专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US07405485B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07405485B2
公开(公告)日：2008-07-29
申请号：US10573772
申请日：2005-06-09
申请人： Kazumasa Tanida , Tadahiro Morifuji , Osamu Miyata
发明人： Kazumasa Tanida , Tadahiro Morifuji , Osamu Miyata
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3114 , H01L24/20 , H01L24/48 , H01L24/82 , H01L2224/04105 , H01L2224/05001 , H01L2224/05023 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05684 , H01L2224/12105 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73209 , H01L2224/73265 , H01L2224/73267 , H01L2225/06513 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/04953 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device provided with a first semiconductor chip having a first functional surface formed with a first functional element and a first rear surface, a second semiconductor chip having a second functional surface which is formed with a second functional element, the second functional surface having a region opposed to the first functional surface of the first semiconductor chip and a non-opposed region defined outside the opposed region, a connection member electrically connecting the first functional element and the second functional element, an insulation film continuously covering the non-opposed region of the second semiconductor chip and the first rear surface of the first semiconductor chip, a rewiring layer provided on a surface of the insulation film, a protective resin layer covering the rewiring layer, and an external connection terminal projecting from the rewiring layer through the protective resin layer.
摘要翻译：一种具有第一半导体芯片的半导体器件，具有形成有第一功能元件和第一后表面的第一功能面，具有形成有第二功能元件的第二功能面的第二半导体芯片，所述第二功能面具有与第一半导体芯片的第一功能表面相对的区域和限定在相对区域外部的非对置区域，将第一功能元件和第二功能元件电连接的连接构件，连续地覆盖第一功能元件的非对置区域的绝缘膜，第二半导体芯片和第一半导体芯片的第一后表面，设置在绝缘膜的表面上的再布线层，覆盖重新布线层的保护树脂层和从再布线层穿过保护树脂突出的外部连接端子层。

22. 发明申请

US20080006910A1 Semiconductor Device and Method for Manufacturing Semiconductor Device 有权
标题翻译：半导体器件及半导体器件制造方法
公开(公告)号：US20080006910A1
公开(公告)日：2008-01-10
申请号：US11667849
申请日：2005-11-16
申请人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
发明人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
IPC分类号： H01L23/29 , H01L21/56
CPC分类号： H01L23/3178 , H01L21/78 , H01L23/291 , H01L23/293 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/528 , H01L23/544 , H01L23/562 , H01L24/02 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2223/5446 , H01L2224/02255 , H01L2224/0226 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/10161 , H01L2924/10253 , H01L2924/12042 , H01L2924/182 , H01L2924/186 , H01L2924/3025 , H01L2924/00 , H01L2224/13 , H01L2924/00014 , H01L2924/00012
摘要： An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
摘要翻译：本发明的半导体器件包括具有钝化膜的半导体芯片和设置在钝化膜上方的密封树脂层，用于密封半导体芯片的正面。密封树脂层延伸到钝化膜的侧表面以覆盖侧表面。

23. 发明申请

US20070230153A1 Semiconductor Device 有权
标题翻译：半导体器件
公开(公告)号：US20070230153A1
公开(公告)日：2007-10-04
申请号：US11597422
申请日：2005-09-01
申请人： Kazumasa Tanida , Osamu Miyata
发明人： Kazumasa Tanida , Osamu Miyata
IPC分类号： H01L23/488
CPC分类号： H01L24/81 , H01L23/49811 , H01L24/16 , H01L25/0657 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13609 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83102 , H01L2224/92125 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/05099
摘要： A semiconductor device is provided with: a solid device having a connection surface formed with a connection electrode projected therefrom; a semiconductor chip which has a functional surface formed with a metal bump projected therefrom and which is bonded to the connection surface of the solid device as directing its functional surface to the connection surface and maintaining a predetermined distance between the functional surface and the connection surface; and a connecting member containing a low melting point metal having a lower solidus temperature than that of the connection electrode and the bump, and interconnecting the connection electrode and the bump. A sum of a height of the connection electrode and a height of the bump is not less than a half of the predetermined distance.
摘要翻译：半导体器件具有：固体器件，其具有形成有从其突出的连接电极的连接表面; 半导体芯片，其具有形成有从其突出的金属凸块的功能表面，并且将其功能表面指向连接表面并且在功能表面和连接表面之间保持预定距离，并将其粘结到固体设备的连接表面; 以及连接构件，其包含具有比连接电极和凸块的固相线低的固相线温度的低熔点金属，并且使连接电极和凸块相互连接。连接电极的高度和凸起的高度之和不小于预定距离的一半。

24. 发明申请

US20070200249A1 Wiring Board And Semiconductor Device 有权
标题翻译：接线板和半导体器件
公开(公告)号：US20070200249A1
公开(公告)日：2007-08-30
申请号：US10593393
申请日：2005-08-04
申请人： Kazumasa Tanida , Osamu Miyata
发明人： Kazumasa Tanida , Osamu Miyata
IPC分类号： H01L23/48
CPC分类号： H05K3/3452 , H01L23/49811 , H01L23/49866 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/05624 , H01L2224/13006 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/16225 , H01L2224/29109 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/48 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/15313 , H01L2924/3841 , H05K3/3436 , H05K2201/0989 , H05K2201/10674 , H05K2201/10977 , H01L2924/0132 , H01L2924/00 , H01L2224/05552
摘要： The invention provides a wiring board (2,15) to which a semiconductor chip (3) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode (14) that is formed on a bonding surface (2a, 15a) to which the semiconductor chip is to be bonded and that is used to make a connection with the semiconductor chip, an insulating film (6) that is formed on the bonding surface and that has an opening (6a) to expose the connection electrode, and a low-melting-point metallic part (16) that is provided on the connection electrode in the opening and that is made of a low-melting-point metallic material whose solidus temperature is lower than that of the connection electrode.
摘要翻译：本发明提供了一种将半导体芯片的表面朝向布线板引导的要接合半导体芯片（3）的布线板（2,15）。布线基板包括连接电极（14），其形成在要与半导体芯片接合的接合面（2a，15a）上并用于与半导体芯片连接的绝缘膜（14） 6），其形成在接合面上并具有露出连接电极的开口（6a）和设置在开口中的连接电极上的低熔点金属部分（16）的固相线温度低于连接电极的低熔点金属材料。

25. 发明授权

US06541844B2 Semiconductor device having substrate with die-bonding area and wire-bonding areas 有权
公开(公告)号：US06541844B2
公开(公告)日：2003-04-01
申请号：US09906436
申请日：2001-07-16
申请人： Osamu Miyata , Ichirou Kishimoto
发明人： Osamu Miyata , Ichirou Kishimoto
IPC分类号： H01L23495
CPC分类号： H01L24/97 , H01L23/49838 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/92247 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device includes a substrate, and the substrate is formed with a wiring pattern on its surface. The wiring pattern includes electrodes, wire-bonding (WB) pads and connecting portions for connecting the electrodes and the WB pads. The WB pads are so formed that the lengthwise directions thereof are in parallel or approximately in parallel to lines, in radiative form, extending from the center of a die-bonding (DB) area. Accordingly, if a chip having a first size is die-bonded within the DB area, bonding wires become approximately in parallel to the lengthwise directions of the WB pads. Even if a chip having a second size smaller than the first size but the same shape is die-bonded, the bonding wires are also in parallel to the lengthwise directions of the WB pads. Thus, since one substrate can be used regardless of the size of a chip, there is no need to prepare a plurality of wiring patterns for each size of chips.

26. 发明授权

US6160526A IC module and IC card 失效
标题翻译： IC模块和IC卡
公开(公告)号：US6160526A
公开(公告)日：2000-12-12
申请号：US242748
申请日：1999-02-22
申请人： Minoru Hirai , Shigeyuki Ueda , Osamu Miyata , Tomoharu Horio
发明人： Minoru Hirai , Shigeyuki Ueda , Osamu Miyata , Tomoharu Horio
IPC分类号： G06K19/077 , H01L23/02 , G06K19/06 , H01Q1/36
CPC分类号： B42D25/22 , B42D25/485 , B42D2033/46 , G06K19/07728 , G06K19/07747 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01L2224/16 , H01L2224/73253 , H01L2924/16195 , H01L2924/3511
摘要： An IC module incorporated in an IC-card includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip. The antenna coil includes a conductive film which is patterned on a surface of the substrate, thereby facilitating fabrication of the IC module while realizing a thickness reduction of the IC module.
摘要翻译： PCT No.PCT / JP98 / 02833 Sec。一九九九年二月二十二日 102（e）1999年2月22日PCT PCT。1998年6月23日PCT公布。 WO98 / 59318 PCT公开号日期：1998年12月30日IC卡中包含的IC模块包括基板，安装在基板上的IC芯片和与IC芯片电连接的天线线圈。天线线圈包括在基板的表面上图案化的导电膜，从而有助于IC模块的制造，同时实现IC模块的厚度减小。

27. 发明授权

US4834035A Variable swirl intake apparatus for engine 失效
标题翻译：发动机可变涡流进气装置
公开(公告)号：US4834035A
公开(公告)日：1989-05-30
申请号：US52048
申请日：1987-04-20
申请人： Taizo Shimada , Osamu Miyata , Tomoaki Tajima , Shigeo Yazawa , Toshio Tsuda , Shuichi Komuro , Eiji Mizote , Tomomi Nakagawa
发明人： Taizo Shimada , Osamu Miyata , Tomoaki Tajima , Shigeo Yazawa , Toshio Tsuda , Shuichi Komuro , Eiji Mizote , Tomomi Nakagawa
IPC分类号： F02B1/04 , F02B3/06 , F02B23/06 , F02B31/00 , F02B31/08 , F02B75/12
CPC分类号： F02B23/0603 , F02B23/0624 , F02B23/0696 , F02B31/00 , F02B31/082 , F02B1/04 , F02B2031/006 , F02B2075/125 , F02B2275/14 , F02B23/0657 , F02B23/0669 , F02B3/06 , Y02T10/125 , Y02T10/146
摘要： Variable swirl intake apparatus 24 controls a swirl of intake air in cylinder chamber 22 of an engine. Variable swirl intake apparatus 24 has intake port 25 which has entrance portion 25a formed on cylinder head 23 of the engine and extending from the side surface of cylinder head 23 and swirl chamber 25b which communicates with entrance portion 25a and is formed to provide a swirl to a gas flow flowing from entrance portion 25a, intake valve 26, arranged on the lower surface of cylinder head 23, for opening/closing between swirl chamber 25b and cylinder chamber 22 of the engine, swirl control path 28, one end of which is open to swirl chamber 25a on the side of entrance portion 25a with respect to a line connecting the axis along a piston sliding direction at the center of cylinder chamber 22 and the axis of the intake valve, and the other end of which is open to the side surface of cylinder head 23, and a control apparatus 29 for controlling a gas flow into swirl control path 28. According to variable swirl intake apparatus 24, a swirl of a gas taken in the engine can be controlled in accordance with an operating condition of the engine so as to reduce NO.sub.x and a fuel consumption rate.
摘要翻译： PCT No.PCT / JP85 / 00465 Sec。 371日期1987年4月20日 102（e）1987年4月20日PCT PCT。1985年8月23日PCT公布。公开号WO87 / 01160 日期1987年2月26日。变量涡旋进气装置24控制发动机气缸室22内的进气旋涡。可变涡流进气装置24具有进气口25，其具有形成在发动机的气缸盖23上的入口部分25a，并且从气缸盖23的侧面和与入口部分25a连通的涡流室25b延伸并形成为提供涡流从入口部分25a流出的气流，设置在气缸盖23的下表面上的进气阀26，用于在涡流室25b和发动机的气缸室22之间打开/关闭，其一端敞开的涡流控制路径28 相对于在气缸室22的中心和进气阀的中心沿着活塞滑动方向的轴线连接的入口部分25a的一侧旋转室25a，另一端向侧面敞开气缸盖23的表面，以及用于控制气流进入涡流控制路径28的控制装置29.根据可变涡旋进气装置24，可以控制在发动机中吸入的气体的涡流根据发动机的运行状态，以减少NOx和燃料消耗率。

28. 发明授权

US08575764B2 Semiconductor device and method for manufacturing semiconductor device 有权
公开(公告)号：US08575764B2
公开(公告)日：2013-11-05
申请号：US12659968
申请日：2010-03-26
申请人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
发明人： Osamu Miyata , Masaki Kasai , Shingo Higuchi
IPC分类号： H01L23/48
CPC分类号： H01L23/3178 , H01L21/78 , H01L23/291 , H01L23/293 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3192 , H01L23/528 , H01L23/544 , H01L23/562 , H01L24/02 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/94 , H01L24/96 , H01L2223/5446 , H01L2224/02255 , H01L2224/0226 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05568 , H01L2224/05569 , H01L2224/05571 , H01L2224/05647 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/05042 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/10161 , H01L2924/10253 , H01L2924/12042 , H01L2924/182 , H01L2924/186 , H01L2924/3025 , H01L2924/00 , H01L2224/13 , H01L2924/00014 , H01L2924/00012
摘要： An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.

29. 发明授权

US07456502B2 Wiring board with connection electrode formed in opening and semiconductor device using the same 有权
标题翻译：具有形成在开口中的连接电极的接线板和使用其的半导体器件
公开(公告)号：US07456502B2
公开(公告)日：2008-11-25
申请号：US10593393
申请日：2005-08-04
申请人： Kazumasa Tanida , Osamu Miyata
发明人： Kazumasa Tanida , Osamu Miyata
IPC分类号： H01L23/48
CPC分类号： H05K3/3452 , H01L23/49811 , H01L23/49866 , H01L24/16 , H01L24/32 , H01L24/81 , H01L2224/0401 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/05624 , H01L2224/13006 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/16225 , H01L2224/29109 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/48 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/15313 , H01L2924/3841 , H05K3/3436 , H05K2201/0989 , H05K2201/10674 , H05K2201/10977 , H01L2924/0132 , H01L2924/00 , H01L2224/05552
摘要： The invention provides a wiring board (2,15) to which a semiconductor chip (3) is to be bonded while directing a surface of the semiconductor chip toward the wiring board. The wiring board includes a connection electrode (14) that is formed on a bonding surface (2a, 15a) to which the semiconductor chip is to be bonded and that is used to make a connection with the semiconductor chip, an insulating film (6) that is formed on the bonding surface and that has an opening (6a) to expose the connection electrode, and a low-melting-point metallic part (16) that is provided on the connection electrode in the opening and that is made of a low-melting-point metallic material whose solidus temperature is lower than that of the connection electrode.
摘要翻译：本发明提供了一种将半导体芯片的表面朝向布线板引导的要接合半导体芯片（3）的布线板（2,15）。布线基板包括连接电极（14），其形成在要与半导体芯片接合的接合面（2a，15a）上并用于与半导体芯片连接的绝缘膜（14） 6），其形成在接合面上并具有露出连接电极的开口（6a）和设置在开口中的连接电极上的低熔点金属部分（16）的固相线温度低于连接电极的低熔点金属材料。

30. 发明申请

US20080036043A1 Manufacture Method for Semiconductor Device and Semiconductor Device 有权
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：US20080036043A1
公开(公告)日：2008-02-14
申请号：US11630162
申请日：2005-10-17
申请人： Kazumasa Tanida , Osamu Miyata
发明人： Kazumasa Tanida , Osamu Miyata
IPC分类号： H01L29/06 , H05K7/00
CPC分类号： H01L23/49833 , H01L21/563 , H01L23/49805 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H05K3/0052 , H05K3/284 , H05K3/403 , H05K3/42 , H05K2201/0394 , H05K2201/09181 , H05K2203/1581 , H01L2924/00 , H01L2224/0401
摘要： A manufacture method for semiconductor device (1, 21) including: a sealing-resin-layer forming step of forming a sealing resin layer (7) on a conductive member (13) formed at lest on one surface of a base substrate (11) formed with a plurality of wiring boards (2) therein, the conductive member spanning a boundary between a respective pair of adjoining wiring boards; and a step of moving the base substrate and a cutting tool (B) relative to each other in a manner to allow the cutting tool to pass through the base substrate from the other surface (2b) opposite from the one surface thereof toward the one surface thereof, thereby cutting the base substrate along the boundary between the respective pair of adjoining wiring boards.
摘要翻译：一种半导体器件（1,21）的制造方法，包括：密封树脂层形成步骤，在基底基板（11）的一个表面上形成的导电部件（13）上形成密封树脂层（7）在其中形成有多个布线板（2），所述导电构件跨越相应的一对相邻布线板之间的边界; 以及相对于彼此移动所述基底基板和切割工具（B）的步骤，以允许所述切割工具从与所述基底基板和所述一个表面相对的另一个表面（2b）穿过所述基底基板，从而沿着相邻的一对相邻布线板之间的边界切割基底基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式