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    • 23. 发明授权
    • Semiconductor device having transistor
    • 具有晶体管的半导体器件
    • US06576963B2
    • 2003-06-10
    • US09992069
    • 2001-11-14
    • Beom-jun JinByeong-yun NamYoung-pil Kim
    • Beom-jun JinByeong-yun NamYoung-pil Kim
    • H01L2976
    • H01L21/76897H01L21/823475H01L29/6653Y10S257/90
    • A method of forming self-aligned contact holes exposing source/drain regions in a semiconductor substrate using only etch mask layers is provided. In the method, sacrificial spacers are formed of a material having an excellent etching selectivity to the etch mask layers at sidewalls of gate electrodes in a cell area. Also, an interlevel dielectric layer is formed of a material having an excellent etching selectivity to the etch mask layers. The sacrificial spacers are removed when forming the self-aligned contact holes. Dielectric spacers are formed of a material having a low dielectric constant, without considering its etching selectivity to the interlevel dielectric layer. Thus, a reduction in the operational speed of a semiconductor device having transistors can be prevented.
    • 提供了一种使用仅使用蚀刻掩模层在半导体衬底中暴露源/漏区的自对准接触孔的方法。 在该方法中,牺牲隔离物由对单元区域中的栅电极的侧壁处的蚀刻掩模层具有优良蚀刻选择性的材料形成。 此外,层间介电层由对蚀刻掩模层具有优异蚀刻选择性的材料形成。 当形成自对准的接触孔时,去除牺牲隔离物。 电介质间隔物由具有低介电常数的材料形成,而不考虑其对层间电介质层的蚀刻选择性。 因此,可以防止具有晶体管的半导体器件的操作速度的降低。