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    • 21. 发明申请
    • POWER TRANSDUCER
    • 电力变压器
    • US20120119685A1
    • 2012-05-17
    • US13357104
    • 2012-01-24
    • Satoshi IboriYoshihiro UchinoHiroshi WatanabeMasahiro Hiraga
    • Satoshi IboriYoshihiro UchinoHiroshi WatanabeMasahiro Hiraga
    • H02P3/12
    • H02P3/22H02M1/32H02M5/458H02P3/14
    • The performance of a power transducer is improved while efficiently using a power semiconductor also by managing the permissible duty factor of the power semiconductor in the regenerative braking circuit provided in the power transducer. The user is allowed to set, through an operation panel provided on the power transducer, the resistance value of the regenerative braking resistor for thermally consuming the rotational energy generated during motor deceleration. The power transducer performs the steps of: calculating the current which flows in the regenerative braking circuit from the resistance value setting; obtaining the generation loss of the power semiconductor in the regenerative braking circuit with the calculated current value; and determining the permissible duty factor of the power semiconductor from the obtained generation loss.
    • 功率传感器的性能得到改善,同时通过管理设置在功率传感器中的再生制动电路中的功率半导体的允许占空比来有效地使用功率半导体。 允许用户通过设置在功率传感器上的操作面板设置再生制动电阻器的电阻值,用于热消耗电动机减速期间产生的旋转能量。 功率传感器执行以下步骤:从电阻值设定计算在再生制动电路中流动的电流; 以所计算的电流值获得再生制动电路中的功率半导体的发电损失; 以及从所获得的发电损失确定功率半导体的允许占空比。
    • 22. 发明授权
    • Three-dimensional (3D) structure data creation method, 3D structure data creation apparatus, computer-readable record media and computer system
    • 三维(3D)结构数据创建方法,3D结构数据创建装置,计算机可读记录介质和计算机系统
    • US08174522B2
    • 2012-05-08
    • US12052198
    • 2008-03-20
    • Hiroshi Watanabe
    • Hiroshi Watanabe
    • G06T15/00
    • G06F17/50
    • A three-dimensional (3D) structure data creation technique capable of readily creating 3D structure data is disclosed. This method is for producing data of a 3D structure which is made up of a plurality of elements. The method includes the steps of preparing first and second two-dimensional (2D) sectional images different in normal vector from each other, forming first and second unit graphics based on these 2D images, partitioning each unit graphic on a per-element basis, performing layout arrangement of two unit graphics in accordance with normal vectors, expanding these unit graphics for conversion to 3D objects, and allocating a selected element to a region in which elements of the unit graphics failing to coincide with each other, which region is included in and specified from those regions with intersection of respective partitioned parts of the unit graphics, thereby to create the 3D structure data required.
    • 公开了能够容易地创建3D结构数据的三维(3D)结构数据创建技术。 该方法用于生成由多个元素构成的3D结构的数据。 该方法包括以下步骤:在法向量中彼此不同的第一和第二二维(2D)截面图像,基于这些2D图像形成第一和第二单位图形,基于每个元素划分每个单位图形,执行 根据法向量布置两个单位图形的布局布置,将这些单位图形扩展到3D对象,并将所选择的元素分配到单元图形的元素彼此不一致的区域,该区域包括在哪个区域中, 从具有相应的单位图形的分割部分的区域指定,从而创建所需的3D结构数据。
    • 24. 发明授权
    • Manufacturing method of silicon carbide semiconductor apparatus
    • 碳化硅半导体器件的制造方法
    • US08039204B2
    • 2011-10-18
    • US12172453
    • 2008-07-14
    • Hiroshi Watanabe
    • Hiroshi Watanabe
    • G03F7/26
    • H01L29/7802H01L21/046H01L29/1608H01L29/66068
    • A manufacturing method of a silicon carbide semiconductor apparatus is provided. The method includes forming a first resist pattern on a surface of a silicon carbide layer formed on a silicon carbide substrate, implanting a first conduction type impurity ion in the silicon carbide layer on which the first resist pattern is formed, forming a second resist pattern by decreasing a width of the first resist pattern with etching and forming a deposition layer on the surface of the silicon carbide layer which is not covered with the second resist pattern, and implanting a second conduction type impurity ion in the silicon carbide layer on which the second resist pattern is formed, through the deposition layer.
    • 提供了一种碳化硅半导体器件的制造方法。 该方法包括在形成在碳化硅衬底上的碳化硅层的表面上形成第一抗蚀剂图案,在形成有第一抗蚀剂图案的碳化硅层中注入第一导电型杂质离子,通过 通过蚀刻来减小第一抗蚀剂图案的宽度,并且在没有被第二抗蚀剂图案覆盖的碳化硅层的表面上形成沉积层,以及将第二导电型杂质离子注入到第二抗蚀剂图案的第二 通过沉积层形成抗蚀剂图案。
    • 26. 发明授权
    • Observation system and observation apparatus
    • 观察系统和观察装置
    • US08018194B2
    • 2011-09-13
    • US12401044
    • 2009-03-10
    • Hiroshi Watanabe
    • Hiroshi Watanabe
    • B64C17/06
    • G02B21/24
    • When application software running on a PC is in the state of being terminated, a switch unit is turned OFF with the control of a CPU and individual motors, and in this state, a light source is not supplied with a motor/lamp-use power source. In this state, however, the CPU and individual I/Fs are supplied with a logic-use power source. Therefore, the switch unit is turned ON when the application software is started, and an initialization process for an individual electrically driven unit is no longer required.
    • 当在PC上运行的应用软件处于终止状态时,通过CPU和单独的电动机的控制将开关单元关闭,并且在该状态下,不向光源提供电动机/灯用电力 资源。 然而,在这种状态下,CPU和各个I / F被提供有逻辑电源。 因此,当应用软件启动时,开关单元被接通,并且不再需要用于单独的电驱动单元的初始化处理。
    • 30. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110001209A1
    • 2011-01-06
    • US12867283
    • 2009-03-12
    • Hiroshi WatanabeNaoki YutaniKenichi OhtsukaKenichi KurodaMasayuki ImaizumiYoshinori Matsuno
    • Hiroshi WatanabeNaoki YutaniKenichi OhtsukaKenichi KurodaMasayuki ImaizumiYoshinori Matsuno
    • H01L29/47
    • H01L29/872H01L21/0495H01L24/05H01L29/0619H01L29/1608H01L29/6606H01L2924/12032H01L2924/1306H01L2924/13091H01L2924/00
    • In a termination structure in which a JTE layer is provided, a level or defect existing at an interface between a semiconductor layer and an insulating film, or a minute amount of adventitious impurities that infiltrate into the semiconductor interface from the insulating film or from an outside through the insulating film becomes a source or a breakdown point of a leakage current, which deteriorates a breakdown voltage. A semiconductor device includes: an n− type semiconductor layer formed on an n+ type semiconductor substrate; a first electrode that is formed on the n− type semiconductor layer and functions as a Schottky electrode; a GR layer that is a first p type semiconductor layer formed on a surface of the n− type semiconductor layer below an end of the first electrode and a perimeter thereof; a JTE layer that is formed of a second p type semiconductor layer formed on a bottom and a lateral surface of a groove arranged in a ring shape around the GR layer apart from the GR layer, in a surface of the n− typesemiconductor layer; an insulating film provided so as to cover the GR layer and the JTE layer; and a second electrode that is an Ohmic electrode formed below a rear surface of the n+ type semiconductor substrate.
    • 在提供JTE层的端接结构中,存在于半导体层和绝缘膜之间的界面处的水平或缺陷,或从绝缘膜或外部渗透到半导体界面的少量不定性杂质 通过绝缘膜成为漏电流的源极或击穿点,这会降低击穿电压。 半导体器件包括:形成在n +型半导体衬底上的n型半导体层; 形成在n型半导体层上并用作肖特基电极的第一电极; GR层,其是形成在所述第一电极的端部下方的所述n型半导体层的表面上的第一p型半导体层及其周边; 在所述n型半导体层的表面中形成由形成在所述GR层之外的围绕所述GR层的环状的槽的底部和侧面上形成的第二p型半导体层的JTE层; 设置为覆盖GR层和JTE层的绝缘膜; 以及形成在n +型半导体衬底的后表面下方的欧姆电极的第二电极。