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    • 22. 发明申请
    • Semiconductor device and method of manufacturing such a device
    • 半导体装置及其制造方法
    • US20060202229A1
    • 2006-09-14
    • US10545736
    • 2004-02-12
    • Rob Van DalenPrabhat AgarwalJan SlotboomGerrit Koops
    • Rob Van DalenPrabhat AgarwalJan SlotboomGerrit Koops
    • H01L31/00
    • H01L29/66242H01L29/7378
    • The invention relates to a semiconductor device with a substrate (11) and a semiconductor body (12) with a heterojunction bipolar, in particular npn, transistor with an emitter region (1), a base region (2) and a collector region (3), which are provided with, respectively, a first, a second and a third connection conductor (4, 5, 6), and wherein the bandgap of the base region (2) is smaller than that of the collector region (3) or of the emitter region (1), for example by the use of a silicon-germanium mixed crystal instead of pure silicon in the base region (2). Such a device is characterized by a very high speed, but its transistor shows a relatively low BVeeo. In a device (10) according to the invention the doping flux of the emitter region (1) is locally reduced by a further semiconductor region (20) of the second conductivity type which is embedded in the emitter region (1). In this way, on the one hand, a low-impedance emitter contact is ensured, while locally the Gummel number is increased without the drawbacks normally associated with such an increase. In this way, the hole current in the, npn, transistor is increased and thus the gain is decreased. The relatively high gain of a Si—Ge transistor is responsible for the low BVCeOf which is consequently avoided in a device (10) according to the invention. Preferably the further semiconductor region (20) is recessed in the emitter region (1) and said emitter region (1) preferably comprises a lower doped part that borders on the base region (2) and that is situated below the further semiconductor region (20). The invention also comprises a method of manufacturing a semiconductor device (10) according to the invention.
    • 本发明涉及具有衬底(11)和具有异质结双极性的半导体本体(12)的半导体器件,特别是具有发射极区域(1),基极区域(2)和集电极区域(3)的npn晶体管 ),其分别设置有第一,第二和第三连接导体(4,5,6),并且其中所述基极区域(2)的带隙小于所述集电极区域(3)的带隙或 的发射极区域(1),例如通过在基极区域(2)中使用硅 - 锗混合晶体代替纯硅。 这种器件的特点是非常高的速度,但其晶体管显示相对较低的BVeeo。 在根据本发明的器件(10)中,发射极区域(1)的掺杂通量被嵌入在发射极区域(1)中的第二导电类型的另外的半导体区域(20)局部地减小。 以这种方式,一方面,确保了低阻抗发射极接触,而局部地增加了Gummel数量,而没有通常与这种增加相关联的缺点。 以这种方式,npn晶体管中的空穴电流增加,因此增益降低。 Si-Ge晶体管的相对高的增益负责在本发明的器件(10)中避免的低BVCeOf。 优选地,另外的半导体区域(20)凹陷在发射极区域(1)中,并且所述发射极区域(1)优选地包括在基极区域(2)上接合并位于另外的半导体区域(20)下方的下部掺杂部分 )。 本发明还包括制造根据本发明的半导体器件(10)的方法。
    • 25. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07868424B2
    • 2011-01-11
    • US11658227
    • 2005-07-07
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • H01L21/02
    • H01L29/0821B82Y10/00H01L29/06H01L29/0665H01L29/0673H01L29/0676H01L29/08H01L29/423H01L29/42304H01L29/66242H01L29/737H01L29/7378
    • The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (12) comprising a vertical bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type and the first conductivity type, wherein the collector region (3) comprises a first sub-region (3A) bordering the base region (2) and a second sub-region (3B) bordering the first sub-region (3A) which has a lower doping concentration than the second sub-region (3B), and the transistor is provided with a gate electrode (5) which laterally borders the first sub-region (3A) and by means of which the first sub-region (3A) may be depleted. According to the invention the collector region (3) borders the surface of the semiconductor body (12), while the emitter region (1) is recessed in the semiconductor body (12), and the collector region (3) forms part of a mesa structure (6) formed at the surface of the semiconductor body (12). Such a device (10) has very favorable properties at high frequencies and high voltages and, moreover, is easy to manufacture. In a preferred embodiment the collector (3) comprises a nanowire (30) forming the mesa structure (6).
    • 本发明涉及一种具有衬底(11)和半导体本体(12)的半导体器件(10),该半导体器件包括分别具有发射极区,基极区和集电极区(1,2,3)的垂直双极晶体管 ,第一导电类型,与第一导电类型和第一导电类型相反的第二导电类型,其中集电极区域(3)包括与基极区域(2)接壤的第一子区域(3A) 与第二子区域(3A)接合的第一子区域(3A)的区域(3B),其具有比第二子区域(3B)低的掺杂浓度,并且晶体管设置有与第一子区域横向相邻的栅电极(5) 3A),并且借助于此可以使第一子区域(3A)耗尽。 根据本发明,集电极区域(3)与半导体本体(12)的表面相接触,而发射极区域(1)凹入半导体本体(12)中,并且集电极区域(3)形成台面的一部分 结构(6)形成在半导体本体(12)的表面。 这种装置(10)在高频和高电压下具有非常有利的特性,而且易于制造。 在优选实施例中,收集器(3)包括形成台面结构(6)的纳米线(30)。
    • 27. 发明授权
    • Low voltage differential signalling driver with pre-emphasis
    • 低压差分信号驱动器,预加重
    • US07667502B2
    • 2010-02-23
    • US12092556
    • 2005-11-04
    • Prabhat Agarwal
    • Prabhat Agarwal
    • H03K3/00
    • H04L25/026H03K19/018528
    • There is provided a LVDS driver arranged to receive an input signal which switches between two voltage levels. The driver comprises a pre-emphasis block (405) for generating a pre-emphasis signal having a first voltage level for a time period T1 after each switch of the input signal, and a second voltage level at all other times, a differential pair of outputs for generating a differential output voltage across a load resistor (RI); and a driver circuit (401) comprising two parallel branches, each branch being connected to one output and each branch being arranged to receive the pre-emphasis signal. The driver is arranged so that the total current flowing through the driver circuit is constant, and during time period T1, the total current flowing through the driver circuit flows through the load resistor, thereby producing a differential output voltage and at all other times, only some of the total current flowing through the driver circuit flows through the load resistor, thereby reducing the differential output voltage.
    • 提供了一个LVDS驱动器,其布置成接收在两个电压电平之间切换的输入信号。 驱动器包括预加重块(405),用于在输入信号的每次切换之后产生具有第一电压电平的时间段T1的预加重信号,以及在所有其他时间的第二电压电平的差分对 用于产生负载电阻(RI)两端的差分输出电压的输出; 以及包括两个并行分支的驱动器电路(401),每个分支连接到一个输出端,每个分支被布置成接收预加重信号。 驱动器被布置成使得流过驱动器电路的总电流是恒定的,并且在时间段T1期间,流过驱动器电路的总电流流过负载电阻器,从而产生差分输出电压,并且在所有其他时间仅仅 流过驱动电路的一部分总电流流过负载电阻,从而降低差分输出电压。
    • 29. 发明申请
    • Semiconductor Device and Method of Manufacturing the Same
    • 半导体器件及其制造方法
    • US20080315361A1
    • 2008-12-25
    • US11658227
    • 2005-07-07
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • Godefridus Adrianus Maria HurkxPrabhat AgarwalErwin HijzenRaymond Josephus Engelbart Hueting
    • H01L27/00H01L21/331
    • H01L29/0821B82Y10/00H01L29/06H01L29/0665H01L29/0673H01L29/0676H01L29/08H01L29/423H01L29/42304H01L29/66242H01L29/737H01L29/7378
    • The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (12) comprising a vertical bipolar transistor with an emitter region, a base region and a collector region (1, 2, 3) of, respectively, a first conductivity type, a second conductivity type opposite to the first conductivity type and the first conductivity type, wherein the collector region (3) comprises a first sub-region (3A) bordering the base region (2) and a second sub-region (3B) bordering the first sub-region (3A) which has a lower doping concentration than the second sub-region (3B), and the transistor is provided with a gate electrode (5) which laterally borders the first sub-region (3A) and by means of which the first sub-region (3A) may be depleted. According to the invention the collector region (3) borders the surface of the semiconductor body (12), while the emitter region (1) is recessed in the semiconductor body (12), and the collector region (3) forms part of a mesa structure (6) formed at the surface of the semiconductor body (12). Such a device (10) has very favorable properties at high frequencies and high voltages and, moreover, is easy to manufacture. In a preferred embodiment the collector (3) comprises a nanowire (30) forming the mesa structure (6).
    • 本发明涉及一种具有衬底(11)和半导体本体(12)的半导体器件(10),该半导体器件包括分别具有发射极区,基极区和集电极区(1,2,3)的垂直双极晶体管 ,第一导电类型,与第一导电类型和第一导电类型相反的第二导电类型,其中集电极区域(3)包括与基极区域(2)接壤的第一子区域(3A) 与第二子区域(3A)接合的第一子区域(3A)的区域(3B),其具有比第二子区域(3B)低的掺杂浓度,并且晶体管设置有与第一子区域横向相邻的栅电极(5) 3A),并且借助于此可以使第一子区域(3A)耗尽。 根据本发明,集电极区域(3)与半导体本体(12)的表面相接触,而发射极区域(1)凹入半导体本体(12)中,并且集电极区域(3)形成台面的一部分 结构(6)形成在半导体本体(12)的表面。 这种装置(10)在高频和高电压下具有非常有利的特性,而且易于制造。 在优选实施例中,收集器(3)包括形成台面结构(6)的纳米线(30)。
    • 30. 发明申请
    • Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtained With Such a Method
    • 制造使用这种方法获得的半导体器件和半导体器件的方法
    • US20080237871A1
    • 2008-10-02
    • US12093649
    • 2006-10-27
    • Vijayaraghavan MadakasiraPrabhat AgarwalJohannes Josephus Theodorus Marinus DonkersMark Van Dal
    • Vijayaraghavan MadakasiraPrabhat AgarwalJohannes Josephus Theodorus Marinus DonkersMark Van Dal
    • H01L21/768H01L21/20H01L23/532
    • H01L21/76877H01L21/28525H01L21/76889H01L2221/1094
    • The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semi-conductor body (12) which is provided with at least one semiconductor element (E) and comprising a monocrystalline silicon (1) region on top of which an epitaxial silicon region (2) is formed by providing a metal silicide region (3) on the monocrystalline silicon region (1) and a low-crystallinity silicon region (4) on top of the metal silicide region (3), after which the low-crystallinity silicon region (4) is transformed by heating into the epitaxial silicon region (2) having a high-crystallinity, during which process the metal silicide region (3) is moved from the bottom of the low-crystallinity silicon region (4) to the top of the epitaxial silicon region (2). According to the invention above the level of the metal silicide region (3) an insulating layer (5) is formed which is provided with an opening (6), the low-crystallinity silicon region (4) is deposited in the opening (6) and on top of the insulating layer (5), the part (4A, 4B) of the low-crystallinity silicon region (4) on top of the insulating layer (5) is removed by a planarization process after which the epitaxial silicon region (2) is formed. In this way an epitaxial silicon region (2), preferably a nano wire (2), is simply obtained that is provided with a metal silicide contact (region) in a self-aligned manner and that can form a part of semiconductor element (E) like a transistor.
    • 本发明涉及一种制造半导体器件(10)的方法,所述半导体器件(10)具有衬底(11)和半导体本体(12),所述半导体本体(12)设置有至少一个半导体元件(E)并且包括单晶硅(1)区域 通过在单晶硅区域(1)上提供金属硅化物区域(3)并且在金属硅化物区域(3)的顶部上提供低结晶度硅区域(4),在其上形成外延硅区域(2) 之后,通过加热将低结晶性硅区域(4)变换为具有高结晶度的外延硅区域(2),在该过程中,金属硅化物区域(3)从低结晶度的底部移动 硅区域(4)到外延硅区域(2)的顶部。 根据本发明,金属硅化物区域(3)的水平形成有形成有开口(6)的绝缘层(5),低结晶度硅区域(4)沉积在开口(6)中, 并且在绝缘层(5)的顶部,通过平坦化工艺除去绝缘层(5)顶部上的低结晶性硅区域(4)的部分(4A,4B),然后将外延硅 形成区域(2)。 以这种方式,简单地获得外延硅区域(2),优选纳米线(2),其以自对准的方式设置有金属硅化物接触(区域),并且可以形成半导体元件(E )像晶体管。