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    • 22. 发明申请
    • Method to selectively recess ETCH regions on a wafer surface using capoly as a mask
    • 使用capoly作为掩模来选择性地在晶片表面上凹入ETCH区域的方法
    • US20060046367A1
    • 2006-03-02
    • US10931195
    • 2004-08-31
    • Antonio RotondaroSeetharaman Sridhar
    • Antonio RotondaroSeetharaman Sridhar
    • H01L21/8238
    • H01L29/7842H01L21/823807H01L21/823814H01L29/7843H01L29/7848
    • The present invention facilitates semiconductor fabrication by providing methods of fabrication that selectively apply strain to channel regions of devices while mitigating masking operations employed. A CAPOLY layer is formed over an NMOS region of a semiconductor device (102). A recess etch is performed on active regions of devices within a PMOS region of the semiconductor device (104) and the CAPOLY layer prevents etching of devices within an NMOS region of the semiconductor device. Subsequently, an epitaxial formation process (106) is performed that forms or deposits epitaxial regions and introduces a first type of strain across the channel regions in the PMOS region. Then, the semiconductor device is annealed (108) to cause the CAPOLY layer to introduce a second type of strain across the channel regions in the NMOS region. After annealing, the CAPOLY layer is removed (110).
    • 本发明通过提供制造方法来促进半导体制造,该方法选择性地将应变应用于器件的沟道区,同时减轻所采用的掩模操作。 在半导体器件(102)的NMOS区域上形成CAPOLY层。 在半导体器件(104)的PMOS区域内的器件的有源区域上执行凹蚀刻,并且CAPOLY层防止在半导体器件的NMOS区域内的器件的蚀刻。 随后,执行形成或沉积外延区域并在PMOS区域中的沟道区域上引入第一类型的应变的外延形成工艺(106)。 然后,半导体器件被退火(108)以使CAPOLY层在NMOS区域中的沟道区域上引入第二类型的应变。 退火后,去除CAPOLY层(110)。
    • 23. 发明申请
    • Method to reduce transistor gate to source/drain overlap capacitance by incorporaton of carbon
    • 通过碳引入降低晶体管栅极到源极/漏极重叠电容的方法
    • US20050014353A1
    • 2005-01-20
    • US10620492
    • 2003-07-16
    • Majid MansooriAlwin TsaoAntonio RotondaroBrian Smith
    • Majid MansooriAlwin TsaoAntonio RotondaroBrian Smith
    • H01L21/265H01L21/28H01L21/3213H01L29/423H01L21/3205
    • H01L21/28044H01L21/26506H01L21/28114H01L21/32137H01L29/42376
    • The present invention pertains to formation of a transistor in a manner that mitigates overlap capacitances, thereby facilitating, among other things, enhanced switching speeds. More particularly, a gate stack of the transistor is formed to include an optional layer of poly-SiGe and a layer of poly-Si, where at least one or the layers comprises carbon. The stack may also include a polysilicon seed layer that can also comprise carbon. The carbon changes the components of sidewall passivation materials and affects etch rates during an etching process, thereby facilitating isotropic etching. The changed passivation materials coupled with an enhanced sensitivity of the poly-SiGe and carbon-doped poly-SiGe layer to an etchant utilized in the etching process causes the stack to have a notched appearance. The tapered configuration of the gate stack provides little, if any, area for dopants that may migrate under the gate structure to overlap the conductive layers in the stack, and thus mitigates the opportunity for overlap capacitances to arise.
    • 本发明涉及以减轻重叠电容的方式形成晶体管,从而有利于提高切换速度。 更具体地,晶体管的栅极堆叠形成为包括任选的多晶硅层和多晶硅层,其中至少一个或多个层包含碳。 堆叠还可以包括也可以包含碳的多晶硅种子层。 碳改变侧壁钝化材料的组分并影响蚀刻过程中的蚀刻速率,从而促进各向同性蚀刻。 与蚀刻过程中使用的蚀刻剂相比,改变的钝化材料与多晶硅和掺杂碳的多晶硅层的增强灵敏度相结合,使堆叠具有缺口外观。 栅极堆叠的锥形配置对于可能在栅极结构下迁移以与堆叠中的导电层重叠的掺杂剂提供很小的(如果有的话)区域,并且因此减轻了重叠电容出现的机会。