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21. 发明申请

US20210062024A1 ARTICLE PREPARED BY INKJET PRINTING 有权
公开(公告)号：US20210062024A1
公开(公告)日：2021-03-04
申请号：US16551908
申请日：2019-08-27
申请人： Eastman Kodak Company
发明人： Mark Edward Irving , David D. Putnam , Allan Francis Sowinski , Barbara Boland Lussier , Todd Russell Griffin , Douglas Eugene Bugner
IPC分类号： C09D11/322 , B41J2/005
摘要： An inkjet-printed article has an ink receptive medium with a substrate and an aqueous-based ink-receptive layer disposed thereon. The aqueous-based ink-receptive layer includes: (a) a water-soluble salt of a multivalent metal cation at 0.6-49 weight %; (b) one or both of a polyvinyl alcohol and a polyvinyl amine (or a copolymer derived from a vinyl alcohol and a vinyl amine) at 0.5-30 weight %; and optionally, (c) a crosslinking agent or (d) silica particles. The article also has an inkjet-printed image disposed on the aqueous-based ink-receptive layer, provided from one or more aqueous pigment-based inks, each of which has a) an anionically-stabilized pigment colorant; b) one or more water-miscible humectants at a total amount of 1-20 weight %, each of which has a carbon atom to oxygen atom ratio of at least 1.0:1.0 and only two hydroxy groups.

22. 发明授权

US10858529B2 Aqueous pre-treatment compositions for inkjet printing 有权
公开(公告)号：US10858529B2
公开(公告)日：2020-12-08
申请号：US16106033
申请日：2018-08-21
申请人： Eastman Kodak Company
发明人： Mark Edward Irving , Thomas Joseph Dannhauser
IPC分类号： C09D11/54 , C09D11/38 , C09D11/037 , C09D11/106 , C09D11/033 , C09D11/322
摘要： An aqueous composition can be used for pre-treating a substrate prior to inkjet printing. This composition includes: (a) one or more water-soluble salts of a multivalent metal cation; and (b) composite particles having a Rockwell Hardness of less than or equal to R90 and each of the composite particles comprising domains of a (i) first organic polymer and domains of a (ii) second organic polymer. The domains of the (ii) second organic polymer are dispersed within the domains of the (i) first organic polymer. Moreover, the melting point of the (i) first organic polymer is lower than the melting point of the (ii) second organic polymer. The weight ratio of the (i) first organic polymer to the (ii) second organic polymer is chosen such that the (b) composite particles have a density of 1.0-1.5 g/ml.

23. 发明申请

US20200062985A1 AQUEOUS PRE-TREATMENT COMPOSITIONS FOR INKJET PRINTING 审中-公开
公开(公告)号：US20200062985A1
公开(公告)日：2020-02-27
申请号：US16106033
申请日：2018-08-21
申请人： Eastman Kodak Company
发明人： Mark Edward Irving , Thomas Joseoh Dannhauser
IPC分类号： C09D11/54 , C09D11/38 , C09D11/322 , C09D11/106 , C09D11/033 , C09D11/037
摘要： An aqueous composition can be used for pre-treating a substrate prior to inkjet printing. This composition includes: (a) one or more water-soluble salts of a multivalent metal cation; and (b) composite particles having a Rockwell Hardness of less than or equal to R90 and each of the composite particles comprising domains of a (i) first organic polymer and domains of a (ii) second organic polymer. The domains of the (ii) second organic polymer are dispersed within the domains of the (i) first organic polymer. Moreover, the melting point of the (i) first organic polymer is lower than the melting point of the (ii) second organic polymer. The weight ratio of the (i) first organic polymer to the (ii) second organic polymer is chosen such that the (b) composite particles have a density of 1.0-1.5 g/ml.

24. 发明授权

US09329481B2 Electroless plating method using halide 有权
标题翻译：使用卤化物的无电镀法
公开(公告)号：US09329481B2
公开(公告)日：2016-05-03
申请号：US14084969
申请日：2013-11-20
申请人： Eastman Kodak Company
发明人： Mark Edward Irving
IPC分类号： G03F7/004 , G03F7/16 , G03F7/20 , G03F7/11
CPC分类号： G03F7/16 , G03F7/0045 , G03F7/038 , G03F7/11 , G03F7/20 , G03F7/26 , G03F7/265 , Y10T428/24802
摘要： A conductive metal pattern is formed using a reactive polymer that can provide pendant sulfonic acid groups upon exposure to radiation, and (2) pendant groups that are capable of providing crosslinking. The polymeric layer is patternwise exposed to radiation to provide first exposed regions that are then contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, followed by contact with a halide. At least some of the electroless seed metal halide can be exposed to form second exposed regions. The polymeric layer can be contacted with a reducing agent either: (i) to develop the electroless seed metal image in the second exposed regions, or (ii) to develop all of the electroless seed metal halide in the first exposed regions, and optionally contacted with a fixing agent. The electroless seed metal nuclei in the first exposed regions can be electrolessly plated with a conductive metal.
摘要翻译：使用可以在暴露于辐射时提供侧链磺酸基团的反应性聚合物形成导电金属图案，和（2）能够提供交联的侧基。将聚合物层图案地暴露于辐射以提供第一暴露区域，然后与无电晶种金属离子接触以形成无电子种子金属离子的图案，然后与卤化物接触。至少一些无电子种子金属卤化物可以暴露以形成第二暴露区域。聚合物层可以与还原剂接触，即：（i）在第二暴露区域中显影无电子种子金属图像，或（ii）在第一曝光区域中显影所有无电子种子金属卤化物，并任选地接触用固定剂。第一暴露区域中的无电晶种金属核可以用导电金属无电镀。

25. 发明授权

US09316914B2 Electroless plating method using non-reducing agent 有权
标题翻译：无电镀法使用非还原剂
公开(公告)号：US09316914B2
公开(公告)日：2016-04-19
申请号：US14085030
申请日：2013-11-20
申请人： Eastman Kodak Company
发明人： Mark Edward Irving
IPC分类号： G03F7/26 , G03F7/16 , G03F7/20 , G03F7/11
CPC分类号： G03F7/16 , G03F7/0045 , G03F7/038 , G03F7/11 , G03F7/20 , G03F7/26 , G03F7/265 , Y10T428/24802
摘要： A conductive metal pattern can be formed in a polymeric layer that has a reactive polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to provide non-exposed regions and exposed regions comprising a polymer comprising pendant sulfonic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. This pattern can be contacted with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40, and which is electrolessly plated with a conductive metal.
摘要翻译：可以在具有反应性聚合物的聚合物层中形成导电金属图案，所述反应性聚合物包含（1）在暴露时能够提供侧链磺酸基的侧基，和（2）能够在存在下反应的侧基磺酸基团提供交联。图案化地暴露聚合物层以提供非暴露区域和包含包含侧链磺酸基团的聚合物的暴露区域。暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。该图案可以与非还原剂接触，其与无电子种子金属离子反应形成pKsp小于40的无电解种子金属化合物，并且其被无电镀上导电金属。

26. 发明授权

US09122161B2 Electroless plating method using bleaching 有权
标题翻译：化学镀方法使用漂白
公开(公告)号：US09122161B2
公开(公告)日：2015-09-01
申请号：US14071951
申请日：2013-11-05
申请人： EASTMAN KODAK COMPANY
发明人： Mark Edward Irving , Thomas B. Brust
IPC分类号： G03F7/20 , G03F7/038 , C23C18/30 , G03F7/16 , G03F7/26 , C23C18/16 , G03F7/40
CPC分类号： G03F7/16 , C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/166 , C23C18/204 , C23C18/2086 , G03F7/038 , G03F7/0392 , G03F7/265 , G03F7/405
摘要： A conductive pattern can be formed a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, (c) a crosslinking agent that is capable of reacting in the presence of the acid, and (d) optionally, a photosensitizer. The polymeric layer is patternwise exposed to provide non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. Both the non-exposed regions and the exposed regions of the polymeric layer are contacted with a reducing agent, bleached to remove surface amounts of the reducing agent in both non-exposed and exposed regions of the polymeric layer, and contacted with electroless seed metal ions to oxidize the reducing agent and to form corresponding electroless seed metal nuclei in the exposed regions. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.
摘要翻译：可以形成导电图案，该反应性聚合物包括叔烷基酯基团，（b）暴露于辐射时提供酸的化合物，（c）能够在酸存在下反应的交联剂和（ d）任选的光敏剂。聚合物层被图案化地暴露以提供非暴露区域和包含包含羧酸基团的聚合物的暴露区域。未曝光区域和聚合物层的暴露区域与还原剂接触，漂白以除去聚合物层的未曝光和暴露区域中的表面量的还原剂，并与无电晶种金属离子以在曝光区域中氧化还原剂并形成相应的无电子种子金属核。然后将相应的无电子种子金属核用导电金属无电镀。

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