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21. 发明授权

US10188853B2 Flexible circuit electrode array with a drum stress relief 有权
公开(公告)号：US10188853B2
公开(公告)日：2019-01-29
申请号：US12044830
申请日：2008-03-07
申请人： Rajat Agrawal , Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Brian V. Mech , Jordan Matthew Neysmith , Neil Hamilton Talbot , Dao Min Zhou
发明人： Rajat Agrawal , Robert J. Greenberg , Mark S. Humayun , James Singleton Little , Brian V. Mech , Jordan Matthew Neysmith , Neil Hamilton Talbot , Dao Min Zhou
IPC分类号： A61N1/05 , A61N1/36
摘要： The present invention is a flexible circuit electrode array with a polymer base layer, metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue, a polymer top layer deposited on the polymer base layer and the metal traces, and a soft polymer filling a void through both the polymer base layer and polymer top layer, the soft polymer forming drum stress relief around an attachment point.

22. 发明授权

US08510939B2 Retinal prosthesis with a new configuration 有权
标题翻译：视网膜假体具有新配置
公开(公告)号：US08510939B2
公开(公告)日：2013-08-20
申请号：US11924696
申请日：2007-10-26
申请人： Robert J. Greenberg , Matthew J. McMahon , James Singleton Little , Kelly H. McClure , Brian V. Mech , Neil Hamilton Talbot , Jordan M. Neysmith
发明人： Robert J. Greenberg , Matthew J. McMahon , James Singleton Little , Kelly H. McClure , Brian V. Mech , Neil Hamilton Talbot , Jordan M. Neysmith
IPC分类号： H01K3/22
CPC分类号： A61N1/36046 , A61N1/0543 , A61N1/37223 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K3/0014 , H05K3/28 , H05K2201/0133 , H05K2201/09018 , H05K2201/09145 , H05K2201/09909 , H05K2201/2009 , H05K2203/1105 , H05K2203/1476 , H05K2203/302 , Y10T29/49158
摘要： Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.
摘要翻译：聚合物材料可用作神经刺激的电极阵列体。它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。太小的压力会导致电阻增加以及电场分散。太大的压力可能会阻止血液流动。通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。通过将适量的热应用于完整的阵列，可以引起曲线。对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。此外，沿着边缘添加材料是有利的。在柔性电路阵列中提供折叠或扭曲是更有利的。可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

23. 发明授权

US08412339B2 Package for an implantable neural stimulation device 有权
标题翻译：可植入神经刺激装置的包装
公开(公告)号：US08412339B2
公开(公告)日：2013-04-02
申请号：US11924709
申请日：2007-10-26
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/18
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译：本发明是用于植入人体的改进的密封包装。可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

24. 发明授权

US08145322B1 Flexible circuit electrode array device and a method for backside processing of a flexible circuit electrode device 有权
标题翻译：柔性电路电极阵列器件及柔性电路电极器件的背面处理方法
公开(公告)号：US08145322B1
公开(公告)日：2012-03-27
申请号：US12177038
申请日：2008-07-21
申请人： Qingfang Yao , Jordan Matthew Neysmith , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Qingfang Yao , Jordan Matthew Neysmith , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/04
CPC分类号： A61N1/05 , A61N1/0541 , A61N1/0543 , B23K26/361 , B23K26/362
摘要： The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.
摘要翻译：本发明涉及一种柔性电路电极阵列器件，包括：聚合物层; 其中所述聚合物层包括一个或多个金属迹线，电极阵列; 一个或多个接合垫; 并且电极阵列位于聚合物层的相对侧上。本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：在基底上施加聚合物膜; 正面加工; 从基材中释放聚合物膜; 翻转在聚合物膜上并将其固定在基底上; 处理背面; 并从基底中最终释放聚合物膜。本发明还涉及一种用于柔性电路电极器件的背面处理的方法，包括：处理前侧而不释放聚合物; 通过牺牲基板方法或通过激光钻孔方法处理背面; 并从基板上释放聚合物膜。

25. 发明申请

US20080288036A1 Flexible Circuit Electrode Array with Wire or Film Support 有权
标题翻译：带电线或薄膜支架的柔性电路电极阵列
公开(公告)号：US20080288036A1
公开(公告)日：2008-11-20
申请号：US12032627
申请日：2008-02-15
申请人： Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
发明人： Robert J. Greenberg , Eugene de Juan , Mark S. Humayun , Kelly H. McClure , Neil Hamilton Talbot , Jordan Matthew Neysmith , Brian V. Mech , James Singleton Little , Mohamed Khaldi
IPC分类号： A61N1/04
CPC分类号： A61N1/0543 , A61N1/05 , A61N1/0541 , H05K1/0393 , H05K1/118
摘要： The disclosure relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and at least one support embedded in said array. The disclosure further relates to a flexible circuit electrode array comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a folded flexible circuit cable connecting the electrode array with an interconnection pad. The disclosure further relates to a method of making a flexible circuit electrode array comprising: depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array, embedding a support at least in the base layer, top layer or between the base and top layer, and/or folding a flexible circuit cable at least once connecting the electrode array with an interconnection pad the array.
摘要翻译：本发明涉及柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及嵌入在所述阵列中的至少一个支撑。本发明还涉及一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及将电极阵列与互连衬垫连接的折叠柔性电路电缆。本公开还涉及一种制造柔性电路电极阵列的方法，包括：沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 将所述柔性电路电极阵列加热到模具中以在所述柔性电路电极阵列中形成三维形状，至少在基层，顶层或基底与顶层之间嵌入支撑件，和/或折叠柔性电路电缆至少一次将电极阵列与互连衬垫连接在一起。

26. 发明授权

US10159832B2 Electrode with increased stability and method of manufacturing the same 有权
公开(公告)号：US10159832B2
公开(公告)日：2018-12-25
申请号：US11924763
申请日：2007-10-26
申请人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
发明人： Dao Min Zhou , Jerry Ok , Neil Hamilton Talbot , Brian V. Mech , James Singleton Little , Robert J. Greenberg
IPC分类号： C25D5/02 , A61N1/05 , A61N1/36
摘要： The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention further provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.

27. 发明授权

US08406887B2 Package for an implantable neural stimulation device 有权
公开(公告)号：US08406887B2
公开(公告)日：2013-03-26
申请号：US13224104
申请日：2011-09-01
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61N1/375
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.

28. 发明申请

US20120136415A1 Method for Inspection of Materials for Defects 有权
标题翻译：检测缺陷材料的方法
公开(公告)号：US20120136415A1
公开(公告)日：2012-05-31
申请号：US13360480
申请日：2012-01-27
申请人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
发明人： Boozarjomehr Faraji , Kevin Jun Ha , Neil Hamilton Talbot , James Singleton Little , Robert J. Greenberg
IPC分类号： A61N1/375 , B65D6/00 , G01N29/04 , A61F9/08
CPC分类号： A61N1/0543 , A61N1/0526 , A61N1/36046 , A61N1/375 , G01N29/00 , G01N29/26
摘要： The present invention is a non-destructive method of inspecting a bond, particularly a braze bond, in a hermetic package. The invention involves a unique hermetic package design adapted for ultrasonic inspection and a method of inspecting the package. This package and non-destructive inspection process are particularly useful in implantable neural stimulators such as visual prostheses.
摘要翻译：本发明是一种在密封包装中检查粘合剂，特别是钎焊粘合剂的非破坏性方法。本发明涉及适用于超声波检查的独特的密封包装设计和检查包装的方法。该包装和非破坏性检查过程在可植入的神经刺激器如视觉假体中特别有用。

29. 发明申请

US20110319963A1 Package for an Implantable Neural Stimulation Device 有权
标题翻译：可植入神经刺激装置的包装
公开(公告)号：US20110319963A1
公开(公告)日：2011-12-29
申请号：US13224104
申请日：2011-09-01
申请人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
发明人： Jerry Ok , Robert J. Greenberg , Neil Hamilton Talbot , James Singleton Little , Rongqing Dai , Jordan Matthew Neysmith , Kelly H. McClure
IPC分类号： A61F9/08
CPC分类号： A61N1/36046 , A61F15/001 , A61N1/0529 , A61N1/0543 , A61N1/36125 , A61N1/375 , H01L23/055 , H01L23/06 , H01L23/08 , H01L23/10 , H01L24/16 , H01L24/48 , H01L25/18 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
摘要翻译：本发明是用于植入人体的改进的密封包装。可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

30. 发明授权

US08078284B2 Retinal prosthesis with a new configuration 有权
标题翻译：视网膜假体具有新配置
公开(公告)号：US08078284B2
公开(公告)日：2011-12-13
申请号：US11523965
申请日：2006-09-19
申请人： Robert J. Greenberg , Matthew J. McMahon , James Singleton Little , Kelly H. McClure , Brian V. Mech , Neil Hamilton Talbot , Jordan M. Neysmith
发明人： Robert J. Greenberg , Matthew J. McMahon , James Singleton Little , Kelly H. McClure , Brian V. Mech , Neil Hamilton Talbot , Jordan M. Neysmith
IPC分类号： A61N1/00
CPC分类号： A61N1/36046 , A61N1/0543 , A61N1/37223 , H05K1/028 , H05K1/0281 , H05K1/118 , H05K3/0014 , H05K3/28 , H05K2201/0133 , H05K2201/09018 , H05K2201/09145 , H05K2201/09909 , H05K2201/2009 , H05K2203/1105 , H05K2203/1476 , H05K2203/302 , Y10T29/49158
摘要： Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.
摘要翻译：聚合物材料可用作神经刺激的电极阵列体。它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。太小的压力会导致电阻增加以及电场分散。太大的压力可能会阻止血液流动。通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。通过将适量的热应用于完整的阵列，可以引起曲线。对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。此外，沿着边缘添加材料是有利的。在柔性电路阵列中提供折叠或扭曲是更有利的。可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

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