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21. 发明授权

US5625645A Differential pulse encoding and decoding for binary data transmissions 失效
标题翻译：用于二进制数据传输的差分脉冲编码和解码
公开(公告)号：US5625645A
公开(公告)日：1997-04-29
申请号：US506625
申请日：1995-07-25
申请人： Paul F. Greier , Lawrence S. Mok
发明人： Paul F. Greier , Lawrence S. Mok
IPC分类号： H03K5/003 , H04B14/06 , H04B4/06
CPC分类号： H03K5/003 , H04B14/06
摘要： A differential pulse encoding and decoding approach for binary data transmissions, such as binary frequency shift keying (BFSK) data transmissions, for sending and recovering a serial, binary digital data stream by differentiating the pulses thereof. A method and system are disclosed for transmitting from a transmitter to a receiver a digital data signal containing a stream of binary data bits having a first high value and a second low value. At the transmitter, the digital signal is transformed into a differential signal which contains pulses corresponding to transitions between the first and second values. The digital signal is transformed into the differential signal by an encoder which can be a differentiator circuit or an RC high-pass filter circuit. If frequency spectrum is a concern, a low-pass filter can filter the output of the encoder. The differential signal is then transmitted, and received by the receiver which reconstructs the original digital signal therefrom. The transmission of the differential signal can be by a transmission cable or by an FM transmitter and receiver. At the receiver, the digital signal is reconstructed from the differential signal by a decoder circuit which functions to produce a high voltage output signal when the input signal is higher than a reference high voltage, and a low voltage output signal when the input signal is lower than a reference low voltage. A low-pass filter can also filter the input to the decoder circuit.
摘要翻译：用于二进制数据传输的差分脉冲编码和解码方法，例如二进制频移键控（BFSK）数据传输，用于通过区分其脉冲发送和恢复串行二进制数字数据流。公开了一种用于从发射机向接收机发送包含具有第一高值和第二低值的二进制数据比特流的数字数据信号的方法和系统。在发射机处，数字信号被转换成包含对应于第一和第二值之间的跃迁的脉冲的差分信号。数字信号通过可以是微分电路或RC高通滤波器电路的编码器转换成差分信号。如果考虑频谱，低通滤波器可以对编码器的输出进行滤波。然后差分信号被发送并由接收器接收，该接收机从其重建原始数字信号。差分信号的传输可以通过传输电缆或由FM发射器和接收器传输。在接收机处，数字信号由差分信号由解码器电路重建，该解码器电路当输入信号高于参考高电压时产生高电压输出信号，当输入信号较低时产生低电压输出信号比参考低电压。低通滤波器也可以对解码器电路的输入进行滤波。

22. 发明申请

US20120328789A1 METAL-GRAPHITE FOAM COMPOSITE AND A COOLING APPARATUS FOR USING THE SAME 审中-公开
标题翻译：金属石墨泡沫复合材料和使用它的冷却装置
公开(公告)号：US20120328789A1
公开(公告)日：2012-12-27
申请号：US13601958
申请日：2012-08-31
申请人： Minhua Lu , Lawrence S. Mok , Krystyna W. Semkow
发明人： Minhua Lu , Lawrence S. Mok , Krystyna W. Semkow
IPC分类号： B05D1/36
CPC分类号： H01L23/473 , B22F2998/10 , B22F2999/00 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , C22C2001/1021 , H01L23/3733 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , C04B41/4564 , C04B41/4572 , C04B41/5127 , C04B41/4517 , C04B41/4523 , C04B35/522 , C04B38/00 , C22C1/1015 , C04B41/00 , C25D5/54 , H01L2224/0401
摘要： A method of producing a metal-graphite foam composite, and particularly, the utilization thereof in connection with a cooling apparatus. Also provided is a cooling apparatus, such as a liquid cooler or alternatively, a heat sink for electronic heat-generating components, which employ the metal-graphite foam composite.
摘要翻译：一种金属 - 石墨发泡体复合体的制造方法，特别是与冷却装置的利用。还提供了采用金属 - 石墨泡沫复合材料的冷却装置，例如液体冷却器或替代地，用于电子发热部件的散热器。

23. 发明授权

US07948077B2 Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement 有权
标题翻译：具有微通道冷却装置的集成电路芯片模块具有特定的流体通道布置
公开(公告)号：US07948077B2
公开(公告)日：2011-05-24
申请号：US12134883
申请日：2008-06-06
申请人： Paul S. Andry , Evan G. Colgan , Lawrence S. Mok , Chirag S. Patel , David E. Seeger
发明人： Paul S. Andry , Evan G. Colgan , Lawrence S. Mok , Chirag S. Patel , David E. Seeger
IPC分类号： H01L23/473 , H01L23/52
CPC分类号： H01L23/473 , H01L25/0657 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2224/0401
摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.
摘要翻译：提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

24. 发明授权

US07458413B2 Semiconductor chip heat transfer device 有权
标题翻译：半导体芯片传热装置
公开(公告)号：US07458413B2
公开(公告)日：2008-12-02
申请号：US10988219
申请日：2004-11-12
申请人： Lawrence S. Mok
发明人： Lawrence S. Mok
IPC分类号： F22B37/00
CPC分类号： H01L23/473 , F28D15/00 , F28D15/02 , F28D2015/0291 , F28F2013/006 , F28F2250/08 , F28F2265/12 , F28F2265/26 , H01L23/34 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： A method and apparatus for improving the heat transfer from a semiconductor chip to its heat sinking device. The heat transfer device has a liquid chamber in which liquid is circulated within the chamber to spread the heat from one location of the chamber to the heat pipes partially mounted in the chamber. The heat is then carried away by the heat pipes to a remote heat sinking device. The chamber has built-in mechanism to allow the liquid to expand during normal operation and its expansion status to be monitored.
摘要翻译：一种用于改善从半导体芯片到其散热装置的热传递的方法和装置。传热装置具有液体室，液体在室内循环，以将热量从室的一个位置传播到部分地安装在室中的热管。然后，热量被热管带走到远程散热装置。该腔室具有内置机构，允许液体在正常操作期间膨胀，并且其膨胀状态将被监控。

25. 发明授权

US07434308B2 Cooling of substrate using interposer channels 有权
标题翻译：使用插入器通道冷却衬底
公开(公告)号：US07434308B2
公开(公告)日：2008-10-14
申请号：US10933051
申请日：2004-09-02
申请人： Minhua Lu , Lawrence S. Mok
发明人： Minhua Lu , Lawrence S. Mok
IPC分类号： H05K3/36
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.
摘要翻译：一种结构，以及形成和冷却结构的方法。该结构可以包括具有N个连续衬底通道的衬底（例如，半导体芯片）和具有N个连续插入器通道（N> = 2）的插入器。 N个插入器通道耦合到N个衬底沟道以形成M个连续环（1≤M≤N）。 M环可将热量从衬底内的热源传递到插入器，然后传递到热耦合到插入器的散热器。该结构可以包括具有围绕空腔的导热外壳的插入器。空腔包含导热泡沫材料（例如石墨泡沫）。泡沫材料包含具有连续连接的通道段的蛇形通道。蛇形通道可以将热量从衬底（例如，半导体芯片）内的热源传递到插入器，然后传递到热耦合到插入器的散热器。

26. 发明申请

US20080165033A1 System and Method of Locating Vehicles with Keylock Signals 有权
标题翻译：用钥匙锁信号定位车辆的系统和方法
公开(公告)号：US20080165033A1
公开(公告)日：2008-07-10
申请号：US11620180
申请日：2007-01-05
申请人： Trieu C. Chieu , David L. Cohn , Shiwa S. Fu , Santhosh Kumaran , Lawrence S. Mok
发明人： Trieu C. Chieu , David L. Cohn , Shiwa S. Fu , Santhosh Kumaran , Lawrence S. Mok
IPC分类号： G08G1/123
CPC分类号： G08G1/14 , G07C9/00174 , G08G1/017 , G08G1/205
摘要： A wireless key is signal, having a key-specific identifier, is received, the key-specific identifier detected, and the signal transmission location is calculated. The signal transmission location is stored based on the detected key-specific identifier. Another instance of the same wireless key signal is received, its key-specific identifier is detected, and the stored signal transmission location is retrieved based on the detected key-specific identifier. Optionally, a wireless key signal is received at a user and repeated at a plurality of locations in a parking facility. A vehicle response is detected, and associated with one of the repeatings of the wireless key signal. A location of the vehicle response is detected based on the repeating with which it is associated.
摘要翻译：无线密钥是具有接收到密钥特定标识符的信号，检测到密钥特定标识符，并且计算信号传输位置。基于检测到的密钥特定标识符来存储信号传输位置。接收到相同无线键信号的另一个实例，检测其密钥特定标识符，并且基于检测到的密钥特定标识符来检索存储的信号传输位置。可选地，在用户处接收无线键信号并在停车设施中的多个位置处重复。检测到车辆响应，并且与无线键信号的重复之一相关联。基于与其相关联的重复来检测车辆响应的位置。

27. 发明授权

US07230334B2 Semiconductor integrated circuit chip packages having integrated microchannel cooling modules 有权
标题翻译：具有集成微通道冷却模块的半导体集成电路芯片封装
公开(公告)号：US07230334B2
公开(公告)日：2007-06-12
申请号：US10987985
申请日：2004-11-12
申请人： Paul S. Andry , Evan G. Colgan , Lawrence S. Mok , Chirag S. Patel , David E. Seeger
发明人： Paul S. Andry , Evan G. Colgan , Lawrence S. Mok , Chirag S. Patel , David E. Seeger
IPC分类号： H01L23/46
CPC分类号： H01L23/473 , H01L25/0657 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2224/0401
摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.
摘要翻译：提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成的硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

28. 发明授权

US5169805A Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation 失效
标题翻译：弹性安装集成电路芯片以实现保形散热的方法
公开(公告)号：US5169805A
公开(公告)日：1992-12-08
申请号：US706637
申请日：1991-05-29
申请人： Lawrence S. Mok , Robert E. Schwall , Ho-Ming Tong
发明人： Lawrence S. Mok , Robert E. Schwall , Ho-Ming Tong
IPC分类号： H01L23/14 , H01L23/16 , H01L23/367 , H01L23/42
CPC分类号： H01L23/42 , H01L23/147 , H01L23/16 , H01L23/3675 , H01L2224/16225 , Y10T29/49146
摘要： In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.
摘要翻译：在集成电路封装中，芯片被结合到中间晶片的一侧，该中间晶片在周边被弹性地安装，中间晶片的整个另一侧保持保形热传递，而不需要任何实心的连接。

29. 发明授权

US07947599B2 Laser annealing for 3-D chip integration 有权
标题翻译：激光退火3-D芯片集成
公开(公告)号：US07947599B2
公开(公告)日：2011-05-24
申请号：US12018756
申请日：2008-01-23
申请人： Howard H. Chen , Louis C. Hsu , Lawrence S. Mok , J. Campbell Scott
发明人： Howard H. Chen , Louis C. Hsu , Lawrence S. Mok , J. Campbell Scott
IPC分类号： H01L21/44
CPC分类号： H01L21/324 , H01L21/268 , H01L24/01 , H01L25/0657 , H01L27/0688 , H01L2225/06513 , H01L2225/06541 , H01L2924/14 , H01L2924/00
摘要： A laser annealing method for annealing a stacked semiconductor structure having at least two stacked layers is disclosed. A laser beam is focused on a lower layer of the stacked layers. The laser beam is then scanned to anneal features in the lower layer. The laser beam is then focused on an upper layer of the stacked layers, and the laser beam is scanned to anneal features in the upper layer. The laser has a wavelength of less than one micrometer. The beam size, depth of focus, energy dosage, and scan speed of the laser beam are programmable. Features in the lower layer are offset from features in the upper layer such that these features do not overlap along a plane parallel to a path of the laser beam. Each of the stacked layers includes active devices, such as transistors. Also, the first and second layers may be annealed simultaneously.
摘要翻译：公开了一种用于退火具有至少两个堆叠层的层叠半导体结构的激光退火方法。激光束聚焦在堆叠层的下层。然后扫描激光束以退火下层中的特征。然后将激光束聚焦在堆叠层的上层上，并且激光束被扫描以退火上层中的特征。激光器的波长小于1微米。激光束的光束尺寸，焦深，能量投射和扫描速度是可编程的。较低层中的特征偏离上层中的特征，使得这些特征不沿着与激光束的路径平行的平面重叠。堆叠层中的每一个包括诸如晶体管的有源器件。此外，第一层和第二层可以同时退火。

30. 发明申请

US20100117209A1 MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS 审中-公开
标题翻译：具有冷却方式的半导体芯片上的多个芯片
公开(公告)号：US20100117209A1
公开(公告)日：2010-05-13
申请号：US11680311
申请日：2007-02-28
申请人： Raschid J. Bezama , Minhua Lu , Lawrence S. Mok
发明人： Raschid J. Bezama , Minhua Lu , Lawrence S. Mok
IPC分类号： H01L23/52 , H01L23/46
CPC分类号： H01L23/427 , F28D15/046 , H01L25/065 , H01L25/18 , H01L2224/05001 , H01L2224/05009 , H01L2224/05026 , H01L2224/05568 , H01L2224/0557 , H01L2224/05647 , H01L2224/16145 , H01L2224/16225 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/15311 , H01L2224/05099
摘要： The present invention is directed to a method of packaging multiple semiconductor chips on a second semiconductor chips with a built-in efficient cooling means. One embodiment is to place two multiple chip stacks on opposing sides of a vapor chamber for transferring heat away from the semiconductor chips. Another embodiment is to construct a vapor chamber with a substrate such that at least one multiple chip stack is embedded inside the vapor chamber.
摘要翻译：本发明涉及一种利用内置高效冷却装置在多个半导体芯片上封装多个半导体芯片的方法。一个实施例是将两个多个芯片堆放置在蒸气室的相对侧上，以将热量从半导体芯片传送出去。另一个实施例是构造具有衬底的蒸汽室，使得至少一个多个芯片堆叠被嵌入在蒸气室内。

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