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21. 发明授权

US07427345B2 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
公开(公告)号：US07427345B2
公开(公告)日：2008-09-23
申请号：US10432397
申请日：2002-11-29
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25D17/00 , C25B15/00 , B23H3/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

22. 发明申请

US20080067077A1 Electrolytic liquid for electrolytic polishing and electrolytic polishing method 审中-公开
标题翻译：电解液用于电解抛光和电解抛光法
公开(公告)号：US20080067077A1
公开(公告)日：2008-03-20
申请号：US11896251
申请日：2007-08-30
申请人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
发明人： Akira Kodera , Yasushi Toma , Tsukuru Suzuki , Takayuki Saito , Itsuki Kobata
IPC分类号： C25F3/16 , B23H3/00
CPC分类号： B23H5/08 , B23H5/12 , C25F3/16 , C25F3/22
摘要： An electrolytic liquid is used for electrolytic polishing which can provide a processed surface having high flattening characteristics with a low voltage applied while ensuring a higher processing rate for an conductive material, and can remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal (conductive material). The electrolytic liquid for use in electrolytic polishing of a surface conductive material of a workpiece comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor and a water-soluble polymeric compound.
摘要翻译：一种电解液用于电解抛光，其可以在确保更高的导电材料的加工速率的同时，提供具有高平坦化特性的加工表面，同时确保更高的导电材料的加工速率，并且可以去除不必要的导电材料并暴露阻挡膜而不引起凹陷，侵蚀或蚀刻在阻挡膜和金属（导电材料）之间的界面处。用于工件表面导电材料的电解抛光的电解液包括含有至少一种有机酸或其盐的水溶液，至少一种具有磺酸基的强酸，缓蚀剂和水溶性聚合物复合。

23. 发明申请

US20070272562A1 Electrolytic Processing Apparatus and Electrolytic Processing Method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070272562A1
公开(公告)日：2007-11-29
申请号：US10560623
申请日：2004-07-14
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Kazuto Hirokawa , Itsuki Kobata
IPC分类号： H01L21/3063
CPC分类号： C25F3/00 , C25F7/00
摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can effectively prevent the formation of pits that would impair the quality of the processed product. The electrolytic processing apparatus including: a processing electrode (210) for processing a workpiece; a feeding electrode (212) for feeding electricity to the workpiece; a power source (232) for applying a voltage between the processing electrode (210) and the feeding electrode (212); a pressure tight container (200) housing the processing electrode (210) and the feeding electrode (212) therein; and a high-pressure liquid supply system (204) for supplying a high-pressure liquid into the pressure tight container (210).
摘要翻译：本发明提供一种电解处理装置和电解处理方法，其可以有效地防止会影响加工产品质量的凹坑的形成。电解处理装置包括：处理工件的处理电极; 用于向工件供电的供电电极（212）; 用于在处理电极（210）和馈电电极（212）之间施加电压的电源（232）; 容纳所述处理电极（210）和所述馈电电极（212）的压力容器（200）; 以及用于将高压液体供应到耐压容器（210）中的高压液体供给系统（204）。

24. 发明申请

US20070187259A1 Substrate processing apparatus and method 审中-公开
标题翻译：基板加工装置及方法
公开(公告)号：US20070187259A1
公开(公告)日：2007-08-16
申请号：US11715971
申请日：2007-03-09
申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
发明人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
IPC分类号： B23H5/00
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.
摘要翻译：基板处理装置可以执行与普通的常规蚀刻不同的电解处理，以去除（清除）形成在或附着于基板的斜面部分等上的导电材料（膜）或处理通过电化学作用的衬底的周边部分。基板处理装置包括：具有多个电极的电极部，该多个电极层叠有绝缘体，并且具有与基板的周边部相对的保持部; 设置在电极部的保持部中的离子交换部; 液体供应部分，用于将液体供应到电极部分的保持位置; 以及用于向电极部分的电极施加电压使得电极交替具有不同极性的电源。

25. 发明申请

US20050155868A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050155868A1
公开(公告)日：2005-07-21
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H5/08 , B24B37/04 , C25F1/00 , C25F3/00 , H01L21/321 , H01L21/768 , B23H3/00
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

26. 发明申请

US20050035001A1 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20050035001A1
公开(公告)日：2005-02-17
申请号：US10914190
申请日：2004-08-10
申请人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
发明人： Hozumi Yasuda , Ikutaro Noji , Kazuto Hirokawa , Takeshi Iizumi , Itsuki Kobata
IPC分类号： B23H3/00 , C25D5/02 , C25F7/02
CPC分类号： C25F7/02
摘要： There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.
摘要翻译：提供一种电解处理装置和电解处理方法，其可以以提高的离子交换容量的再生速率再生离子交换器，而不会不利地影响装置的生产量。电解处理装置包括：用于保持工件的保持器; 电极部分，包括电极，接触部件和用于在处理期间从工件中取出的金属离子放电到接触部件中的放电部分，所述电极部分靠近或与保持件保持的工件接触或接触在液体存在下对工件进行加工; 以及能够靠近或与接触构件接触的再生虚拟电极。

27. 发明申请

US20090134036A1 Electrolytic Processing Method and Electrolytic Processing Apparatus 审中-公开
标题翻译：电解加工方法和电解处理装置
公开(公告)号：US20090134036A1
公开(公告)日：2009-05-28
申请号：US11991356
申请日：2006-08-30
申请人： Akira Kodera , Itsuki Kobata
发明人： Akira Kodera , Itsuki Kobata
IPC分类号： C25D3/50 , C25D5/00 , C25F3/00 , C25D17/00 , C25D3/56 , C25D3/54
CPC分类号： C25F3/02 , B23H5/08 , H01L21/7684
摘要： An electrolytic processing method makes it possible to preferentially process a diffusion barrier layer while suppressing processing of an interconnect metal, thereby enabling omission of CMP or a lowering of processing pressure in CMP. The electrolytic processing method comprises: bringing a surface of a substrate (W) into contact with an electrolytic solution (48) comprising an organic solvent, such as propylene carbonate, and an electrolyte, such as lithium hexafluorophosphate, dissolved into the organic solvent, and optionally an inhibitor composed of a heterocyclic compound; and applying an electric potential, for example, a positive electric potential which is controlled at a value less than the decomposition voltage of the organic solvent, to the surface of the substrate (W) to carry out electrolytic processing of the substrate surface.
摘要翻译：电解处理方法可以在抑制互连金属的处理的同时优先处理扩散阻挡层，从而能够省略CMP或降低CMP中的处理压力。电解处理方法包括：使基材（W）的表面与包含有机溶剂的碳酸亚乙酯的电解液（48）和溶解在有机溶剂中的六氟磷酸锂等电解质接触，以及任选的由杂环化合物组成的抑制剂; 以及将电位（例如被控制在小于有机溶剂的分解电压的正电位）施加到基板（W）的表面，以进行基板表面的电解处理。

28. 发明申请

US20080188162A1 Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution 审中-公开
标题翻译：电化学机械抛光装置调理方法，调理溶液
公开(公告)号：US20080188162A1
公开(公告)日：2008-08-07
申请号：US12068300
申请日：2008-02-05
申请人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
发明人： Itsuki Kobata , Yasushi Toma , Akira Kodera , Tsukuru Suzuki , Yuji Makita , Takayuki Saito
IPC分类号： B24B49/00
CPC分类号： B24B53/017 , B23H5/08 , B24B37/042 , B24B37/046 , B24B49/10 , H01L21/32125 , H01L21/7684
摘要： An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material (e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface, a polishing head adapted to hold a workpiece having a conductive film and to press the workpiece against the polishing surface, a second electrode for supplying an electric current to the conductive film, an electrolytic-solution supply section for supplying an electrolytic solution to the polishing surface, a detecting section adapted to detect a signal corresponding to a thickness of the conductive film, a variable resistance unit having the same number of variable resistors as the number of divided electrodes, a moving mechanism for providing relative movement between the workpiece and the polishing surface, and a control section adapted to control each of the variable resistors based on the signal from the detecting section.
摘要翻译：电化学机械抛光装置用于通过电化学作用和机械作用的组合在基底表面上抛光导电材料（例如金属）。该装置包括具有分割电极并且适于保持具有抛光表面的抛光垫的抛光台，用于保持具有导电膜的工件并将工件压靠抛光表面的抛光头，用于提供电电流至导电膜的电解液供应部分，用于向研磨表面供应电解液的电解溶液供应部分，用于检测对应于导电膜厚度的信号的检测部分，具有相同数目的可变电阻器的可变电阻单元作为分割电极的数量，用于在工件和抛光表面之间提供相对移动的移动机构，以及适于基于来自检测部分的信号来控制每个可变电阻器的控制部分。

29. 发明申请

US20080121529A1 Flattening Method and Flattening Apparatus 审中-公开
标题翻译：扁平化方法和扁平化装置
公开(公告)号：US20080121529A1
公开(公告)日：2008-05-29
申请号：US11793773
申请日：2005-12-21
申请人： Yasushi Tohma , Takayuki Saitoh , Tsukuru Suzuki , Akira Kodera , Yutaka Wada , Itsuki Kobata
发明人： Yasushi Tohma , Takayuki Saitoh , Tsukuru Suzuki , Akira Kodera , Yutaka Wada , Itsuki Kobata
IPC分类号： C25F3/16 , C25F7/00
CPC分类号： C25F3/02 , C25F7/00 , H01L21/32115 , H01L21/32125 , H01L21/7684
摘要： A flattening method can flatly process a surface of a metal film as an interconnect material over the entire film surface at a sufficiently high processing rate even when the metal film has initial surface irregularities. The flattening method for processing and flattening a surface of a metal film formed on a workpiece and having initial surface irregularities, including: coating only recessed portions of the initial surface irregularities of the metal film with a solid or pasty coating material; and processing the surface of the metal film by electrolytic processing using no abrasive.
摘要翻译：平坦化方法即使当金属膜具有初始表面不规则性时，可以在足够高的处理速率下将整个膜表面上的金属膜的表面作为互连材料平整处理。用于加工和平坦化在工件上形成的具有初始表面凹凸的金属膜的表面的平坦化方法，包括：用固体或糊状涂料仅仅涂覆金属膜初始表面凹凸的凹陷部分; 并且通过不使用研磨剂的电解处理来处理金属膜的表面。

30. 发明申请

US20070187257A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070187257A1
公开(公告)日：2007-08-16
申请号：US10592673
申请日：2005-03-16
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
IPC分类号： B23H7/00
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00 , H01L21/32125
摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal
摘要翻译：电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小

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