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21. 发明申请

US20140141956A1 SHEET PROCESSING APPARATUS, IMAGE FORMING SYSTEM, AND SHEET FOLDING METHOD 有权
标题翻译：表格处理设备，图像形成系统和图纸折叠方法
公开(公告)号：US20140141956A1
公开(公告)日：2014-05-22
申请号：US14070932
申请日：2013-11-04
申请人： Yuuji SUZUKI , Tomohiro FURUHASHI , Shuuya NAGASAKO , Akira KUNIEDA , Michitaka SUZUKI , Kyosuke NAKADA , Kazuya YAMAMOTO , Takahiro WATANABE , Kiichiro GOTO
发明人： Yuuji SUZUKI , Tomohiro FURUHASHI , Shuuya NAGASAKO , Akira KUNIEDA , Michitaka SUZUKI , Kyosuke NAKADA , Kazuya YAMAMOTO , Takahiro WATANABE , Kiichiro GOTO
IPC分类号： B65H45/04
CPC分类号： B31F1/10 , B31F1/0025 , B65H45/14 , B65H45/147 , B65H45/20
摘要： A sheet processing apparatus includes: a first pair of conveying members that convey a sheet; a second pair of conveying members that receive the sheet conveyed by the first pair of the conveying members and further conveys the sheet to a subsequent stage; and a third pair of conveying members that fold the sheet by rotating the second pair of the conveying members in a reverse direction while the sheet is held by the first pair of the conveying members and the second pair of the conveying members. One of the conveying members of the second pair serves as one of the conveying members of the third pair.
摘要翻译：片材处理设备包括：第一对输送片材的输送构件; 第二对输送构件，其接收由第一对输送构件输送的纸张，并进一步将纸张输送到后续阶段; 以及第三对输送构件，其通过在第一对输送构件和第二对输送构件保持片材的同时沿相反方向旋转第二对输送构件而折叠片材。第二对的输送构件之一用作第三对的输送构件之一。

22. 发明授权

US07976956B2 Laminated circuit board 失效
标题翻译：层压电路板
公开(公告)号：US07976956B2
公开(公告)日：2011-07-12
申请号：US11594134
申请日：2006-11-08
申请人： Yuuji Suzuki , Yuuki Kikuchi , Satoru Zama
发明人： Yuuji Suzuki , Yuuki Kikuchi , Satoru Zama
IPC分类号： B32B3/00
CPC分类号： H05K3/384 , B32B15/08 , B32B15/20 , H05K3/4069 , H05K2201/0272 , H05K2201/0355 , H05K2203/0307 , H05K2203/0425 , H05K2203/0723 , H05K2203/1461 , Y10T29/49124 , Y10T29/49128 , Y10T428/12438 , Y10T428/12451 , Y10T428/24917
摘要： A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2 to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.
摘要翻译：通过使用铜箔和含有低熔点金属的导电膏，电连接的可靠性高，而不会在铜箔和导电膏金属之间的边界处产生有害的空隙和裂纹。层压电路板是通过使至少在其一个表面侧至少具有粗糙化处理的铜箔的多个树脂板层叠多个树脂板而形成的，其粗化投影沉积小于150mg / dm 2，使得表面粗糙度Rz为0.3〜10μm，高度为投影为0.3〜10μm。原始箔的表面粗糙度为0.1〜5μm，粗化处理层的铜金属原子的量设定为含有低熔点金属的扩散性导电性糊状金属原子的量的4倍以下，箔表面。

23. 发明申请

US20100270063A1 ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING SAME 失效
标题翻译：超薄铜箔与载体和印刷电路板使用相同
公开(公告)号：US20100270063A1
公开(公告)日：2010-10-28
申请号：US12827018
申请日：2010-06-30
申请人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
发明人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
IPC分类号： H05K1/09 , B32B15/01
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译：一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放层和超薄铜箔，其中剥离层由用于保持剥离性质的金属A形成，金属B由金属A的含量“a”和含量“b 形成释放层的金属B满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

24. 发明授权

US07771841B2 Ultrathin copper foil with carrier and printed circuit board using same 有权
标题翻译：超薄铜箔带载体和印刷电路板使用相同
公开(公告)号：US07771841B2
公开(公告)日：2010-08-10
申请号：US11639439
申请日：2006-12-15
申请人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
发明人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
IPC分类号： B32B15/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译：一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成满足以下等式的剥离层：10＆lt; nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

25. 发明授权

US07381475B2 Treated copper foil and circuit board 失效
标题翻译：处理铜箔和电路板
公开(公告)号：US07381475B2
公开(公告)日：2008-06-03
申请号：US11052998
申请日：2005-02-07
申请人： Yuuji Suzuki
发明人： Yuuji Suzuki
IPC分类号： B32B15/20
CPC分类号： C25D1/04 , C25D5/16 , C25D7/0614 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12063 , Y10T428/12438 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/24917 , Y10T428/25
摘要： An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 μm and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 μm, preferably 6 to 35 thereof are uniformly distributed in a 25 μm of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 μm and not more than twice of 25 μm divided by the number of projections in the 25 μm surface length.
摘要翻译：本发明的目的是提供一种具有低吸湿性和优异的高耐热性的介晶聚合物膜的处理铜箔，以制造具有大的剥离强度和与精细图案工艺相容的电路板复合材料，铜箔是沉积有粗糙颗粒以使具有1.5至4.0μm的表面粗糙度和不大于30的表面粗糙度的粗糙化处理侧的处理过的铜箔具有由粗糙度为1至5μm，优选6至5μm的粗糙颗粒形成的突起 35均匀分布在观察到的铜箔截面的25μm的表面长度上，其最大宽度为25μm以上的0.01μm以上2倍以下，除以25μm的表面长度的突起数。

26. 发明申请

US20080005759A1 DISK DRIVE DEVICE 失效
标题翻译：磁盘驱动器
公开(公告)号：US20080005759A1
公开(公告)日：2008-01-03
申请号：US11766366
申请日：2007-06-21
申请人： Kiyoshi OMORI , Noriyoshi Ishii , Hideaki Tsutsumi , Shigeru Tamura , Katsunori Takahashi , Yuuji Suzuki , Yoichiro Mitsumoto , Manabu Obata
发明人： Kiyoshi OMORI , Noriyoshi Ishii , Hideaki Tsutsumi , Shigeru Tamura , Katsunori Takahashi , Yuuji Suzuki , Yoichiro Mitsumoto , Manabu Obata
IPC分类号： G11B7/24
CPC分类号： G11B17/051 , G11B17/0515
摘要： A disk drive device includes a device main body in which a disk slot for inserting and removing a disk-like recording medium is provided, a disk holding unit that rotatably holds the disk-like recording medium, a main chassis that supports the disk holding unit and a base unit, an arm unit rotatably supported on one or the other side in a plane parallel to the disk-like recording medium, an urging arm that urges the disk-like recording medium, a first centering member that supports the side of the disk-like recording medium, and a second centering member that supports the side of the disk-like recording medium. The first centering member and the second centering member are regulated in positions to support the side of the disk-like recording medium. The first centering member and the second centering member support the disk-like recording medium in a centering position.
摘要翻译：磁盘驱动装置包括：设置有用于插入和移除盘状记录介质的盘槽的装置主体;可旋转地保持盘状记录介质的盘保持单元;支撑盘保持单元的主机架; 基座单元，可旋转地支撑在与盘状记录介质平行的平面中的一侧或另一侧的臂单元，推动盘状记录介质的推动臂，支撑所述盘状记录介质的一侧的第一定心构件盘状记录介质和支撑盘状记录介质侧的第二定心构件。第一定心构件和第二定心构件被调节在支撑盘状记录介质的侧面的位置。第一定心构件和第二定心构件将盘状记录介质支撑在定心位置。

27. 发明申请

US20070228443A1 CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, METHOD OF PRODUCTION OF CONDUCTIVE BASE MATERIAL WITH THIN FILM RESISTANCE LAYER, AND CIRCUIT BOARD WITH THIN FILM RESISTANCE LAYER 审中-公开
标题翻译：具有薄膜电阻层的导电基材，具有薄膜电阻层的导电基材的生产方法和具有薄膜电阻层的电路板
公开(公告)号：US20070228443A1
公开(公告)日：2007-10-04
申请号：US11693273
申请日：2007-03-29
申请人： Yuuki KIKUCHI , Yuuji Suzuki , Sadao Matsumoto , Satoru Zama , Yoshiaki Ogiwara
发明人： Yuuki KIKUCHI , Yuuji Suzuki , Sadao Matsumoto , Satoru Zama , Yoshiaki Ogiwara
IPC分类号： H05K1/03
CPC分类号： H05K1/167 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723 , H05K2203/1105 , Y10T29/49082
摘要： An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.
摘要翻译：具有薄膜电阻层的廉价的导电基材，具有薄的电阻值变化小的导电性基材和具有通过稳定地留下电阻元件而制造印刷电阻电路板的电阻层的导电性基材，即导电性基材具有薄膜电阻层，其由在其表面上形成有电阻层的导电性基材构成，其中电阻层包括含有P的Ni和非晶态和晶体形式混合在一起，并且具有薄膜电阻层的导电基材包含具有在其表面上形成的电阻层的导电基材，其中电阻层是包含含Ni的结晶薄膜电阻层。

28. 发明申请

US20070141381A1 Ultrathin copper foil with carrier and printed circuit board using same 有权
标题翻译：超薄铜箔带载体和印刷电路板使用相同
公开(公告)号：US20070141381A1
公开(公告)日：2007-06-21
申请号：US11639439
申请日：2006-12-15
申请人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
发明人： Yuuji Suzuki , Takami Moteki , Kazuhiro Hoshino , Satoshi Fujisawa , Akira Kawakami
IPC分类号： B22D25/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译：一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成释放层，满足以下等式：<？in-line-formula description =“In-line Formulas”end =“lead”？> 10 <= a /（a + b）* 100 <= 70 < line-formula description =“In-Line Formulas”end =“尾”？和通过使用这种超薄铜箔与载体制备的印刷电路板。

29. 发明申请

US20070042212A1 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil 审中-公开
标题翻译：铜箔用于高频电路，生产方法及其生产设备，以及使用铜箔的高频电路
公开(公告)号：US20070042212A1
公开(公告)日：2007-02-22
申请号：US11585881
申请日：2006-10-25
申请人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
发明人： Takami Moteki , Yuuji Suzuki , Kazuhiro Hoshino , Kensaku Shinozaki , Akira Matsuda
IPC分类号： B21C37/00 , C25B11/04
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译：铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。

30. 发明申请

US20050280498A1 Conductive base material with resistance layer and circuit board material with resistance layer 审中-公开
标题翻译：具有电阻层的导电基材和具有电阻层的电路板材料
公开(公告)号：US20050280498A1
公开(公告)日：2005-12-22
申请号：US11153609
申请日：2005-06-16
申请人： Yuuki Kikuchi , Akira Matsuda , Yuuji Suzuki , Sadao Matsumoto
发明人： Yuuki Kikuchi , Akira Matsuda , Yuuji Suzuki , Sadao Matsumoto
IPC分类号： C25D3/56 , C25D5/12 , C25D5/16 , C25D7/06 , H05K1/16 , H05K3/38 , H01C1/012
CPC分类号： C25D7/0614 , C25D3/562 , C25D5/12 , C25D5/16 , H05K1/167 , H05K3/384 , H05K2201/0355 , H05K2203/0361 , H05K2203/0723
摘要： A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 μm and the resistance layer of Ni alloy layer containing at least 8 to 18 wt % of P is formed on the roughening treated side.
摘要翻译：具有电阻层的导电性基材在其表面上形成均匀厚度分布的电阻层的粗糙导电性基材，以及使用其的电阻电路基板材料，其中具有粒状结晶的电解铜箔在其上进行粗糙化处理至少一个表面以获得不大于2.5μm的Rz，并且在粗糙化处理侧上形成含有至少8至18重量％的P的Ni合金层的电阻层。

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