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21. 发明申请

US20070041199A1 ILLUMINATOR, LED ILLUMINATOR, AND IMAGING DEVICE WITH ILLUMINATOR 审中-公开
标题翻译：照明器，LED照明器和具有照明器的成像装置
公开(公告)号：US20070041199A1
公开(公告)日：2007-02-22
申请号：US11464381
申请日：2006-08-14
申请人： Naotada OKADA , Miki Mori
发明人： Naotada OKADA , Miki Mori
IPC分类号： F21V5/00
CPC分类号： G02B27/0961 , F21V5/045 , F21V14/06 , F21W2131/405 , F21W2131/406 , F21Y2115/10 , G02B27/0927 , G03B15/02 , H04N5/2256
摘要： The invention comprises an imaging mechanism, and an LED illuminator which emits illuminating light to an imaging area of the imaging mechanism. The LED illuminator includes a light emitting module having light emitting elements arranged therein, a Fresnel lens which brings light from the light emitting module into parallel rays of light, a pair of lens arrays arranged in a direction of light coming from the light source, the pair of lens arrays shaping the parallel rays of light produced by the Fresnel lens into a rectangle, and an adjustment mechanism which adjusts an interval between the lens arrays in accordance with an imaging area of the imaging mechanism.
摘要翻译：本发明包括成像机构和向成像机构的成像区域发射照明光的LED照明器。 LED照明器包括发光模块，其中布置有发光元件，将来自发光模块的光带入平行光线的菲涅耳透镜，沿着来自光源的光的方向排列的一对透镜阵列，将由菲涅耳透镜产生的平行光线成形为矩形的一对透镜阵列，以及根据成像机构的成像区域调整透镜阵列之间的间隔的调节机构。

22. 发明授权

US5864178A Semiconductor device with improved encapsulating resin 失效
标题翻译：具有改进的封装树脂的半导体器件
公开(公告)号：US5864178A
公开(公告)日：1999-01-26
申请号：US580978
申请日：1996-01-03
申请人： Hiroshi Yamada , Takasi Togasaki , Masayuki Saito , Soichi Honma , Miki Mori , Kazuki Tateyama
发明人： Hiroshi Yamada , Takasi Togasaki , Masayuki Saito , Soichi Honma , Miki Mori , Kazuki Tateyama
IPC分类号： H01L21/56 , H01L23/31 , H01L21/60 , H01L23/28
CPC分类号： H01L23/3135 , H01L21/563 , H01L23/3121 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/26175 , H01L2224/27013 , H01L2224/29034 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83051 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/92125 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/15151 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/3025 , H01L2924/3511
摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.
摘要翻译：一种半导体器件，包括布线电路板和通过电路板上的凸块电极安装的半导体芯片，电路板和半导体芯片之间的空间以及半导体芯片的外围被包含填料的树脂封装。该树脂由设置在位于半导体芯片的最外周上的凸起电极包围的区域中的第一树脂，以及设置在不包围位于半导体芯片的最外周边的凸块电极的区域中的第二树脂构成，第一和第二树脂在选自填料的含量，最大粒径和平均粒径的至少一个特征中彼此不同。

23. 发明授权

US5071787A Semiconductor device utilizing a face-down bonding and a method for manufacturing the same 失效
标题翻译：利用面向下接合的半导体器件及其制造方法
公开(公告)号：US5071787A
公开(公告)日：1991-12-10
申请号：US477504
申请日：1990-02-09
申请人： Miki Mori , Masayuki Saito
发明人： Miki Mori , Masayuki Saito
IPC分类号： B23K35/00 , H01L21/56 , H01L21/603 , H01L23/485
CPC分类号： H01L24/11 , B23K35/001 , H01L21/563 , H01L24/13 , H01L24/28 , H01L24/81 , H01L2224/11003 , H01L2224/11822 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81409 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , Y10T29/49144
摘要： In a semiconductor device including a substrate having a wiring layer formed on its major surface and a semiconductor element having an electrode formed on its major surface in which a face-down bonding is achieved with the major surface of the semiconductor element oppositely facing that major surface of the semiconductor substrate which is located opposite to the electrode on the semiconductor element, first bumps formed of gold are formed on the electrode of the semiconductor element, second bumps formed of an indium/tin alloy are formed on the first bumps and an electrical and mechanical bond is achieved, by the second bumps, between the first bumps and the wiring layer in which case the second bumps are heated to an extent not exceeding the melting point of the second bumps.

24. 发明授权

US4857482A Method of forming bump electrode and electronic circuit device 失效
标题翻译：形成凸块电极和电子电路器件的方法
公开(公告)号：US4857482A
公开(公告)日：1989-08-15
申请号：US213249
申请日：1988-06-29
申请人： Masayuki Saito , Akira Niitsuma , Hirosi Ohdaira , Chiaki Tanuma , Miki Mori
发明人： Masayuki Saito , Akira Niitsuma , Hirosi Ohdaira , Chiaki Tanuma , Miki Mori
IPC分类号： H01L21/56 , H01L21/60 , H01L23/485 , H05K3/34
CPC分类号： H05K3/3478 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L24/96 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/73203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/0517 , H05K2203/105 , H05K3/1266 , Y10T29/49139 , Y10T29/53174
摘要： A support is formed and comprises a base, a resin layer which is formed on the base and on recesses which are formed on a surface of the base, and a conductive layer which is formed on a portion of a surface of the resin layer, other than where the recesses are formed. The surface of the recesses is electrically charged by way of a corona discharge to create static electricity in the recesses. Metal balls to be formed into bump electrodes are held in the recesses by way of the static electricity. Then, each of the metal balls is bonded to a corresponding electrode terminal of an electronic component by hot press unit while the electronic component is opposed to the support.
摘要翻译：形成支撑体，其包括基体，形成在基材上的树脂层和形成在基材的表面上的凹部，以及形成在树脂层的表面的一部分上的导电层，其他比形成凹部的情况更好。凹槽的表面通过电晕放电而充电，以在凹部中产生静电。要形成凸起电极的金属球通过静电保持在凹槽中。然后，当电子元件与支撑件相对时，通过热压单元将每个金属球结合到电子元件的对应电极端子。

25. 发明授权

US07673905B2 Lock device of sliding mechanism 失效
标题翻译：滑动机构锁定装置
公开(公告)号：US07673905B2
公开(公告)日：2010-03-09
申请号：US11705560
申请日：2007-02-12
申请人： Daisuke Fujii , Miki Mori , Yasuki Motozawa
发明人： Daisuke Fujii , Miki Mori , Yasuki Motozawa
IPC分类号： B60R22/46 , B60R22/195
CPC分类号： B60R22/1951 , B60R22/1955 , B60R22/24
摘要： In a lock device of a sliding mechanism, a pair of locking claws provided on a moving member are brought into resilient engagement with locking grooves of a locking groove group, whereby downward sliding of the moving member is permitted but upward sliding thereof is locked. The distance between the locking claws is longer than distance between the locking grooves, so that the moving member becomes locked against upward sliding at an interval smaller than the distance between the locking grooves. Thus, the moving member adapted to slide in one (downward) direction along a guide rail can be reliably locked against movement in the opposite (upward) direction at a very small interval.
摘要翻译：在滑动机构的锁定装置中，设置在移动构件上的一对锁定爪与锁定槽组的锁定槽弹性接合，从而允许移动构件的向下滑动，但是其向上滑动被锁定。锁定爪之间的距离长于锁定槽之间的距离，使得移动构件以小于锁定槽之间的间隔的间隔被锁定以防止向上滑动。因此，适于沿着导轨沿一个（向下）方向滑动的移动部件能够以相当的间隔在相反（向上）方向上被可靠地锁定。

26. 发明授权

US5594768A Laminograph and inspection and repair device using the same 失效
标题翻译： Laminograph和检修装置使用相同
公开(公告)号：US5594768A
公开(公告)日：1997-01-14
申请号：US439106
申请日：1995-05-11
申请人： Masashi Fujii , Kiichiro Uyama , Takeo Tsuchiya , Miki Mori , Hideo Kosuge , Hirokatsu Suzuki
发明人： Masashi Fujii , Kiichiro Uyama , Takeo Tsuchiya , Miki Mori , Hideo Kosuge , Hirokatsu Suzuki
IPC分类号： G01N23/04 , H05K13/08
CPC分类号： G01N23/046 , H05K13/08 , G01N2223/419
摘要： A laminograph including, a radiation source for generating radiation towards a subject, a radiation surface sensor device with a two-dimensional resolution, fitted opposite to the radiation source for detecting the radiation from the radiation source which has passed through the subject, a scanning device for moving the subject to take a plurality of different positions between the radiation source and the radiation surface sensor device and for scanning the subject in each of the different positions by the radiation from the radiation source. The laminograph further includes a data collection device for collecting the plurality of outputs of the radiation surface sensor device during the scanning by the scanning device to obtain the plurality of radiographic images of the subject in the different positions, a position measurement device for measuring multiple positions of a focal plane at multiple places of the subject, a displacement measurement device for measuring multiple displacement based on the multiple positions of the focal plane measured by the position measurement device, and an image processing device for adding and averaging the plurality of radiographic images with the displacements to obtain a radiographic image of the subject focused on the focal plane as a tomographic image of the subject.
摘要翻译：一种液晶显示器，包括用于向被摄体产生辐射的辐射源，具有二维分辨率的辐射表面传感器装置，其与辐射源相对安装，用于检测来自已经穿过被摄体的辐射源的辐射;扫描装置用于移动受试者以在辐射源和辐射表面传感器装置之间采取多个不同位置，并且用于通过来自辐射源的辐射在每个不同位置扫描对象。所述液晶显示装置还包括数据采集装置，用于在扫描装置扫描期间收集辐射表面传感器装置的多个输出，以获得不同位置的被摄体的多个放射照相图像，用于测量多个位置的位置测量装置基于由所述位置测量装置测量的所述焦平面的多个位置来测量多个位移的位移测量装置，以及用于对所述多个放射线图像进行加和平均化的图像处理装置，以获得作为被摄体的断层图像的聚焦在焦平面上的被摄体的放射线照相图像的位移。

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