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21. 发明授权

US07838981B2 Component assembly 失效
标题翻译：组件装配
公开(公告)号：US07838981B2
公开(公告)日：2010-11-23
申请号：US12069786
申请日：2008-02-13
申请人： Frieder Haag
发明人： Frieder Haag
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L24/48 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , Y10T428/24521 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a possibility of mounting conventionally capped components, that saves much space. The component assembly includes at least one component having a cap, a substrate for the component and connecting means for mounting the component on the substrate and for the electrical connection of the component. The substrate has at least one recess. The component is mounted on the substrate in flip-chip technique, so that the cap is inserted into the recess and the component is connected to the substrate via connecting bumps in the edge region of the recess.
摘要翻译：本发明提供了安装常规封盖部件的可能性，节省了大量的空间。部件组件包括至少一个具有盖的部件，用于部件的基板和用于将部件安装在基板上以及用于部件的电连接的连接装置。衬底具有至少一个凹部。该部件以倒装芯片技术安装在基板上，从而将盖插入凹部中，并且该部件通过凹部的边缘区域中的连接凸块连接到基板。

22. 发明授权

US07737544B2 Sensor system having a substrate and a housing, and method for manufacturing a sensor system 失效
标题翻译：具有基板和壳体的传感器系统以及用于制造传感器系统的方法
公开(公告)号：US07737544B2
公开(公告)日：2010-06-15
申请号：US11601420
申请日：2006-11-16
申请人： Stefan Mueller , Frieder Haag , Thomas-Achim Boes
发明人： Stefan Mueller , Frieder Haag , Thomas-Achim Boes
IPC分类号： H01L21/44
CPC分类号： H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01057 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A sensor system having a substrate and a housing and a method for manufacturing a sensor system are provided, the housing essentially completely enclosing the substrate in a first substrate region, the housing in a second substrate region being provided at least partially open via an opening, the second substrate region in the region of the opening being provided so as to project from the housing, the housing being manufactured using an injection molding compound and being molded in such a way that the injection molding compound has only one flow front.
摘要翻译：提供了一种具有衬底和壳体的传感器系统以及用于制造传感器系统的方法，所述壳体基本上完全将衬底封闭在第一衬底区域中，所述壳体在第二衬底区域中经由开口至少部分地敞开，开口区域中的第二基板区域设置成从壳体突出，壳体使用注射成型化合物制造并且以这样的方式模制，使得注射模塑料仅具有一个流动前端。

23. 发明申请

US20050253240A1 Micromechanical component and corresponsing production method 审中-公开
标题翻译：微机械部件和相应的生产方法
公开(公告)号：US20050253240A1
公开(公告)日：2005-11-17
申请号：US10514364
申请日：2003-02-21
申请人： Wolfgang Nuechter , Frank Fischer , Frieder Haag , Eckhard Graf
发明人： Wolfgang Nuechter , Frank Fischer , Frieder Haag , Eckhard Graf
IPC分类号： B81B3/00 , B81B7/00 , B81C3/00 , H01L21/56 , H01L21/60 , H01L23/02 , H01L23/495 , H01L21/48 , H01L23/28
CPC分类号： B81B7/0077 , H01L21/563 , H01L23/49575 , H01L2224/16145 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2924/00014 , H01L2924/00
摘要： A micromechanical component including a chip which is mounted on a substrate and has an encapsulated chip area which is higher than its vicinity, as well as a mounting area provided in the vicinity of the encapsulated chip area. The chip being mounted on the substrate by a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom. The encapsulated chip area is surrounded by an underfill beneath the chip. A method for the manufacture of the micromechanical component is also provided.
摘要翻译：一种微机械部件，包括安装在基板上并具有高于其附近的封装芯片面积的芯片以及设置在封装芯片区域附近的安装区域。芯片通过连接到安装区域的安装装置安装在基板上，使得封装的芯片区域面向基板并且定位在与其一定距离处。封装的芯片区域被芯片下方的底部填充物包围。还提供了用于制造微机械部件的方法。

24. 发明授权

US06804883B1 Method for producing a pressure sensor 有权
标题翻译：压力传感器的制造方法
公开(公告)号：US06804883B1
公开(公告)日：2004-10-19
申请号：US09603060
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01R4300
CPC分类号： B81C1/00333 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T29/49169 , Y10T29/49171 , Y10T29/49174 , Y10T29/49176 , H01L2924/00014
摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.
摘要翻译：一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。半导体压力传感器电连接到引线栅格的接触部分。引线格栅与半导体压力传感器一起插入注塑模具中。模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

25. 发明授权

US06300169B1 Method for manufacturing a pressure sensor 有权
标题翻译：制造压力传感器的方法
公开(公告)号：US06300169B1
公开(公告)日：2001-10-09
申请号：US09603082
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01L2144
CPC分类号： G01L19/143 , G01L19/141 , H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/10253 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.
摘要翻译：在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开装配段由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在避免了将注射成型化合物完全渗透到间隙中。

26. 发明申请

US20110229375A1 Microfluidic System for Purposes of Analysis and Diagnosis and Corresponding Method for Producing a Microfluidic System 有权
标题翻译：用于分析和诊断用的微流体系统以及用于产生微流体系统的相应方法
公开(公告)号：US20110229375A1
公开(公告)日：2011-09-22
申请号：US13050762
申请日：2011-03-17
申请人： Ricardo Ehrenpfordt , Mathias Bruendel , Frieder Haag , Jochen Rupp , Ulrike Scholz
发明人： Ricardo Ehrenpfordt , Mathias Bruendel , Frieder Haag , Jochen Rupp , Ulrike Scholz
IPC分类号： G01N33/00 , B32B37/02 , B32B38/10 , B32B37/24
CPC分类号： B01L3/5027 , B01J2219/00783 , B01L3/502707 , B01L2200/027 , B01L2300/0663 , B01L2300/0874 , B01L2300/0887 , B01L2300/16 , B81B7/007 , B81B2201/036 , B81B2201/054 , B81B2207/098 , B81C2203/0154 , H01L23/473 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83191 , Y10T156/10 , H01L2924/00014
摘要： A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.
摘要翻译：用于分析和诊断的微流体系统由基本上彼此排列的层组成。微流体系统至少包括第一和第二导电层，其分别包括至少一个通道，用于在相应导电层中导通的流体。微流体系统还包括至少一个芯片层，其包括至少一个有源微机械元件，所述有源微机械元件与至少一个通道操作连接，并且所述芯片层布置在第一和第二导通层，并且通道彼此流体连接。除了微流体系统之外，还公开了相应的制造方法。

27. 发明授权

US07855426B2 Optical sensor assemblage and corresponding manufacturing method 有权
标题翻译：光学传感器组合及相应的制造方法
公开(公告)号：US07855426B2
公开(公告)日：2010-12-21
申请号：US10561635
申请日：2004-05-15
申请人： Frieder Haag , Ronny Ludwig
发明人： Frieder Haag , Ronny Ludwig
IPC分类号： H01L31/00 , H01L31/0232 , H01L31/0203 , H01L23/495
CPC分类号： G01J5/12 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optical sensor assemblage, in particular a thermopile sensor assemblage, comprising a sensor chip assemblage having an optically transparent irradiation region, a mounting region surrounding the latter, and a wire-bond region; an optically isolating mounting frame having a chip receiving region and a plurality of connector elements; and an optically isolating packaging device; the sensor chip assemblage being joined in the mounting region to the chip receiving region, and in the wire-bond region to one or more of the connector elements, the chip receiving region having a window disposed in such a way that at least a portion of the optical irradiation region is not covered by the chip receiving region; and the packaging device surrounding the sensor chip assemblage and the mounting frame in such a way that optical radiation can enter the sensor chip assemblage substantially only through the window.
摘要翻译：一种光学传感器组合件，特别是热电堆传感器组件，其包括具有光学透明照射区域的传感器芯片组件，围绕其的安装区域和引线键合区域; 具有芯片接收区域和多个连接器元件的光学隔离安装框架; 和光隔离包装装置; 传感器芯片组合件在安装区域中连接到芯片接收区域，并且在引线接合区域中连接到一个或多个连接器元件，芯片接收区域具有窗口，光学照射区域不被芯片接收区域覆盖; 以及围绕传感器芯片组合件和安装框架的包装装置，使得光学辐射可以基本上仅通过窗口进入传感器芯片组合。

28. 发明授权

US07825524B2 QFN housing having optimized connecting surface geometry 有权
标题翻译： QFN外壳具有优化的连接表面几何形状
公开(公告)号：US07825524B2
公开(公告)日：2010-11-02
申请号：US11731054
申请日：2007-03-30
申请人： Anton Doering , Stefan Mueller , Frieder Haag , Christoph Gahn
发明人： Anton Doering , Stefan Mueller , Frieder Haag , Christoph Gahn
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K3/3442 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L2224/05073 , H01L2224/05647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19043 , H01L2924/351 , H05K2201/09427 , H05K2201/10727 , Y02P70/613 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor system or sensor system in a housing which is butt-joined to a printed circuit board by soldering, at least some of the connecting surfaces not being soldered over their entire area, the connecting surfaces which are not soldered over their entire area being fixedly soldered in a first surface region to a section of a printed conductor, and in a second surface region the connecting surfaces not being fixedly connected to the printed circuit board, the securely soldered surface regions being situated closer to the semiconductor or sensor structure to be contacted than are the surface regions which are not fixedly connected to the printed circuit board.
摘要翻译：壳体中的半导体系统或传感器系统，其通过焊接对接于印刷电路板，至少一些连接表面未被焊接在其整个区域上，未被焊接在其整个区域上的连接表面被固定在第一表面区域焊接到印刷导体的一部分，并且在第二表面区域中，连接表面未固定地连接到印刷电路板，安全焊接的表面区域位于更接近待接触的半导体或传感器结构没有固定地连接到印刷电路板的表面区域。

29. 发明授权

US07791891B2 Enclosure including an electrical module 有权
标题翻译：外壳包括电气模块
公开(公告)号：US07791891B2
公开(公告)日：2010-09-07
申请号：US12217301
申请日：2008-07-02
申请人： Christian Ohl , Frieder Haag , Juergen Kurle , Ingbert Gerngross
发明人： Christian Ohl , Frieder Haag , Juergen Kurle , Ingbert Gerngross
IPC分类号： H05K7/00
CPC分类号： H05K5/0078 , H01L2924/181 , H01L2924/00012
摘要： A module includes an electrical component having an inner enclosure which surrounds the electrical component and which has first electrical contact means at least on one outer side; having an outer enclosure in the interior of which the inner enclosure is situated, the outer enclosure having second electrical contact means, the second electrical contact means extending from the interior to at least one outer side of the outer enclosure. The first and second contact means are interconnected.
摘要翻译：模块包括电气部件，其具有围绕电气部件的内部外壳，并且具有至少一个外侧上的第一电接触装置; 在其内部具有外壳的外壳中，外壳具有第二电接触装置，第二电接触装置从内部延伸到外壳的至少一个外侧。第一和第二接触装置相互连接。

30. 发明申请

US20090072333A1 SENSOR ARRAY HAVING A SUBSTRATE AND A HOUSING, AND METHOD FOR MANUFACTURING A SENSOR ARRAY 审中-公开
标题翻译：具有基板和壳体的传感器阵列以及用于制造传感器阵列的方法
公开(公告)号：US20090072333A1
公开(公告)日：2009-03-19
申请号：US12063785
申请日：2006-07-07
申请人： Frieder Haag , Thomas-Achim Boes
发明人： Frieder Haag , Thomas-Achim Boes
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： G01L19/141 , B81B7/0048 , G01L19/148 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： In a sensor array having a substrate and a housing, and in a method for manufacturing a sensor array are proposed, the housing substantially completely surrounds the substrate in a first substrate area, the housing is provided in a second substrate area at least partly open via an opening, and the second substrate area is provided protruding from the housing in the area of the opening.
摘要翻译：在具有衬底和壳体的传感器阵列中，并且在制造传感器阵列的方法中，壳体基本上完全围绕第一衬底区域中的衬底包围，壳体设置在至少部分打开的第二衬底区域开口，并且第二基板区域在开口的区域中从壳体突出设置。

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