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21. 发明授权

US07620272B2 Photoelectric composite module and optical input/output device 有权
标题翻译：光电复合模块和光输入/输出装置
公开(公告)号：US07620272B2
公开(公告)日：2009-11-17
申请号：US11785946
申请日：2007-04-23
申请人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
发明人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
IPC分类号： G02B6/12 , G02B6/00
CPC分类号： G02B6/3897
摘要： A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.
摘要翻译：光电复合模块具有沿着封装的两个壳体部分设置的光学器件，封装和柔性印刷电路，并且在其上形成用于光学器件的电线。包装具有第一壳体部分和第二壳体部分，其通过铰链与第一壳体部分连接并且被设置在安装的板上。光学装置与面对所述柔性印刷电路中的第一壳体部分的表面接合。柔性印刷电路具有光提取装置，用于传输应该在光学装置和光波导之间交换的光信号。该封装具有短路装置，用于在柔性印刷电路的电线与安装板的电线之间短路。

22. 发明授权

US07488122B2 Optical connector and optical module 失效
标题翻译：光连接器和光模块
公开(公告)号：US07488122B2
公开(公告)日：2009-02-10
申请号：US11694787
申请日：2007-03-30
申请人： Youichi Hashimoto , Junichi Sasaki , Ichiro Hatakeyama , Kazuhiko Kurata
发明人： Youichi Hashimoto , Junichi Sasaki , Ichiro Hatakeyama , Kazuhiko Kurata
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/421 , G02B6/4214 , G02B6/4277
摘要： An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.
摘要翻译：一种光波导或第一光纤，其一端与光学元件的光出射平面和/或光入射面光学连接，并且其另一端与第二光纤和连接器光学连接，用于机械地连接光波导或第一包括光纤和第二光纤。弯曲光波导或第一光纤以改变光的行进方向，使得从一端进入的光从基板平行于另一端发射，并且基本上与板平行地入射到光光波导或另一端的第一光纤从一端朝向光学元件发射。

23. 发明申请

US20080036021A1 Semiconductor Device Having Optical Signal Input-Output Mechanism 有权
标题翻译：具有光信号输入输出机构的半导体器件
公开(公告)号：US20080036021A1
公开(公告)日：2008-02-14
申请号：US11575482
申请日：2005-09-20
申请人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
发明人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
IPC分类号： H01L31/0232
CPC分类号： G02B6/42 , G02B6/4214 , G02B6/4232 , H05K1/141 , H05K1/147 , H05K1/189
摘要： A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).
摘要翻译：半导体装置具有印刷电路板（11），其中形成连接到LSI芯片（17）和平面光学元件（21）的电线（18），并且其中传输输入到平面光学元件的光的光波导（25） 21）和/或从平面光学元件（21）输出的光是固定的。平面光学元件（21）安装在小基板（13）的一端，小基板（13）的另一端通过焊料凸块（26）与印刷电路板（11）连接。安装平面光学元件（21）的小基板（13）的一端通过固定机构固定到印刷电路板（11）。小基板（13）具有柔性部分（15），其与印刷电路板（11）和小基板（13）的其它部分相比容易变形，在平面光学元件（21）的一端之间的至少一部分区域中，并且另一端电连接到印刷线路板（11）。

24. 发明申请

US20070280594A1 Photoelectric composite module and optical input/output device 有权
标题翻译：光电复合模块和光输入/输出装置
公开(公告)号：US20070280594A1
公开(公告)日：2007-12-06
申请号：US11785946
申请日：2007-04-23
申请人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
发明人： Tomoyuki Hino , Kazuhiko Kurata , Ichiro Ogura , Junichi Sasaki , Ichiro Hatakeyama , Yoichi Hashimoto , Ryosuke Kuribayashi
IPC分类号： G02B6/42
CPC分类号： G02B6/3897
摘要： A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.
摘要翻译：光电复合模块具有沿着封装的两个壳体部分设置的光学器件，封装和柔性印刷电路，并且在其上形成用于光学器件的电线。包装具有第一壳体部分和第二壳体部分，其通过铰链与第一壳体部分连接并且被设置在安装的板上。光学装置与面对所述柔性印刷电路中的第一壳体部分的表面接合。柔性印刷电路具有光提取装置，用于传输应该在光学装置和光波导之间交换的光信号。该封装具有短路装置，用于在柔性印刷电路的电线与安装板的电线之间短路。

25. 发明申请

US20070086723A1 Optical connection structure of optical backplane to circuit substrate 失效
标题翻译：光背板到电路基板的光学连接结构
公开(公告)号：US20070086723A1
公开(公告)日：2007-04-19
申请号：US11543118
申请日：2006-10-05
申请人： Junichi Sasaki , Kazuhiko Kurata , Shuji Suzuki , Kazuhito Saito , Hiroshi Masuda , Osamu Ibaragi , Masao Kinoshita
发明人： Junichi Sasaki , Kazuhiko Kurata , Shuji Suzuki , Kazuhito Saito , Hiroshi Masuda , Osamu Ibaragi , Masao Kinoshita
IPC分类号： G02B6/00
CPC分类号： G02B6/3897 , G02B6/43
摘要： An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.
摘要翻译：光背板包括一个光连接器，该光连接器从电路基板接收非平行于电路基板的主表面传输的并置的光信号，或将电路基板的非平行的并置的光信号传输到电路基板。光连接器配置并容纳多根光纤的边缘部分，并且光连接器中的光纤的布置方向与电路基板的主表面不平行。

26. 发明授权

US06994479B2 Substrate, optical fiber connection end member, optical element housing member, and method of fabrication of an optical module and the substrate 失效
标题翻译：基板，光纤连接端部件，光学元件外壳部件以及制造光学模块和基板的方法
公开(公告)号：US06994479B2
公开(公告)日：2006-02-07
申请号：US11165322
申请日：2005-06-24
申请人： Junichi Sasaki , Kazuhiko Kurata , Takanori Shimizu
发明人： Junichi Sasaki , Kazuhiko Kurata , Takanori Shimizu
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/30 , G02B6/421 , G02B6/4214 , G02B6/423 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4257
摘要： The present invention provides a substrate, an optical fiber connecting end member, an optical element-housing member, a light module, and a manufacturing method of the substrate. The substrate has a feature that can be stably realizable and having a simple structure and that a light waveguide formed on the substrate surface or an optical element formed thereon can be connected without core alignment to an optical element provided on the optical fiber of the optical fiber connector to be connected to the optical fiber connecting end member. The substrate of the present invention is characterized in steps 5 for positioning being formed on at least one side of the substrate 1 that provides the optical waveguide 4.
摘要翻译：本发明提供一种基板，光纤连接端部件，光学元件外壳部件，光模块以及基板的制造方法。该基板具有能够稳定地实现并且具有简单结构的特征，并且形成在基板表面上的光波导或形成在其上的光学元件可以连接到光纤上的光学元件而不与芯对准连接。连接器连接到光纤连接端部件。本发明的基板的特征在于步骤5，定位形成在提供光波导4的基板1的至少一侧上。

27. 发明授权

US08322933B2 Optical connection structure between optical backplane and circuit substrate 有权
标题翻译：光背板与电路基板之间的光连接结构
公开(公告)号：US08322933B2
公开(公告)日：2012-12-04
申请号：US12534622
申请日：2009-08-03
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/36 , G02B6/38
CPC分类号： G02B6/3885 , G02B6/3897 , G02B6/43
摘要： Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.
摘要翻译：信息处理设备包括设置在电路基板上的光电转换模块，通过多个第一光纤连接到光电转换模块并且设置在电路基板的边缘部分的第一光学连接器，以及设置在电路基板上的第二光学连接器光学背板并且光学连接到第一光学连接器。光电转换模块中的光纤的布置方向与电路基板的主表面不平行，第一光连接器中的光纤的布置方向和第二光连接器中的光纤的布置方向为与电路基板的主表面不平行。

28. 发明授权

US08267597B2 Mounting of optical device on mounting board to at least provide heat radiation 有权
标题翻译：将光学装置安装在安装板上至少提供热辐射
公开(公告)号：US08267597B2
公开(公告)日：2012-09-18
申请号：US12545204
申请日：2009-08-21
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/00 , G02B6/36
CPC分类号： G02B6/4214 , G02B6/325 , G02B6/4228 , H05K1/141 , H05K1/182
摘要： An optical module includes: an optical device mounting board including a first surface, a second surface on the reverse side, and a light transparent part allowing an emitted light traveling from the first surface to the second surface and a received light traveling in the opposite direction to pass through the transparent part; an optical device mounted on the first surface, which is a light emitting device or a light receiving device; a first terminal mounted on a surface except the first surface of the optical device mounting board; a wiring connecting a second terminal of a component mounted on the first surface including the optical device with the first terminal; and a transmission medium connector connecting a light transmission medium transmitting the emitted light traveling from the second surface to an outside of the optical module or the received light traveling in the opposite direction.
摘要翻译：光学模块包括：光学装置安装板，包括第一表面，反面上的第二表面和允许从第一表面到第二表面传播的发射光的透光部分和沿相反方向行进的接收光透过透明部分; 安装在第一表面上的光学器件，其是发光器件或光接收器件; 第一端子，其安装在除了所述光学装置安装板的第一表面之外的表面上; 连接安装在包括光学装置的第一表面的部件的第二端子与第一端子的布线; 以及传输介质连接器，其连接将从第二表面传播的发射光传输到光学模块的外部的光传输介质或沿相反方向传播的接收光。

29. 发明授权

US07732340B2 Method for adjusting a critical dimension in a high aspect ratio feature 失效
标题翻译：用于调整高宽高比特征中临界尺寸的方法
公开(公告)号：US07732340B2
公开(公告)日：2010-06-08
申请号：US11463133
申请日：2006-08-08
申请人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
发明人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
IPC分类号： H01I21/302
CPC分类号： H01L21/31116 , H01L21/31122 , H01L21/31144
摘要： A method for adjusting the lateral critical dimension (i.e., length and width) of a feature formed in a layer on a substrate using a dry etching process. One or more thin intermediate sub-layers are inserted in the layer within which the feature is to be formed. Once an intermediate sub-layer is reached during the etching process, an etch process is performed to correct and/or adjust the lateral critical dimensions before etching through the intermediate sub-layer and continuing the layer etch.
摘要翻译：一种用于使用干蚀刻工艺调节在衬底上形成的特征的横向临界尺寸（即，长度和宽度）的方法。将一个或多个薄的中间子层插入其中要形成特征的层中。一旦在蚀刻过程中达到中间子层，则在蚀刻通过中间子层并继续层蚀刻之前，执行蚀刻工艺以校正和/或调整横向临界尺寸。

30. 发明授权

US06934429B2 Optical waveguide board and optical module 失效
标题翻译：光波导板和光模块
公开(公告)号：US06934429B2
公开(公告)日：2005-08-23
申请号：US10285647
申请日：2002-11-01
申请人： Hideo Kikuchi , Junichi Sasaki , Seiji Suda , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada
发明人： Hideo Kikuchi , Junichi Sasaki , Seiji Suda , Mikio Oda , Hikaru Kouta , Sakae Kitajo , Yuzo Shimada
IPC分类号： G02B6/122 , G02B6/42 , H04B10/25 , H04B10/2507 , H04B10/2581 , G02B6/12
CPC分类号： G02B6/4214 , G02B6/42 , G02B6/4206
摘要： An optical waveguide board is provided which includes a substrate, an optical path changing unit being formed on the substrate used to change a direction of an optical path of incident light from a direction being vertical to a surface of the substrate to a direction being horizontal to the surface of the substrate and to condense a luminous flux and an optical waveguide being formed on the substrate to carry out multi-mode transmission of a luminous flux fed from the optical path changing unit wherein, based on a spread angle of the luminous flux formed by the optical path changing unit, mainly light components to be transmitted in a zero-order mode to a three-order mode only, out of various kinds of modes for the multi-mode transmission, is transmitted through the optical waveguide.
摘要翻译：提供了一种光波导板，其包括基板，光路改变单元，其形成在基板上，用于将入射光的光路方向从垂直于基板的表面的方向改变到水平方向在基板的表面上冷凝形成在基板上的光束和光波导，以进行从光路改变单元馈送的光束的多模传输，其中基于形成的光束的扩展角通过光路改变单元，主要是通过光波导传输在多模式传输的各种模式中仅以零阶模式传输到三阶模式的光分量。

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