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    • 23. 发明授权
    • Structure of a low-voltage channel write/erase flash memory cell and fabricating method thereof
    • 低电压通道写入/擦除闪存单元的结构及其制造方法
    • US06677198B2
    • 2004-01-13
    • US10064109
    • 2002-06-12
    • Ching-Hsiang HsuChing-Sung Yang
    • Ching-Hsiang HsuChing-Sung Yang
    • H01L21336
    • H01L29/66825H01L21/28273H01L29/7883
    • The present invention relates to a structure of a low-voltage channel write/erase flash memory cell and a fabricating method thereof, which structure comprises an N-substrate, a deep P-well formed on the substrate, and an N-well formed on the deep P-well. A deep p-type region and a shallow p-type region are ion-implanted in the N-well. The deep p-type region is connected to the shallow p-type region. An n-type region is ion-implanted in the deep p-type region to be electrically shorted with the deep p-type region and be used as a drain. Another n-type region is also ion-implanted at one side of the shallow p-type region to be used as a source. The present invention can apply the same voltage to the deep P-well and the N-well on the N-substrate by adding in a triple well architecture so that the leakage current capably generated can be reduced to minimum, thereby effectively reducing end voltages when performing the operation of erasing, simplifying the design complexity of a charge pump circuit required by the whole structure, and enhancing the operating efficiency.
    • 本发明涉及一种低电压通道写入/擦除闪速存储单元的结构及其制造方法,该结构包括N衬底,在衬底上形成的深P阱以及形成在N阱上的N阱 深P井。 将深P型区域和浅P型区域离子注入到N阱中。 深P型区域连接到浅P型区域。 在深p型区域中离子注入n型区域,与深p型区域电短路并用作漏极。 另一个n型区域也被离子注入在用作源的浅P型区域的一侧。 本发明可以通过添加三阱结构将相同的电压施加在N衬底上的深P阱和N阱上,使得可以产生的泄漏电流可以减小到最小,从而有效地减少最终电压,当 执行擦除操作,简化了整个结构所需的电荷泵电路的设计复杂度,提高了运行效率。
    • 26. 发明授权
    • Embedded type flash memory structure and method for operating the same
    • 嵌入式闪存结构及其操作方法
    • US06441443B1
    • 2002-08-27
    • US09781430
    • 2001-02-13
    • Ching-Hsiang HsuChing-Sung Yang
    • Ching-Hsiang HsuChing-Sung Yang
    • H01L2976
    • H01L27/115G11C16/0416H01L29/792
    • The present invention provides an embedded type flash memory structure and a method for operating the same. The memory structure of the present invention comprises a first deep doped-region formed on the surface of a semiconductor substrate. A second doped-region is implanted in the first deep doped-region. A plurality of first shallow doped-regions are respectively formed in the second doped-region and the first deep doped-region to be used as drains and sources. A dielectric insulating layer and a poly-silicon gate are stacked above the first deep doped-region between the source and the drain. The present invention also proposes programming, erasing, and reading processes corresponding to the flash memory cell structure.
    • 本发明提供一种嵌入式闪速存储器结构及其操作方法。 本发明的存储器结构包括在半导体衬底的表面上形成的第一深掺杂区域。 在第一深掺杂区域中注入第二掺杂区域。 多个第一浅掺杂区域分别形成在第二掺杂区域和第一深掺杂区域中,用作下水和源。 在源极和漏极之间的第一深掺杂区域的上方堆叠介电绝缘层和多晶硅栅极。 本发明还提出了对应于闪存单元结构的编程,擦除和读取处理。
    • 27. 发明授权
    • Parasitic surface transfer transistor cell (PASTT cell) for bi-level and multi-level NAND flash memory
    • 用于双电平和多电平NAND闪存的寄生面转移晶体管单元(PASTT cell)
    • US06429081B1
    • 2002-08-06
    • US09858530
    • 2001-05-17
    • Kelvin Yin-Yuh DoongChing-Hsiang Hsu
    • Kelvin Yin-Yuh DoongChing-Hsiang Hsu
    • H01L21336
    • H01L27/11521G11C2211/5641H01L27/115
    • A new Flash memory cell device with a parasitic surface transfer transistor (PASTT) and a method of manufacture are achieved. The device comprises, first, a semiconductor substrate. The semiconductor substrate further comprises an active area and an isolation barrier region. A source junction is in the active area. A drain junction is in the active area. A cell channel is in the active area extending from the drain junction to the source junction. A parasitic channel is in the active area on the top surface of the semiconductor substrate extending from the drain junction to the source junction. The parasitic channel is bounded on one side by the isolation barrier region and on another side by the cell channel. A floating gate comprises a first conductive layer overlying the cell channel with a tunneling oxide layer therebetween. The floating gate does not overlie the parasitic channel. A control gate comprises a second conductive layer overlying the floating gate with an interlevel dielectric layer therebetween. A parasitic surface transfer-transistor (PASTT) gate comprises the second conductive layer overlying the parasitic channel with the interlevel dielectric layer therebetween.
    • 实现了具有寄生面转移晶体管(PASTT)和制造方法的新的闪存单元器件。 该器件首先包括半导体衬底。 半导体衬底还包括有源区和隔离屏障区。 源结点处于活动区域。 漏极结处于有源区。 电池通道在从漏极结延伸到源极结的有源区中。 寄生沟道位于半导体衬底的顶表面上的从漏极结延伸到源极结的有源区中。 寄生通道在一侧由隔离屏障区域限定,另一侧由单元通道限制。 浮动栅极包括覆盖电池沟道的第一导电层,其间具有隧道氧化物层。 浮动栅极不会覆盖寄生通道。 控制栅极包括覆盖浮置栅极的第二导电层,其间具有层间电介质层。 寄生表面转移晶体管(PASTT)栅极包括覆盖寄生沟道的第二导电层,其间具有层间电介质层。