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21. 发明专利

JPS63124352A X-RAY TUBE TARGET 失效
公开(公告)号：JPS63124352A
公开(公告)日：1988-05-27
申请号：JP26761086
申请日：1986-11-12
申请人： HITACHI LTD
发明人： CHIBA AKIO , MATSUSHITA YASUO , NAKAMURA KOSUKE , SOFUE MASAHISA
IPC分类号： H01J35/10 , H01J35/08
摘要： PURPOSE:To enable the manufacture of a target which resists high-speed rotation and has high performance and high efficiency by forming a X-ray target in a X-ray CT device so that it is composed of graphite/carbon fiber composite/ graphite. CONSTITUTION:Graphite 1, ceramics 3, a carbon fiber composite 2, ceramics 3, and graphite 1 are incorporated serially inside a metallic mold 4, and they are molded with a molding pressure 500 kg/cm in order to uniformalize the thickness of the ceramics 3. Then the thickness after the sintering of the ceramics 3 is made 0.5 mm to 1 mm or so. This molded composite target is sintered by a hot press. The sintering conditions are as follows; this target is heated for about 15 min. until its temperature rises up to 1900 deg.C from a room temperature, and pressure 300 kg/cm is applied to the target at 1900 deg.C, and moreover the target is heated up to 2150 deg.C at the rate of 10 deg.C/min, and after the target is held at 2150 deg.C for 30 min., it is cooled, and the pressure is released at 1500 deg.C.

22. 发明专利

JPS6123502B2 JPS6123502B2 - 失效
公开(公告)号：JPS6123502B2
公开(公告)日：1986-06-06
申请号：JP5457775
申请日：1975-05-12
申请人： Hitachi Ltd
发明人： TOMITA SADAMI , CHIBA AKIO , UCHIUMI YOSHIHARU
IPC分类号： G01R33/383 , G01R33/3875 , H01F7/02 , H01F7/20
CPC分类号： H01F7/0278 , G01R33/383 , G01R33/3875 , H01F7/20

23. 发明专利

JPS60125339A MANUFACTURE OF COPPER-CARBON FIBER COMPOSITE MATERIAL 失效
公开(公告)号：JPS60125339A
公开(公告)日：1985-07-04
申请号：JP22980983
申请日：1983-12-07
申请人： HITACHI LTD
发明人： TSURUOKA SHIGEO , KUNIYA KEIICHI , ARAKAWA HIDEO , CHIBA AKIO , YAMAGISHI RIYOUZOU
IPC分类号： C22C47/00 , C25D7/00 , C25D7/12 , H01L21/52 , H01L21/58
摘要： PURPOSE:To obtain the titled sound material free from surface swelling and surface cracks by subjecting a copper-carbon fiber composite material for a semiconductor electrode to specified copper plating before the composite material is coated with a thin film of Ni or the like by electroplating. CONSTITUTION:A plate 2 of a copper-carbon fiber composite material clad with copper plates 1 on both sides is electroplated with Ni which does not hinder the bonding of the plate 2 to a semiconductor element or the like. At this time, the plate 2 is first pretreated by electrolytic degreasing and pickling, and the 1st dense Cu layer 3 and the 2nd Cu layer 4 having significant smoothing action are formed as two layers having different properties by electroplating or other method. The layer 4 is then electroplated with Ni to form an Ni layer 5.

24. 发明专利

JPS5951534A Substrate for integrated circuit device 失效
标题翻译：集成电路设备基板
公开(公告)号：JPS5951534A
公开(公告)日：1984-03-26
申请号：JP15156183
申请日：1983-08-22
申请人： Hitachi Ltd
发明人： CHIBA AKIO , SHIMIZU SEIKI , KUNIYA KEIICHI , SOGA TASAO
IPC分类号： H01L23/15 , H01L21/52 , H01L21/58
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/8319 , H01L2224/8385 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01047 , H01L2924/07802 , H01L2924/14 , H01L2924/3512 , H01L2924/00
摘要： PURPOSE:To easily join an insulating plate and heat radiating plate thereby to obtain a low thermal resistivity substrate without warpage and crack by joining an alumina insulating plate and heat radiating plate made of Cu and carbon fiber composite material through Cr layer, Cr-Ag layer and vacuum-deposited layer of Ag. CONSTITUTION:An insulating plate, Al2O3 plate is, for example, degreased and washed and is then dried up sufficiently. Thereafter, it is placed under the vacuum condition of 1X10 Torr or higher. First, Cr2 is deposited and a mixed layer of Cr-Ag and finally Ag 4 are also deposited. A heat radiating plate can be manufactured, for example, by disposing the Cu and carbon fiber composite material like a mesh and by hot pressing it. Thereafter, the insulating plate, Al2O3 vacuum deposited as described above and a heat radiating plate consisting of the Cu and carbon fiber composite material are stacked directly and are joined with a pressure of 1kg/cm unde a temperature of 600 deg.C and a period of 300mm.. Thereby, a substrate for integrated circuit device can be obtained.
摘要翻译：目的：为了容易地加入绝缘板和散热板，从而通过Cr层和Cr-Ag层将由Cu和碳纤维复合材料制成的氧化铝绝缘板和散热板接合而获得低热阻基板而没有翘曲和裂纹和Ag的真空沉积层。构成：绝缘板，Al2O3板例如脱脂和洗涤，然后充分干燥。此后，将其置于1×10 -6乇或更高的真空条件下。首先沉积Cr2并沉积Cr-Ag和最终的Ag 4的混合层。散热板可以例如通过将铜和碳纤维复合材料设置成网状并通过热压而制造。然后，将如上所述的真空蒸镀的Al 2 O 3，Cu和碳纤维复合材料构成的散热板直接层叠，并在600℃的温度下以1kg / cm 2的压力进行接合并且300mm的周期。由此，可以获得用于集成电路器件的衬底。

25. 发明专利

JPS5436790A MAGNETIC POLE PIECE FOR INTERNAL CHILL 失效
公开(公告)号：JPS5436790A
公开(公告)日：1979-03-17
申请号：JP10164577
申请日：1977-08-26
申请人： HITACHI LTD
发明人： CHIBA AKIO , MIYAMOTO RIYOUICHI , IMAHASHI HIROMICHI
IPC分类号： G01R33/383 , H01F7/02 , H01F41/02
摘要： PURPOSE:To make the parallelish between pile pieces highly accurate, while eliminating deformation, by giving a frustoconical shape to the pole pieces and by forming a groove in the circumfernetial portion fo the frustrum contacting the conical portion.

26. 发明专利

JPS52104990A MAGNETIC BODY S STRUCTURE FOR UNIFORM MAGNETIC FIELD GENERATION 失效
公开(公告)号：JPS52104990A
公开(公告)日：1977-09-02
申请号：JP2109776
申请日：1976-03-01
申请人： HITACHI LTD
发明人： CHIBA AKIO , TOMITA SADAMI , SUZUKI YASUAKI
IPC分类号： G01R33/383 , H01F7/02
摘要： PURPOSE:To obtain the uniform magnetic field inside a hole with simple and small size and that with low cost in a wide range, by means of using high permeability alloy around a hole of magnetic material with hole.

27. 发明专利

JPS51131389A DEVICE FOR UNIFORM POLARIZED MAGNETIC FIELD 失效
公开(公告)号：JPS51131389A
公开(公告)日：1976-11-15
申请号：JP5457775
申请日：1975-05-12
申请人： HITACHI LTD
发明人： TOMITA SADAMI , CHIBA AKIO , UCHIUMI YOSHIHARU
IPC分类号： G01R33/383 , G01R33/3875 , H01F7/02 , H01F7/20
摘要： PURPOSE:Device for developing a strong, uniform magnetic field.

28. 发明专利

JP2000223302A CERAMICS RESISTOR AND ITS MANUFACTURE 失效
公开(公告)号：JP2000223302A
公开(公告)日：2000-08-11
申请号：JP2169899
申请日：1999-01-29
申请人： HITACHI LTD
发明人： KANAI TSUNEYUKI , CHIBA AKIO , SAITO YUKIO , TAKAHASHI KEN
IPC分类号： H01C7/00
摘要： PROBLEM TO BE SOLVED: To restrain resistivity at normal temperature and improve stability of characteristics, reliability and reproducibility by dispersing a specified amount in Si3N4 as free carbon of deposited SiC. SOLUTION: The mixing ratio of C powder to Si3N4 powder is set in the range of at least 1 wt.% and less than 15 wt.%. In order to reduce the temperature dependence of free carbon, free carbon amount is set to be at least 100 PPM and less than 10,000 PPM. Proper amount of dispersant is added to those powders. They are sulbjicted to thermal treatment in inert gas at 1,500-1,800 deg.C is performed, material powder is decomposed and/or composed by chemical reaction, and SiC particles and/or SiC whiskers are formed in Si3N4 matrix. SiC particles, SiC whiskers and free carbon can be formed uniformly and finely and decomposed in Si3N4. As a result, free carbon as a material with which SiC restrains resistivity can be decreased in temperature dependence of a resistor.

29. 发明专利

JPH09113660A FUSION REACTOR 失效
公开(公告)号：JPH09113660A
公开(公告)日：1997-05-02
申请号：JP26970295
申请日：1995-10-18
申请人： HITACHI LTD
发明人： YASUTOMI YOSHIYUKI , NAKAGAWA MOROO , SAWAI YUICHI , CHIBA AKIO , SUZUKI YASUTAKA
IPC分类号： G21B1/11 , G21B1/00 , G21B1/13
摘要： PROBLEM TO BE SOLVED: To reduce shear stress due to eddy current and radiation of neutron by constituting a cooling base plate constituting a coolant flow path of silicon base composite material with high electric resistivity and low radiation. SOLUTION: A cooling metal base body 5 of a vacuum vessel-cooling system placed on the periphery of a vacuum vessel is constituted by combining a diverter cooling base plate consisting of metal silicon 10 and reinforcing particles 11, etc., and a plasma opposing material 9 such as carbon/carbon composite. As for the reinforcing material, at least one of silicon carbide, carbon, boron carbide, beryllium, magnesium, etc., is selected and added to silicon 10 as reinforcing particles 11, whisker state or long fiber state. As the base body 5 is constituted of metal base complex material with light element and high electric resistivity in this manner, shear force due to eddy current is reduced and reliability is improved. Also, as exposure to radiation is reduced, safety in waste processing improves.

30. 发明专利

JPH06176840A COMPOSITE CERAMIC COMMUTATOR 失效
公开(公告)号：JPH06176840A
公开(公告)日：1994-06-24
申请号：JP34517192
申请日：1992-12-02
申请人： HITACHI KOKI KK , HITACHI LTD
发明人： CHIBA AKIO , KAMOSHITA MUTSUO , SAITO YUKIO , SAKAMOTO SHINICHI
IPC分类号： H01R39/04
摘要： PURPOSE:To improve electric resistance and heat resistance of a conductive segment, set it applicable to a commutator of large current specifications, and improve its spark resistance, heat resistance, and abrasion resistance. CONSTITUTION:A ceramic commutator comprises a center insulation ring 4, and conductive segments disposed at its outer circumferential part. The conductive segment comprises metal 3, and conductive ceramic 1, and insulation layers between the conductive segments comprise a gap 5 or insulation ceramic.

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