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    • 23. 发明授权
    • Ink jet printhead having a patternable ink channel structure
    • 喷墨打印头具有可图案化的墨水通道结构
    • US06183069B2
    • 2001-02-06
    • US09004765
    • 1998-01-08
    • Cathie J. BurkeMildred Calistri-YehDiane AtkinsonAlmon P. Fisher
    • Cathie J. BurkeMildred Calistri-YehDiane AtkinsonAlmon P. Fisher
    • B41J205
    • B41J2/1623B41J2/1604B41J2/1628B41J2/1629B41J2/1631B41J2/1632B41J2/1635B41J2/1642
    • An ink jet printhead is disclosed which has a heater plate containing the heating elements and driving circuitry means monolithographically formed on one surface thereof and the ink flow directing channel structure is formed on the heater plate using a layer of patternable material, so that all critical alignments are done directly on the heater plate. In one embodiment, the patternable material is a photosensitive polymer which is exposed using a mask to define the channel and reservoir pattern, which is then developed and cured. After curing, the patterned channel structure is polished to provide a smooth coplanar surface and a cover plate with an aperture therein is aligned with a loose tolerance to the channel structure and bonded thereto to complete the printhead. The aperture serves as both ink inlet and a portion of the ink reservoir. The channels are open at one end and serve as the droplet ejecting nozzles, while the other ends are connected to the reservoir. In one embodiment, the cover plate is transparent and the channel structure material is polyimide or polyarylene ether ketone.
    • 公开了一种喷墨打印头,其具有包含加热元件的加热器板和在其一个表面上以光学方式形成的驱动电路装置,并且使用可图案化材料层在加热器板上形成墨流动引导通道结构,使得所有关键对准 直接在加热器板上完成。 在一个实施方案中,可图案材料是使用掩模曝光以限定通道和储存器图案的光敏聚合物,其然后显影和固化。 固化后,对图案化的沟道结构进行抛光以提供平滑的共面表面,并且其中具有孔的盖板对准通道结构的松动公差并与其结合以完成打印头。 该孔用作墨水入口和墨水储存器的一部分。 通道在一端开口并用作液滴喷嘴,而另一端连接到储存器。 在一个实施例中,盖板是透明的,并且通道结构材料是聚酰亚胺或聚亚芳基醚酮。
    • 26. 发明授权
    • Increased threshold uniformity of thermal ink transducers
    • 增加热油墨换能器的阈值均匀性
    • US5639386A
    • 1997-06-17
    • US400638
    • 1995-03-07
    • Cathie J. BurkeDaniel S. BrennanKeith G. KamekonaRoberto E. Proano
    • Cathie J. BurkeDaniel S. BrennanKeith G. KamekonaRoberto E. Proano
    • B41J2/05B41J2/16H01L21/00
    • B41J2/14129B41J2/1604B41J2/1623B41J2/1628B41J2/1629B41J2/1631B41J2/1642B41J2/1646
    • The resistors of heater elements are formed by chemical vapor deposition of polycrystalline silicon at at least one of a flat temperature profile of 620.degree. C. and a ramped temperature profile of 620.degree. C. to 640.degree. C. in a first embodiment. Such method of forming the polysilicon result in a predominantly uniform grain size of approximately 1000 .ANG., where grain size can vary between 200 .ANG. to 1000 .ANG.. Alternatively, the resistors are formed by chemical vapor deposition of amorphous polysilicon at at least one of a flat temperature profile at a temperature below 580.degree. C. and a ramped temperature profile of 565.degree. C. to 575.degree. C. In the alternative embodiment, the polysilicon has a grain size of at least 1000 .ANG.. During the ion implantation of either p-type or n-type dopants into the polysilicon, a flood gun located in an ion implanter emits low energy electrons to neutralize the build-up of positive charges on the polysilicon surface. Because the low energy electrons prevent the build-up of electric charges on the surface of the polysilicon, the usual build-up of an electrical field on the surface of the polysilicon is eliminated, and the polysilicon can be uniformly doped by ion implantation of dopants. By using the flood gun during the fabrication of the heater elements of the printhead, the resistors of the heater elements and printheads have substantially uniform sheet resistances relative to each other. The sheet resistances of the resistors in the printhead vary less than 3% and preferably less than 1%. Such low variations in sheet resistance prevent undervoltage and overvoltage from being applied to the resistors and extend the lifetime of the heater element and thus, the printhead.
    • 加热器元件的电阻器通过在620℃的平坦温度分布和620℃至640℃的升温温度分布中的至少一个上的多晶硅的化学气相沉积形成。在第一实施例中。 这种形成多晶硅的方法导致大致均匀的晶粒尺寸约为1000,其中晶粒尺寸可以在200至1000之间变化。 或者,电阻器通过在低于580℃的温度曲线和565℃至575℃的升温温度分布中的至少一个下的非晶多晶硅的化学气相沉积形成。在替代实施例中, 多晶硅的晶粒尺寸至少为1000安培。 在将p型或n型掺杂剂离子注入多晶硅期间,位于离子注入机中的喷枪发射低能电子以中和多晶硅表面上正电荷的积聚。 因为低能电子阻止了多晶硅表面上的电荷的积聚,消除了在多晶硅表面上电场的通常积累,并且可以通过掺杂剂的离子注入均匀地掺杂多晶硅 。 通过在制造打印头的加热元件期间使用喷枪,加热器元件和打印头的电阻器相对于彼此具有基本均匀的薄片电阻。 打印头中的电阻器的薄层电阻变化小于3%,优选小于1%。 薄层电阻的这种低的变化防止欠电压和过压被施加到电阻器并延长加热器元件的寿命并因此延长打印头。