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    • 24. 发明授权
    • Method for fabricating semiconductor device with metal-polycide gate and recessed channel
    • 用金属多晶硅栅极和凹槽形成半导体器件的方法
    • US07320919B2
    • 2008-01-22
    • US11450789
    • 2006-06-09
    • Tae Kyun Kim
    • Tae Kyun Kim
    • H01L21/336
    • H01L21/823437H01L21/823412H01L29/4236H01L29/42376H01L29/66621
    • A method for fabricating a semiconductor device with a metal-polycide gate and a recessed channel, including the steps of: forming trenches for a recessed channel in an active area of a semiconductor substrate; forming a gate insulating layer on the semiconductor substrate having the trenches; forming a gate conductive layer on the entire surface of the resulting structure so that the trenches are buried; forming a silicon-rich amorphous metal silicide layer and a gate hard mask on the gate conductive layer; etching the resulting structure until upper portions of the gate conductive layer are removed by a predetermined thickness, upon first patterning for gate stacks, and forming a metal layer on the entire surface of the resulting structure; forming lateral metal capping layers on sides of the silicon-rich amorphous metal silicide layer by blanket etching, completing formation of gate stacks; and thermally processing the silicon-rich amorphous metal silicide layer to form a crystallized metal silicide layer.
    • 一种制造具有金属多晶硅栅极和凹陷沟道的半导体器件的方法,包括以下步骤:在半导体衬底的有源区域中形成用于凹陷沟道的沟槽; 在具有沟槽的半导体衬底上形成栅极绝缘层; 在所得结构的整个表面上形成栅极导电层,使得沟槽被埋入; 在栅极导电层上形成富硅非晶金属硅化物层和栅极硬掩模; 蚀刻所得到的结构,直到栅极导电层的上部被去除预定厚度,首先对栅极堆叠进行图案化,并在所得结构的整个表面上形成金属层; 通过毯式蚀刻在富硅非晶金属硅化物层的侧面上形成侧面金属覆盖层,完成栅叠层的形成; 并且热处理富硅非晶金属硅化物层以形成结晶的金属硅化物层。
    • 25. 发明授权
    • Method for fabricating semiconductor device with recessed channel
    • 用于制造具有凹槽的半导体器件的方法
    • US07306993B2
    • 2007-12-11
    • US11450764
    • 2006-06-09
    • Tae Kyun Kim
    • Tae Kyun Kim
    • H01L21/336
    • H01L29/66621H01L21/28061H01L21/28114H01L29/42376
    • A method for fabricating a semiconductor device with a recessed channel, including the steps of: forming trenches for a recessed channel in an active area of a semiconductor substrate; forming a gate insulating layer on the semiconductor substrate having the trenches; forming a gate conductive layer on the entire surface of the resulting structure so that the trenches are buried; forming a silicon-rich amorphous metal silicide layer having seams on the gate conductive layer; filling the seams of the silicon-rich amorphous metal silicide layer with a metal thin film; forming a gate hard mask on the silicon-rich amorphous metal silicide layer and the metal thin film; patterning the gate insulating layer, the gate conductive layer, the silicon-rich amorphous metal silicide layer and the gate hard mask to form gate stacks; and thermally processing the silicon-rich amorphous metal silicide layer and the metal thin film to form a crystallized metal silicide layer.
    • 一种用于制造具有凹陷沟道的半导体器件的方法,包括以下步骤:在半导体衬底的有源区中形成用于凹陷沟道的沟槽; 在具有沟槽的半导体衬底上形成栅极绝缘层; 在所得结构的整个表面上形成栅极导电层,使得沟槽被埋置; 在所述栅极导电层上形成具有接缝的富硅非晶金属硅化物层; 用金属薄膜填充富硅非晶金属硅化物层的接缝; 在富硅非晶金属硅化物层和金属薄膜上形成栅极硬掩模; 图案化栅极绝缘层,栅极导电层,富硅非晶金属硅化物层和栅极硬掩模以形成栅极堆叠; 并且对富硅非晶金属硅化物层和金属薄膜进行热处理以形成结晶的金属硅化物层。
    • 28. 发明授权
    • Semiconductor memory device and method for manufacturing the same
    • 半导体存储器件及其制造方法
    • US08729617B2
    • 2014-05-20
    • US13368054
    • 2012-02-07
    • Tae Kyun Kim
    • Tae Kyun Kim
    • H01L27/108
    • H01L27/10876H01L27/10885H01L27/10891H01L29/41741H01L29/456H01L29/66666H01L29/7827
    • A semiconductor memory device includes: a lower pillar protruding from a substrate in a vertical direction and extending in a first direction by a trench formed in the first direction; an upper pillar protruding on the lower pillar in a second direction perpendicular to the first direction; a buried bit line junction region disposed on one sidewall of the lower pillar; a buried bit line contacting the buried bit line junction region and filling a portion of the trench; an etch stop film disposed on an exposed surface of the buried bit line; a first interlayer dielectric film recessed to expose a portion of an outer side of at least the upper pillar disposed on the etch stop film; a second interlayer dielectric film disposed on the first interlayer dielectric film; and a gate surrounding the exposed outer side of the upper pillar and crossing the buried bit line.
    • 半导体存储器件包括:从垂直方向从衬底突出并沿第一方向沿第一方向形成的沟槽延伸的下柱; 上柱在垂直于第一方向的第二方向上在下支柱上突出; 设置在下支柱的一个侧壁上的掩埋位线接合区域; 接触所述掩埋位线接合区域并填充所述沟槽的一部分的掩埋位线; 设置在所述掩埋位线的暴露表面上的蚀刻停止膜; 第一层间电介质膜,其凹入以暴露至少设置在所述蚀刻停止膜上的上柱的外侧的一部分; 设置在第一层间电介质膜上的第二层间绝缘膜; 以及围绕上部柱的暴露的外侧并与埋入位线交叉的门。