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21. 发明专利

AU2003223079A1 METHOD SUITABLE FOR TRANSFERRING A COMPONENT SUPPORTED BY A CARRIER TO A DESIRED POSITION ON A SUBSTRATE, AND A DEVICE DESIGNED FOR THIS 未知
公开(公告)号：AU2003223079A1
公开(公告)日：2003-12-12
申请号：AU2003223079
申请日：2003-05-08
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： BOSMAN JOHAN , HOVING WILLEM , SANDERS RENATUS H M , WEEKAMP JOHANNUS W , SAMBER MARC A DE
IPC分类号： H05K13/04
摘要： A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

22. 发明专利

AU2003214524A1 METHOD OF MANUFACTURING AN ELECTRONIC DEVICE 未知
公开(公告)号：AU2003214524A1
公开(公告)日：2003-10-20
申请号：AU2003214524
申请日：2003-04-10
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： WEEKAMP JOHANNUS W
IPC分类号： H01L23/12 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/538 , H01L25/00
摘要： A semiconductor device ( 100 ) comprising a semiconductor substrate ( 20 ) and a functional element ( 31 ), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the functional element ( 31 ) is-at least partially-present in a conductive patterned layer that is mechanically embedded in isolating material ( 40 ) and that is connected to the substrate ( 20 ) through connection means. In this way, electrical losses through the substrate ( 20 ) are substantially reduced. The device ( 100 ) is provided in that a foil comprising the patterned layer and a carrier layer is applied to the substrate ( 20 ), after which the space between them is filled with the isolating material ( 40 ) and the carrier layer is removed.

23. 发明专利

DE60333364D1 VERFAHREN ZUR ÜBERTRAGUNG VON EINEM AN EINEN TRÄGER BEFESTIGTEN BAUELEMENT IN EINE GEWÜNSCHTE LAGE AUF EINEN TRÄGER UND EINRICHTUNG DAFUR 未知
公开(公告)号：DE60333364D1
公开(公告)日：2010-08-26
申请号：DE60333364
申请日：2003-05-08
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： WEEKAMP JOHANNUS W , DE SAMBER MARC A , BOSMAN JOHAN , HOVING WILLEM , SANDERS RENATUS H
IPC分类号： H05K13/04

24. 发明专利

AU2003282843A1 DEVICE FOR MOBILE IMAGE COMMUNICATION 未知
公开(公告)号：AU2003282843A1
公开(公告)日：2004-02-25
申请号：AU2003282843
申请日：2003-07-01
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： WEEKAMP JOHANNUS W , VERWEG FRANSISCUS G C
IPC分类号： H04M1/00 , H04M1/02 , H04M1/04 , H04M1/21 , H04N5/225
摘要： The device for mobile communication comprises a first and a second camera ( 41, 42 ), which are faced towards opposite sides of the device ( 2 A, 2 C). The cameras ( 41, 42 ) each comprise an optical lens ( 40 ) and a photosensitive semiconductor device ( 30 ). The lens ( 40 ) and the semiconductor device ( 30 ) are assembled together with a carrier body ( 2 ) which is provided with an aperture ( 20 ) between the lens ( 40 ) and the semiconductor device ( 30 ). The carrier body ( 2 ) is preferably provided with a pattern of conductive tracks ( 1 ) which extends from a first side ( 2 A) to an opposite side ( 2 C) of the body. The two cameras may have the same carrier body ( 2 ). The device for mobile communication further comprises a display, means for switching either one of the cameras and the projection of images thereof on the display on or off, as well as means for standing the device on a surface.

25. 发明专利

AU2003239739A1 MULTI ELECTRIC DEVICE PACKAGE 未知
公开(公告)号：AU2003239739A1
公开(公告)日：2004-01-23
申请号：AU2003239739
申请日：2003-06-24
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： GISPEN WICHER I-J , LENOIR PETRUS J , WEEKAMP JOHANNUS W
IPC分类号： H01L25/065 , H01L25/10 , H05K1/14 , H05K1/18 , H05K3/34

26. 发明专利

AU2003214578A1 METHOD OF MANUFACTURING AN ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 未知
公开(公告)号：AU2003214578A1
公开(公告)日：2003-10-20
申请号：AU2003214578
申请日：2003-04-08
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： WEEKAMP JOHANNUS W , VEEN NICOLAAS J A VAN
IPC分类号： H01L23/12 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/538
摘要： The invention relates to a method of manufacturing a semiconductor device ( 10 ), whereby an electric element ( 11 ) is attached on or above a carrier plate ( 4 ) which comprises a first layer ( 5 ) of a first material and a second layer ( 2 ) of a second material which differs from the first, which is electrically conducting, which has a smaller thickness than the first layer ( 5 ), and in which a cavity ( 6 ) is formed that extends at least to the first layer ( 5 ). The element ( 11 ) is electrically connected to parts ( 2 ) of the carrier plate ( 4 ) at first connection regions ( 1 ), and an encapsulation is deposited around the element ( 11 ) and in the cavity ( 6 ). Then so much of the first layer ( 5 ) of the carrier plate ( 4 ) is removed that the cavity ( 6 ) is reached, whereby second connection conductors ( 2 ) are formed from the remaining portion of the carrier plate ( 4 ). According to the invention, at least one further cavity ( 7 ) is formed in a portion of the carrier plate ( 4 ) surrounded by the cavity ( 6 ) before the encapsulation ( 3 ) is deposited, which further cavity ( 7 ) becomes at least substantially filled with a portion of the encapsulation ( 3 ) during the deposition thereof and, within the second connection regions ( 2 ), separates a portion ( 2 A) thereof from the remaining portion ( 2 B) thereof, the smallest dimension of the portion ( 2 A) being chosen to be smaller than the smallest dimension of the remaining portion ( 2 B) of each second connection region ( 2 ). The portion ( 2 A) may thus be readily provided with solder ( 8 A) having a smaller thickness than the solder ( 8 B) in the remaining portion of the second connection region ( 2 ). This is an advantage, for example in the case of surface mounting of the device ( 10 ). Preferably, the first connection regions ( 1 ) are connected to the portion ( 2 A) of the connection region ( 2 ).

27. 发明专利

DE602005007599D1 未知
公开(公告)号：DE602005007599D1
公开(公告)日：2008-07-31
申请号：DE602005007599
申请日：2005-05-04
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： KUIPER STEIN , HENDRIKS BERNARDUS H , WEEKAMP JOHANNUS W
IPC分类号： G02B26/02 , G02B3/14
摘要： The electrowetting cel ( 15 ) that is primarily to be used as a variable focus lens, comprises a liquid chamber ( 50 ) containing a first and a second immiscible fluid ( 51, 52 ), which are in contact across a meniscus ( 14 ) and of which the first fluid ( 51 ) is a polar and the second ( 52 ) is electrically conductive. The liquid chamber ( 50 ) is provided with an inner face ( 18 ), at which a fluid contact layer ( 10 ) is present, which has an inherent attraction to the first liquid. An electrode is separated from the liquid chamber ( 50 ) through this fluid contact layer ( 10 ). The fluid chamber ( 50 ) is constructed such that it has a small diameter at an operating point ( 101 ) at the inner face ( 18 ) than at a point of tangency ( 102 ), while a tangent (R 1 ) to the operating point ( 101 ) encloses a smaller angle with the optical axis (OA) of the cell ( 15 ) than a tangent (R 2 ) to the second point ( 102 ). This results in the fact that the meniscus ( 14 ) that touches the inner wall ( 18 ) at the second point ( 102 ) is oriented towards the optical axis and that the cell ( 15 ) can have a low construction height.

28. 发明专利

AU2003292484A8 Electronic device and method of manufacturing a substrate 未知
公开(公告)号：AU2003292484A8
公开(公告)日：2004-08-10
申请号：AU2003292484
申请日：2003-12-10
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： SAMBER MARC A DE , WEEKAMP JOHANNUS W , ARENDONK ANTON P M VAN , VEEN NICOLAAS J A VAN
IPC分类号： H01L23/14 , H01L23/498 , H01L23/373
摘要： Provided is an electronic device (1) with a semiconductor element (5) and a substrate (3) of a material chosen from the group of AlSi, AlSiC, AlSiGe and the like. These materials are provided by providing preferably crystalline particles of a semiconductor material in a thermally conducting matrix material, after which the material is adequately strengthened by a heat treatment. The semiconductor element (5) is a digital integrated circuit with a large number of first contact pad (32) by preference. In such applications, thermal mismatch can easily lead to breakdown of the packaged device. This is prevented through the use of the substrate (3) of the invention.

29. 发明专利

AU2003292462A1 ELECTRONIC DEVICE AND USE THEREOF 未知
公开(公告)号：AU2003292462A1
公开(公告)日：2004-07-14
申请号：AU2003292462
申请日：2003-12-22
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： ROTARU MIHAI D , WEEKAMP JOHANNUS W
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L23/64 , H01L23/66
摘要： The electronic device ( 100 ) comprises a semiconductor element ( 1 ) (e.g. a transistor), an encapsulation ( 5 ) and an electrically conductive layer ( 3 ) with a first and a second contact pad ( 11,12 ), used as signal pads, and a third contact pad ( 13 ) used as ground pads. Due to the shape of the contact pads ( 11,12,13 ), the spacing ( 200 ) is continuous, with a small entrance in between of the first and second contact pads ( 11,12 ). Consequently, the parasitic inductance is reduced and the device ( 100 ) is suitable for use at frequencies below and above 30 GHz, particularly up to 40 GHz.

30. 发明专利

AU2003219352A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME 未知
公开(公告)号：AU2003219352A1
公开(公告)日：2003-10-20
申请号：AU2003219352
申请日：2003-04-11
申请人： KONINKL PHILIPS ELECTRONICS NV
发明人： SAMBER MARC A DE , WEEKAMP JOHANNUS W
IPC分类号： H01L23/12 , B81B7/00 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/057 , H01L23/10 , H01L23/31 , H01L23/36 , H01L23/538 , H03H9/10
摘要： The electronic device ( 100 ) comprises a body ( 20 ) with a cavity ( 30 ) wherein a semiconductor element ( 10 ) and a thermally conductive layer ( 33 ) are present. The cavity ( 30 ) is filled with an encapsulation ( 35 ) of an electrically insulating material wherein contact faces ( 47, 48 ) are mechanically anchored.

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