会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 21. 发明授权
    • 전사기반의 임프린팅 공정을 이용한 함몰패턴 제작방법
    • 使用基于转移的印刷制作嵌入图案的方法
    • KR101449272B1
    • 2014-10-08
    • KR1020130044343
    • 2013-04-22
    • 한국기계연구원
    • 최준혁이응숙이지혜정준호정주연최대근김철현
    • B29C59/02B29C33/42
    • G02B5/008B32B37/06B82Y20/00G09F3/10Y10T156/1031Y10T156/1041
    • The present invention relates to an embedded pattern manufacturing method using a transfer-based imprinting process. The embedded pattern manufacturing method using a transfer-based imprinting process comprises: an adhesion layer laminating step of laminating an adhesion layer made up of photo-curable resins on a substrate; a stamp preparing step of preparing a stamp equipped with a protrusion pattern on which a thin film layer is deposited on an external surface; a thin layer transferring step of selectively transferring the thin layer on the protrusion pattern to the adhesion layer by pressurizing the stamp in conditions in which the thin film layer of the protrusion pattern and the adhesion layer are in contact; a hardening step of irradiating ultraviolet light so that the adhesion layer is hardened; and a releasing step of releasing the stamp, and is characterized by arranging the thin film layer transferred to an area embedded by stamp and the adhesion layer which is not pressurized by the stamp in the thin film layer transferring layer on an identical plane. Accordingly, the present invention provides the embedded pattern manufacturing method using a transfer-based imprinting process capable of manufacturing the embedded pattern of a uniform shape.
    • 本发明涉及使用基于转印的印刷方法的嵌入图案制造方法。 使用基于转印的压印方法的嵌入图案制造方法包括:将由光固化树脂构成的粘合层层压在基板上的粘合层层压步骤; 印模准备步骤,准备装有突起图案的印模,在外表面上沉积有薄膜层; 通过在突起图案和粘合层的薄膜层接触的条件下对印模进行加压来选择性地将突起图案上的薄层转移到粘合层的薄层转印步骤; 照射紫外线使得粘附层硬化的硬化步骤; 以及释放印模的释放步骤,其特征在于将薄膜层转印到由印模嵌入的区域和在薄膜层转印层中在同一平面上未被印模加压的粘合层。 因此,本发明提供了使用能够制造均匀形状的嵌入图案的基于转印的印刷工艺的嵌入图案制造方法。
    • 22. 发明授权
    • 금속 나노패터닝과 화학적 에칭 공정을 이용한 실리콘 나노튜브 제조방법
    • 使用金属辅助化学蚀刻制造硅纳米管的方法
    • KR101421047B1
    • 2014-07-22
    • KR1020130026170
    • 2013-03-12
    • 한국기계연구원
    • 최대근김한중최준혁이지혜정준호이응숙정주연
    • B82B3/00B29C59/02
    • C01B33/021B82B3/00C01P2004/13
    • The present invention relates to a method of manufacturing a silicone nanotube using metal nanopatterning and chemical etching. The method of manufacturing a silicone nanotube using metal nanopatterning and chemical etching given in the present invention includes: a preparation step of preparing a silicone layer; a stacking step of stacking a metal layer, on which a tube-shaped intaglio pattern is formed, on the top of the silicone layer; and an etching step of etching the silicone layer through a metal-assisted chemical etching process using the patterned metal to manufacture a tube-shaped silicone nanotube. Therefore, according to the present invention, provided is the method of manufacturing a silicone nanotube using metal nanopatterning and chemical etching which enables a large-area nanotube to be manufactured with reduced costs through a relatively-simple process.
    • 本发明涉及使用金属纳米图案和化学蚀刻制造硅氧烷纳米管的方法。 使用本发明中提供的金属纳米图案和化学蚀刻制造硅氧烷纳米管的方法包括:制备硅氧烷层的制备步骤; 将形成有管状凹版图案的金属层层叠在硅氧烷层的顶部上的层叠工序; 以及通过使用图案化金属的金属辅助化学蚀刻工艺蚀刻硅氧烷层以制造管状硅氧烷纳米管的蚀刻步骤。 因此,根据本发明,提供了使用金属纳米图案和化学蚀刻制造硅氧烷纳米管的方法,其能够通过相对简单的工艺以降低成本制造大面积纳米管。
    • 26. 发明公开
    • 금속박막의 선택적 제거에 의한 패턴형성 방법
    • 通过选择性去除形成金属薄膜图案的方法
    • KR1020140012331A
    • 2014-02-03
    • KR1020120078893
    • 2012-07-19
    • 한국기계연구원
    • 최준혁이응숙이지혜최대근정주연정준호
    • C23C26/00B82B3/00
    • The present invention relates to a method for forming a pattern of a metal thin film by selective removal capable of obtaining various effects by selectively removing sections to be removed in a metal thin film patterning process of a substrate. The method comprises: a deposition step of depositing a metal thin film layer on the substrate; a compression step of compressing a stamp having a protrusion pattern, which protrudes to partially increase bonding force between the substrate and the metal thin film layer, to the metal thin film layer; and a pattern forming step of forming the pattern by selectively removing the sections of the metal thin film layer which are not compressed by the protrusion pattern. [Reference numerals] (AA) START; (BB) END; (S110) Anti-adhesive treatment step; (S120) Deposition step; (S130) Compression step; (S140) Pattern formation step; (S141) Bonding step; (S142) Removal step
    • 本发明涉及一种用于通过选择性去除形成金属薄膜图案的方法,该方法能够通过在衬底的金属薄膜构图工艺中选择性地除去待除去的部分而获得各种效果。 该方法包括:在衬底上沉积金属薄膜层的沉积步骤; 压缩步骤,压缩具有凸起图案的印模,所述凸起图案突出以部分地增加所述基板和所述金属薄膜层之间的结合力,所述压缩步骤到所述金属薄膜层; 以及图案形成步骤,通过选择性地去除未被突起图案压缩的金属薄膜层的部分来形成图案。 (附图标记)(AA)START; (BB)END; (S110)防粘处理工序; (S120)沉积步骤; (S130)压缩步骤 (S140)图案形成步骤; (S141)接合工序; (S142)去除步骤
    • 29. 发明公开
    • Ti-Nb-X계 타이타늄 합금의 에칭방법
    • 蚀刻基于TI-NB-X的钛合金的方法
    • KR1020130026159A
    • 2013-03-13
    • KR1020110089606
    • 2011-09-05
    • 한국기계연구원
    • 이동근이지혜이용태
    • C23F1/26C23F1/44
    • C23F1/44C09K13/04C23F1/26
    • PURPOSE: An etching method of Ti - Nb - X group titanium alloy is provided to clearly observe grain boundary by reducing over-etching phenomenon which is presented when etching sample after heat treatment. CONSTITUTION: An etching method of Ti - Nb - X group titanium alloy etches by soaking alloy in etchant including 2 - 15 wt% of nitric acid(HNO3), 1 - 20 wt% of hydrofluoric acid(HF), and rest water. If an alloy material is heat-treated, the ally etches by soaking in etchant including 3 - 10 wt% of HNO3, 1 - 10 wt% of HF, and rest water. In an immersion process, the etchant is stirred for 2-15 second. The etchant which is adhered in the immersion process is completely removed through rinse step between immersion process while repeating the immersion process. X is one kind or more which is selected from Zr, Ge, Si, V, Ta and Sn.
    • 目的:提供Ti-Nb-X族钛合金的蚀刻方法,通过减少在热处理后刻蚀样品时出现的过蚀刻现象,清楚地观察晶界。 构成:通过在包括2-15重量%硝酸(HNO 3),1-20重量%氢氟酸(HF)和静止水的蚀刻剂中浸渍合金来蚀刻Ti-Nb-X族钛合金蚀刻方法。 如果对合金材料进行热处理,则通过在含有3〜10重量%的HNO 3,1-10重量%的HF和静止水的蚀刻剂中浸泡而进行的相互蚀刻。 在浸渍过程中,将蚀刻剂搅拌2-15秒。 浸渍过程中粘附的蚀刻剂通过浸渍过程之间的冲洗步骤完全去除,同时重复浸渍过程。 X是选自Zr,Ge,Si,V,Ta和Sn中的一种以上。