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    • 21. 发明授权
    • Cleaning chamber built into SEM for plasma or gaseous phase cleaning
    • 内置扫描电镜的清洗室进行等离子体或气相清洗
    • US06190062B1
    • 2001-02-20
    • US09558492
    • 2000-04-26
    • Ramkumar SubramanianKhoi A. PhanBharath RangarajanBhanwar SinghBryan K. ChooSanjay K. Yedur
    • Ramkumar SubramanianKhoi A. PhanBharath RangarajanBhanwar SinghBryan K. ChooSanjay K. Yedur
    • G03D1300
    • H01J37/28H01J2237/2817
    • One aspect of the present invention relates to a method of inspecting a patterned substrate using an SEM, involving the steps of evaluating the patterned substrate to determine if charges exist thereon; introducing the patterned substrate having charges thereon into a processing chamber of the SEM; inspecting the patterned resist using an electron beam generated by the SEM; and introducing a cleaner containing ozone into the processing chamber of the SEM. Another aspect of the present invention relates to a system for processing a patterned substrate, containing a charge sensor for determining if charges exist on the patterned substrate and measuring the charges; a means for contacting the patterned substrate with a cleaner containing ozone to reduce the charges thereon; a controller for setting at least one of time of contact between the patterned substrate and the cleaner, temperature of the cleaner, concentration of ozone in the cleaner, and pressure under which contact between the patterned substrate and the cleaner occurs; and a device for inspecting the patterned substrate with an electron beam.
    • 本发明的一个方面涉及使用SEM检查图案化衬底的方法,包括以下步骤:评估图案化衬底以确定其中是否存在电荷; 将具有电荷的图案化衬底引入到SEM的处理室中; 使用由SEM产生的电子束检查图案化的抗蚀剂; 并将含有臭氧的清洁剂引入SEM的处理室。 本发明的另一方面涉及一种用于处理图案化衬底的系统,其包含用于确定在图案化衬底上是否存在电荷并测量电荷的电荷传感器; 用于使图案化基底与含有臭氧的清洁剂接触以降低其上的电荷的装置; 用于设置图案化基板和清洁器之间的接触时间中的至少一个的控制器,清洁器的温度,清洁器中的臭氧浓度以及图案化基板和清洁器之间的接触发生的压力; 以及用于用电子束检查图案化衬底的装置。
    • 24. 发明授权
    • Nozzle arm movement for resist development
    • 喷嘴臂运动用于抗蚀剂开发
    • US06592932B2
    • 2003-07-15
    • US09814131
    • 2001-03-21
    • Ramkumar SubramanianKhoi A. PhanBharath RangarajanBhanwar SinghMichael K. TempletonSanjay K. Yedur
    • Ramkumar SubramanianKhoi A. PhanBharath RangarajanBhanwar SinghMichael K. TempletonSanjay K. Yedur
    • B05D312
    • H01L21/6715G03F7/3021
    • A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position. A method of adjusting the offset position and/or volume of developer material applied at the first and second position is also provided. The method utilizes developed photoresist material layer thickness data provided by a measurement system to adjust the offset position and/or volume of the developer.
    • 提供了一种有助于在光致抗蚀剂材料层上施加均匀的显影剂材料层的系统和方法。 该系统包括适于沿着具有大致等于光致抗蚀剂材料层的直径的直线路径的光致抗蚀剂材料层上施加预定体积的显影剂材料的喷嘴。 移动系统将喷嘴移动到偏离光致抗蚀剂材料层的中心区域的第一位置,以在旋转涂覆显影剂材料的同时将第一预定体积的显影剂材料施加到光致抗蚀剂材料层。 移动系统还将喷嘴移动到偏离中心区域的第二位置,以在旋涂涂覆显影剂的同时将第二预定体积的显影剂材料施加到光致抗蚀剂材料层。 第一位置相对于第二位置位于中心区域的相反侧。 还提供了一种调节在第一和第二位置施加的显影剂材料的偏移位置和/或体积的方法。 该方法利用由测量系统提供的显影的光致抗蚀剂材料层厚度数据来调节显影剂的偏移位置和/或体积。
    • 25. 发明授权
    • Nozzle arm movement for resist development
    • 喷嘴臂运动用于抗蚀剂开发
    • US06270579B1
    • 2001-08-07
    • US09429995
    • 1999-10-29
    • Ramkumar SubramanianKhoi A. PhanBharath RangarajanBhanwar SinghMichael K. TempletonSanjay K. Yedur
    • Ramkumar SubramanianKhoi A. PhanBharath RangarajanBhanwar SinghMichael K. TempletonSanjay K. Yedur
    • B05C1102
    • H01L21/6715G03F7/3028
    • A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a multiple tip nozzle and a movement system that moves the nozzle to an operating position above a central region of a photoresist material layer located on a substrate, and applies a volume of developer as the nozzle scan moves across a predetermined path. The movement system moves the nozzle in two dimensions by providing an arm that has a first arm member that is pivotable about a first rotational axis and a second arm member that is pivotable about a second rotational axis or is movable along a translational axis. The system also provides a measurement system that measures the thickness uniformity of the developed photoresist material layer disposed on a test wafer. The thickness uniformity data is used to reconfigure the predetermined path of the nozzle as the developer is applied. The thickness uniformity data can also be used to adjust the volume of developer applied along the path and/or the volume flow rate.
    • 提供了一种有助于在光致抗蚀剂材料层上施加均匀的显影剂材料层的系统和方法。 该系统包括多个尖端喷嘴和运动系统,该运动系统将喷嘴移动到位于基板上的光致抗蚀剂材料层的中心区域上方的操作位置,并且当喷嘴扫描移动穿过预定路径时施加一定体积的显影剂。 移动系统通过提供具有第一臂构件的臂来移动喷嘴,该臂具有可围绕第一旋转轴线枢转的第一臂构件和可围绕第二旋转轴线枢转或可沿着平移轴线移动的第二臂构件。 该系统还提供了测量设置在测试晶片上的显影的光致抗蚀剂材料层的厚度均匀性的测量系统。 当施加显影剂时,厚度均匀性数据用于重新配置喷嘴的预定路径。 厚度均匀性数据也可用于调节沿路径施加的显影剂的体积和/或体积流量。
    • 30. 发明授权
    • Comprehensive integrated lithographic process control system based on product design and yield feedback system
    • 基于产品设计和产量反馈系统的综合光刻过程控制系统
    • US06915177B2
    • 2005-07-05
    • US10261569
    • 2002-09-30
    • Khoi A. PhanBhanwar SinghBharath RangarajanRamkumar Subramanian
    • Khoi A. PhanBhanwar SinghBharath RangarajanRamkumar Subramanian
    • G03F7/20H01L21/66G06F19/00
    • G03F7/70525G03F7/70616G03F7/70858H01L22/20
    • The present invention provides systems and methods that facilitate performing fabrication process. Critical parameters are valued collectively as a quality matrix, which weights respective parameters according to their importance to one or more design goals. The critical parameters are weighted by coefficients according to information such as, product design, simulation, test results, yield data, electrical data and the like. The invention then can develop a quality index which is a composite “score” of the current fabrication process. A control system can then do comparisons of the quality index with design specifications in order to determine if the current fabrication process is acceptable. If the process is unacceptable, test parameters can be modified for ongoing processes and the process can be re-worked and re-performed for completed processes. As such, respective layers of a device can be customized for different specifications and quality index depending on product designs and yields.
    • 本发明提供了便于执行制造过程的系统和方法。 关键参数被统称为质量矩阵,其根据其对一个或多个设计目标的重要性来对各个参数进行加权。 关键参数根据产品设计,仿真,测试结果,产量数据,电气数据等信息对系数进行加权。 然后,本发明可以开发质量指数,其是当前制造过程的综合“评分”。 然后,控制系统可以将质量指标与设计规范进行比较,以便确定当前的制造过程是否可接受。 如果该过程是不可接受的,则可以对正在进行的过程修改测试参数,并且可以对完成的过程重新处理和重新执行该过程。 因此,根据产品设计和产量,可以针对不同的规格和质量指数定制装置的各个层。