed through this second dielectric layer 13 or a metal member 19.

28. 发明专利

JP2001284916A WIRING BOARD AND STRUCTURE FOR CONNECTION WITH WAVEGUIDE THEREFOR 失效
公开(公告)号：JP2001284916A
公开(公告)日：2001-10-12
申请号：JP2000092191
申请日：2000-03-29
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , NANJIYOU HIDEHIRO , KITAZAWA KENJI , KORIYAMA SHINICHI
IPC分类号： H01L23/12 , H01P5/02 , H01P5/107
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, which facilitates production and is capable of air-tight sealing, capable of connecting a signal transmission line and a waveguide formed on the surface of a dielectric substrate with low loss. SOLUTION: Concerning the wiring board, with which a signal transmission line 5 formed on the surface of a dielectric substrate 1 can be connected with a waveguide B through a slot hole 6 electromagnetically coupled with the signal transmission line 5, provided with the dielectric substrate 1, the signal transmission line 5 and a ground layer 7 formed inside or on the other surface of the dielectric substrate 1 lower than the signal transmission line 5 and constituted by forming the slot hole 6, a resonance conductor 9 to be resonated with the signal transmission line 5 is provided at a position within the same plane as the signal transmission line 5 on the dielectric substrate 1 at the coupling part of the signal transmission line 5 and the slot hole 6 or upper than the signal transmission line 5 and axial symmetrical to the signal transmission line 5.

29. 发明专利

JP2001144512A WIRING BOARD AND ITS CONNECTION STRUCTURE WITH WAVEGUIDE 失效
公开(公告)号：JP2001144512A
公开(公告)日：2001-05-25
申请号：JP31997499
申请日：1999-11-10
申请人： KYOCERA CORP
发明人： SHINO NAOYUKI , KORIYAMA SHINICHI , KITAZAWA KENJI , NANJIYOU HIDEHIRO
IPC分类号： H01L23/12 , H01L23/02 , H01P5/107
摘要： PROBLEM TO BE SOLVED: To provide a wiring board that can connect a signal transmission line formed with a front side of the wiring board to a waveguide at a low loss and a low reflectance and its connection structure with the waveguide. SOLUTION: The wiring board for a package is provided with a dielectric board 1, a signal transmission line 5 formed on one front side of the dielectric board 1 and a connection part o connect the signal transmission line 5 and a waveguide B1, and the connection part is formed on the other side of the dielectric board 1. A ground layer 7 having a slot hole 6 formed at a position opposed to a termination 5a of the signal transmission line 5 is formed on the dielectric board 1. A signal excitation patch conductor 10 is provided on the surface of the ground layer 7 on which the slot hole 6 is formed via a 1st dielectric part 9 and a 2nd dielectric part 11 is formed on the surface of the patch conductor 10.

30. 发明专利

JPH09165255A COLORED ALUMINA SINTERED PRODUCT AND ITS PRODUCTION 失效
公开(公告)号：JPH09165255A
公开(公告)日：1997-06-24
申请号：JP32468395
申请日：1995-12-13
申请人： KYOCERA CORP
发明人： HAYASHI KATSURA , SHINO NAOYUKI , ARIKAWA HIDEHIRO
IPC分类号： C04B35/111 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a colored alumina sintered product having excellent electric characteristics for circuit substrates and LSI packages in high frequency regions and exhibiting a back-based color. SOLUTION: A molded product comprising Nb or a Nb compound in an amount of 0.05-5wt.% converted to their oxides, Cr or a Cr compound in an amount of 0-5wt.% converted to their oxides and Al2 O3 in the remaining amount is sintered in a reducing atmosphere to obtain the sintered product comprising Nb in an amount of 0.05-5wt.% converted to the oxide, Cr in an amount of 0-5wt.%, and Al2 O3 and inevitable impurities in the remaining amount.

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