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21. 发明授权

US06855952B2 Semiconductor device and semiconductor package 失效
标题翻译：半导体器件及半导体封装
公开(公告)号：US06855952B2
公开(公告)日：2005-02-15
申请号：US10400647
申请日：2003-03-28
申请人： Akira Nagai , Satoru Amou , Shinji Yamada , Takao Ishikawa , Hiroshi Nakano
发明人： Akira Nagai , Satoru Amou , Shinji Yamada , Takao Ishikawa , Hiroshi Nakano
IPC分类号： C08K5/01 , C08L101/00 , H01L21/312 , H01L23/31 , H01L23/36 , H01L23/532 , B32B27/00 , H01L35/24
CPC分类号： H01L23/3114 , H01L23/5329 , H01L2924/0002 , H01L2924/12044 , Y10T428/12528 , Y10T428/24917 , Y10T428/249958 , Y10T428/249988 , Y10T428/249991 , Y10T428/249993 , Y10T428/31855 , Y10T428/31931 , H01L2924/00
摘要： A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material: where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.
摘要翻译：使用含有作为交联成分的具有多个苯乙烯基并由化学式[1]表示的化合物的树脂作为绝缘材料的半导体器件：其中R为可具有取代基或烃基的烃结构 R 1为氢，甲基或乙基，m为1〜4的整数，n为2以上的整数。由此，具有优异的透射特性和较少的半导体器件和半导体封装提供功耗。

22. 发明授权

US06638352B2 Thermal stable low elastic modulus material and device using the same 失效
标题翻译：热稳定性低弹性模量材料及其使用方法
公开(公告)号：US06638352B2
公开(公告)日：2003-10-28
申请号：US10097664
申请日：2002-03-15
申请人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
发明人： Yuichi Satsu , Morimichi Umino , Takumi Ueno , Akio Takahashi , Akira Nagai , Toshiya Satoh , Shinji Yamada , Kazuhiro Suzuki
IPC分类号： C08L8300
CPC分类号： H01L24/10 , C08L79/08 , C08L83/10 , H01L23/293 , H01L23/3114 , H01L23/3171 , H01L23/49894 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05647 , H01L2224/13 , H01L2224/13022 , H01L2224/131 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01087 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/351 , H05K1/0271 , Y10T428/31663 , C08L83/00 , H01L2224/13099 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides a thermal stable low elastic modulus material, which has high thermal stability, is little in change in dynamic characteristics such as coefficient of thermal expansion and elastic modulus within a temperature of −50° C. to 300° C., has an elastic modulus at room temperature of 2-0.01 GPa and is high in reliability of electric insulation regardless of a temperature fluctuation, and provides a semiconductor device using the same. The present invention also provides a thermal stable low elastic modulus resin composition obtained by heat-curing a mixture containing a polyimide, polyamide-imide or polyamide resin or resin precursor, whose cured product has an elastic modulus measured at −50° C. of 2-0.01 GPa, and an oligomer of an organosilicon compound having a functional group capable of causing addition reaction with an NH and/or COOH group.
摘要翻译：本发明提供一种热稳定性低的弹性模量材料，它具有高的热稳定性，在-50℃至300℃的温度范围内的动态特性如热膨胀系数和弹性模量的变化很小，具有在室温下为2-0.01GPa的弹性模量，并且电绝缘的可靠性高，而不管温度波动如何，并且提供了使用其的半导体器件。本发明还提供一种通过热量获得的热稳定性低弹性模量树脂组合物固化含有聚酰亚胺，聚酰胺 - 酰亚胺或聚酰胺树脂或树脂前体的混合物，其固化产物在-50℃下测量的2-0.01GPa的弹性模量和具有官能团的有机硅化合物的低聚物引起与NH和/或COOH基团的加成反应。

23. 发明授权

US06573615B1 Electronic key system for a vehicle 失效
标题翻译：汽车电子钥匙系统
公开(公告)号：US06573615B1
公开(公告)日：2003-06-03
申请号：US09662907
申请日：2000-09-15
申请人： Suguru Asakura , Akira Nagai , Yoshikazu Imura , Kentaro Yoshimura , Munehisa Nozawa
发明人： Suguru Asakura , Akira Nagai , Yoshikazu Imura , Kentaro Yoshimura , Munehisa Nozawa
IPC分类号： B60R2500
CPC分类号： B60R25/24 , B60R25/04 , B60R25/2063 , G07C9/00309 , G07C2009/00222 , G07C2009/00333 , G07C2009/00507 , G07C2009/00793 , G07C2209/63
摘要： The present invention provides an electronic key system for a vehicle which is a type of starting the engine with pressing a button switch and can be operated at familiar mechanical movements thus easing the user or driver of an unfamiliar conception as well as improved in the operability and the protection against theft. When a quick-start switch mounted on the steering wheel is pressed after the code identification is valid, a CPU switches on the start switch to energize a starter motor. The CPU judges from a change in the voltage of an alternator that the engine starts running. As the engine runs, an ignition switch is automatically turned to the II position with a valet key inserted. The engine can be stopped by the valet key turning to the 0 position. In the parking state, the valet key may be detached from or accommodated in the ignition switch.
摘要翻译：本发明提供了一种用于车辆的电子钥匙系统，其是通过按压按钮开关起动发动机的类型，并且可以在熟悉的机械运动下操作，从而缓解用户或驾驶员不熟悉的概念，并且提高了可操作性，保护防盗。当代码识别有效后，当按下方向盘上的快速启动开关时，CPU打开启动开关以启动起动电机。 CPU根据发动机开始运行的交流发电机电压的变化进行判断。当发动机运行时，点火开关自动转到II位置，并插入一个代号。发动机可以通过代客钥匙转到0位置来停止。在停车状态下，代客钥匙可以从点火开关中分离或容纳在点火开关中。

24. 发明授权

US06396145B1 Semiconductor device and method for manufacturing the same technical field 失效
标题翻译：半导体器件及其制造方法相同的技术领域
公开(公告)号：US06396145B1
公开(公告)日：2002-05-28
申请号：US09446979
申请日：1999-12-30
申请人： Akira Nagai , Takumi Ueno , Haruo Akahoshi , Syuji Eguchi , Masahiko Ogino , Toshiya Satoh , Asao Nishimura , Ichiro Anjoh
发明人： Akira Nagai , Takumi Ueno , Haruo Akahoshi , Syuji Eguchi , Masahiko Ogino , Toshiya Satoh , Asao Nishimura , Ichiro Anjoh
IPC分类号： H01L2348
CPC分类号： H01L23/3171 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/13 , H01L24/16 , H01L2224/02145 , H01L2224/0231 , H01L2224/0236 , H01L2224/02377 , H01L2224/0401 , H01L2224/08225 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/30107 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device includes a semiconductor element arranged to form integrated circuitry, a plurality of electrode pads formed on the side of the integrated circuitry formation surface of the in semiconductor element, bump electrodes for external connection electrically connected to the electrode pads through a conductive layer, and a stress relaxation layer formed between the integrated circuitry formation surface and electrode pads on one hand and the bump electrodes and conductive layer on the other hand, the stress relaxation layer being adhered thereto, wherein more than one third of the stress relaxation layer from a surface thereof is cut away for removal and wherein the stress relaxation layer is subdivided into a plurality of regions.
摘要翻译：半导体器件包括布置成形成集成电路的半导体元件，形成在半导体元件的集成电路形成表面侧的多个电极焊盘，用于通过导电层电连接到电极焊盘的用于外部连接的凸起电极，以及一方面在集成电路形成表面和电极焊盘之间形成的应力松弛层，另一方面在凸起电极和导电层之间形成应力松弛层，应力松弛层粘附到其上，其中来自一个或多个应力松弛层的三分之一以上其表面被切除以除去，并且其中应力松弛层被细分为多个区域。

25. 发明授权

US6114005A Laminate and multilayer printed circuit board 失效
标题翻译：层压板和多层印刷电路板
公开(公告)号：US6114005A
公开(公告)日：2000-09-05
申请号：US859659
申请日：1997-05-20
申请人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
发明人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
IPC分类号： B32B27/12 , H01L23/14 , H05K1/03 , B32B5/12
CPC分类号： B32B27/12 , H01L23/145 , H05K1/0373 , H01L2224/48227 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/30107 , H01L2924/3025 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/029 , H05K2201/068 , Y10S428/901 , Y10T428/24132 , Y10T428/254
摘要： A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
摘要翻译：能够在其上安装半导体元件的层压体; 包括由海岛结构的树脂部分和织造加强件构成的绝缘层。例如，海岛结构的树脂部分使得岛状树脂以树脂为基体分散。因此，绝缘层在其平面方向上的热膨胀系数为3.0D（ppm / K），玻璃化转变温度为150℃（℃）。由于这些物理性质，可以减少层压体在其上封装半导体元件时的热应力，使得层压体与半导体元件的连接可以高度可靠。

26. 发明授权

US5707749A Method for producing thin film multilayer wiring board 失效
标题翻译：薄膜多层布线板的制造方法
公开(公告)号：US5707749A
公开(公告)日：1998-01-13
申请号：US494974
申请日：1995-06-26
申请人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
发明人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
IPC分类号： B32B15/08 , H05K3/00 , H05K3/38 , H05K3/46 , B32B7/12 , B32B27/00
CPC分类号： H05K3/4655 , B32B15/08 , H05K2201/0154 , H05K2201/0195 , H05K2203/107 , H05K3/0017 , H05K3/386 , H05K3/4652 , Y10T29/49165 , Y10T428/2848 , Y10T428/31721
摘要： A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
摘要翻译：可靠性，产率，生产率和更高的定位精度优异的薄膜多层布线材料包括在一个表面上具有布线图案的绝缘有机膜和在另一个主表面上的粘合剂层。绝缘性有机膜是在热解开始温度为350〜550℃，介电常数为3.5〜2.2的耐热性，V-0或V-1的阻燃性根据UL- 94标准。粘合层含有醚双马来酰亚胺化合物。

27. 发明授权

US5686883A Vehicle anti-theft system 失效
标题翻译：车辆防盗系统
公开(公告)号：US5686883A
公开(公告)日：1997-11-11
申请号：US461422
申请日：1995-06-05
申请人： Eiji Mutoh , Shinichi Kubota , Susumu Maeda , Suguru Asakura , Akira Nagai
发明人： Eiji Mutoh , Shinichi Kubota , Susumu Maeda , Suguru Asakura , Akira Nagai
IPC分类号： B60R25/04 , B60R25/24 , B60R25/10
CPC分类号： B60R25/24 , B60R25/04
摘要： A vehicle anti-theft system in which, only when the ID signal is obtained from a right ignition key and when the vehicle anti-theft function is halted by the failure of an anti-theft circuit or theft detection unit itself, the start-up of the engine is permitted. The system comprises a unit for generating a start-up enable signal in response to a verification signal representing a right ID signal, and an engine control unit for performing the start-up control of the engine in response to the start-up enable signal and disabling the engine in response to a theft signal. The start-up enable signal generating unit generates a start-up enable signal in response to the fault signal. A dummy line for detecting a breakage is wired along various signal lines wired on the substrate of an immobilizer, which, if intentionally broken by an ill-intentioned third party, could cause a fault signal similar to that for the failure of the immobilizer to be outputted from a determination signal output terminal. If a break in the dummy line is detected, the engine control is inhibited even if the fault signal is detected.
摘要翻译：一种车辆防盗系统，其中仅当从右点火钥匙获得ID信号时，并且当车辆防盗功能被防盗电路或盗窃检测单元本身的故障停止时，启动的发动机是允许的。该系统包括用于响应于表示右ID信号的验证信号产生启动使能信号的单元，以及用于响应于启动使能信号执行引擎启动控制的引擎控制单元，以及响应于盗窃信号禁用发动机。启动使能信号生成单元响应故障信号产生启动使能信号。用于检测断裂的虚拟线被布线在固定器的基板上的各种信号线上，如果故意的第三方故意破坏，则可能导致类似于防盗器故障的故障信号从判定信号输出端子输出。如果检测到虚拟线路中断，即使检测到故障信号，也禁止发动机控制。

28. 发明授权

US5598898A Vehicle antitheft system 失效
标题翻译：车辆防盗系统
公开(公告)号：US5598898A
公开(公告)日：1997-02-04
申请号：US524449
申请日：1995-09-06
申请人： Eiji Mutoh , Suguru Asakura , Akira Nagai
发明人： Eiji Mutoh , Suguru Asakura , Akira Nagai
IPC分类号： B60R25/04 , B60R25/24 , B60R25/00
CPC分类号： B60R25/24 , B60R25/04
摘要： A vehicle antitheft system comprising an ID code compare unit for comparing a key ID code obtained from an ignition key with a reference ID code stored in advance in the vehicle and generating an enable signal when these ID codes are in a preset relationship (for example, both codes are identical), an engine ECU for receiving the enable signal and enabling control of the engine when the enable signal is correct and a delay times that is started in response to generation of the enable signal and generates a signal which enables starting of the motor starter after the lapse of a preset time period following the generation of the enable signal (for example, at least period necessary for the engine ECU to store or identify the enable signal).
摘要翻译：一种车辆防盗系统，包括ID码比较单元，用于将从点火钥匙获得的密钥ID码与预先存储在车辆中的参考ID码进行比较，并且当这些ID码处于预设关系时产生使能信号（例如，两个代码相同），用于接收使能信号并且在使能信号正确时使得能够控制发动机的发动机ECU以及响应于使能信号的产生开始的延迟时间，并且产生使得能够启动电动机起动器在产生启用信号之后经过预设时间段（例如，发动机ECU存储或识别使能信号所需的至少一段时间）。

29. 发明授权

US5308888A Fluorine-containing curable resin composition and use thereof 失效
标题翻译：含氟可固化树脂组合物及其用途
公开(公告)号：US5308888A
公开(公告)日：1994-05-03
申请号：US20399
申请日：1993-02-22
申请人： Shin Nishimura , Akira Nagai , Akio Takahashi , Akio Mukoo , Tadashi Narita , Tokio Hagiwara , Hiroshi Hamana , Junichi Katagiri
发明人： Shin Nishimura , Akira Nagai , Akio Takahashi , Akio Mukoo , Tadashi Narita , Tokio Hagiwara , Hiroshi Hamana , Junichi Katagiri
IPC分类号： C08F136/16 , H05K1/03 , C08J3/28
CPC分类号： C08F136/16 , H05K1/034
摘要： According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant.A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.
摘要翻译：根据本发明，提供一种树脂组合物，其可以提供具有优异的耐热性和固化后的阻燃性并显示低介电常数的绝缘树脂。含氟聚合物的含氟光固化树脂组合物，其含有通式[II]表示的氟或含氟基团的聚合物：其中R 1和R 2选自H，F，CH 3 和CF3; R3和R4选自CH2和CF2; x和y表示0〜4，m表示30〜1000，环境温度为固体的光聚合引发剂在100〜150℃之间熔融，熔融粘度不大于106泊，为光固化。

30. 发明授权

US4784917A Thermosetting resin composition and laminate and process for the production thereof 失效
标题翻译：热固性树脂组合物及其制备方法
公开(公告)号：US4784917A
公开(公告)日：1988-11-15
申请号：US854507
申请日：1986-04-22
申请人： Keiko Tawara , Akira Nagai , Akio Takahashi , Katuo Sugawara , Masahiro Ono , Ritsuro Tada , Motoyo Wajima , Toshikazu Narahara
发明人： Keiko Tawara , Akira Nagai , Akio Takahashi , Katuo Sugawara , Masahiro Ono , Ritsuro Tada , Motoyo Wajima , Toshikazu Narahara
IPC分类号： C08L25/00 , C08F290/12 , C08F299/00 , C08J5/24 , C08L7/00 , C08L9/00 , C08L21/00 , C08L25/18 , C08L33/00 , C08L47/00 , H05K1/03 , B32B17/10 , B32B27/08 , B32B27/34
CPC分类号： C08L25/18 , C08F290/124 , C08F299/00 , C08J5/24 , C08L9/00 , H05K1/0326 , Y10T428/31645 , Y10T428/31746 , Y10T428/3175
摘要： A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.
摘要翻译：一种热固性树脂组合物，其包含作为必要组分（a）预聚物，其包含通式为其中A表示氢或卤素原子的聚（对羟基苯乙烯）衍生物或具有2〜 4个碳原子，m表示1〜4的数，n表示1〜100的数，（b）1,2-聚丁二烯或其衍生物。通过使用这种新型树脂组合物和常规设备和方法，可以容易地获得能够生产适合用于多层印刷电路板的低介电常数的层压材料的无粘性预浸料，其改善了接合铜箔的剥离强度，机械强度，阻燃性和耐热性。

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