专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US4944569A Multi-fiber alignment package for optoelectronic components 失效
标题翻译：用于光电子元件的多光纤对准封装
公开(公告)号：US4944569A
公开(公告)日：1990-07-31
申请号：US395931
申请日：1989-08-18
申请人： Robert A. Boudreau , Joanne S. LaCourse
发明人： Robert A. Boudreau , Joanne S. LaCourse
IPC分类号： G02B6/42 , H01S5/00
CPC分类号： G02B6/4238 , G02B6/4225 , Y10S257/93
摘要： A localized cooling method allows the sequential alignment and soldering of one optical fiber at a time to a semiconductor package, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber optoelectronic packages demanding stability and high precision. A package design for optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The localized cooling method and the novel package utilizing this method internally make it possible to eliminate the tilted angle optical fiber alignment problem by mounting tilted facet optical amplifier components at a predetermined offset angle.

22. 发明授权

US06970628B2 Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit 有权
标题翻译：具有形成在平面光波电路上的光学元件的半导体光学部件的主动光学对准和附接
公开(公告)号：US06970628B2
公开(公告)日：2005-11-29
申请号：US10826145
申请日：2004-04-15
申请人： Robert A. Boudreau
发明人： Robert A. Boudreau
IPC分类号： B81C3/00 , G02B6/26 , G02B6/36 , G02B6/42
CPC分类号： G02B6/422 , B81C3/002 , G02B6/4226 , G02B6/4238 , H01L2224/81801 , H01L2924/01322 , H01L2924/12041
摘要： A method and apparatus is provided for attaching a bulk element processing an optical beam to a PLC and optically aligning the bulk element with an optical element formed on the PLC. The method begins by securing the bulk element to a first side of a substrate. A first side of a flexure element is secured to the first side of the substrate. A second side of the flexure element is secured to a first side of the PLC on which the optical element is formed such that the bulk element and the optical element are in optical alignment to within a first level of tolerance. Subsequent to the step of securing the second side of the flexure element, a force is exerted on at least a second side of the substrate to thereby flex the flexure element. The force causes sufficient flexure of the flexure element to optically align the bulk element and optical element to within a second level of tolerance that is more stringent than the first level of tolerance.
摘要翻译：提供了一种方法和装置，用于将处理光束的体元件附接到PLC并且将块体元件与形成在PLC上的光学元件进行光学对准。该方法通过将块状元件固定到衬底的第一侧开始。挠曲元件的第一侧固定到基板的第一侧。弯曲元件的第二侧被固定到其上形成有光学元件的PLC的第一侧，使得块体元件和光学元件在第一公差范围内光学对准。在固定挠曲元件的第二侧的步骤之后，力施加在基板的至少第二侧上，从而使挠曲元件弯曲。该力引起挠曲元件的足够弯曲以将散装元件和光学元件光学对准到比第一公差水平更严格的第二公差范围内。

23. 发明授权

US06574399B2 Ceramic waferboard for integration of optical/optoelectronic/electronic components 有权
标题翻译：用于光学/光电子/电子元件集成的陶瓷片
公开(公告)号：US06574399B2
公开(公告)日：2003-06-03
申请号：US10015914
申请日：2001-11-02
申请人： Robert A. Boudreau , Songsheng Tan
发明人： Robert A. Boudreau , Songsheng Tan
IPC分类号： G02B630
CPC分类号： G02B6/423 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/3696
摘要： An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
摘要翻译：光电模块包括具有被配置为被动地定位光纤的凹槽的陶瓷晶片板。陶瓷晶片板包括被配置为被动地定位光学部件的对准特征。光学装置固定到与对准特征接触的陶瓷片板上，从而定位光学装置。光纤定位在槽中，其中光纤的端部位于光学器件附近，从而将光纤光耦合到光学器件。光电子模块还包括固定到陶瓷晶片板上的集成电路芯片和设置在陶瓷晶片板上并将集成电路芯片电耦合到光学器件的导电材料。

24. 发明授权

US5026138A Multi-fiber alignment package for tilted facet optoelectronic components 失效
标题翻译：用于倾斜面光电元件的多光纤对准封装
公开(公告)号：US5026138A
公开(公告)日：1991-06-25
申请号：US400593
申请日：1989-08-29
申请人： Robert A. Boudreau , Joanne S. LaCourse
发明人： Robert A. Boudreau , Joanne S. LaCourse
IPC分类号： G02B6/42 , H01S5/00
CPC分类号： G02B6/4238 , G02B6/4202 , G02B6/4249 , G02B6/4225
摘要： A method of compensating for the angular coupling of optical fibers to a tilted facet optoelectronic component involves a precise calculation of the coupling angle with respect to the active layer of the component and with respect to the side walls of the package in which the component is to be mounted. With these angles computed, the tilted facet component is positioned on a carrier at an offset to the perpendicular such that input/output fibers can exit the component package perpendicularly to its sidewalls. The component is secured to the carrier by a solder having a high melting point such that subsequent soldering of parts to the carrier will not affect the component positioning. A localized cooling method then allows the sequential alignment and soldering of one optical fiber at a time to the offset tilted facet component, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber optoelectronic packages demanding stability and high precision. A package design for tilted facet optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The package utilizing localized cooling method internally eliminates the tilted facet-optical fiber alignment problem, while providing standard lead configurations.

25. 发明授权

US5024504A Method of aligning and packaging an optoelectronic component with a single-mode optical fiber array 失效
标题翻译：将光电子元件与单模光纤阵列对准和封装的方法
公开(公告)号：US5024504A
公开(公告)日：1991-06-18
申请号：US439761
申请日：1989-11-20
申请人： Robert A. Boudreau , William C. Rideout
发明人： Robert A. Boudreau , William C. Rideout
IPC分类号： G02B6/42
CPC分类号： G02B6/4249 , G02B6/425
摘要： A method for optically coupling multiple single-mode optical fibers to a single packaged optoelectronic array device uses a single graded index lens to magnify the images of the active semi-conductor elements and to expand the spacing between their light beams. These separated magnified light beams then coupled to an associated array of uptapered optical fibers. Simultaneous alignment is possible because the location of the semiconductor array beams can be known with high precision relative to the central beam in the array. A lens with known magnification is first positioned relative to the central beam. Alignment to this central beam automatically aligns other optical fibers held collectively in a fixture engineered with the geometry set by the known magnification of the lens. The coupling of single-mode optical fiber to two-dimensional semiconductor surface arrays utilizes the projected and magnified beams of the array which replicate the precise placement of the array elements. A mandrel supports the uptapered optical fibers. Simultaneous alignment of the optical fiber array is performed by first aligning the center fiber, and then rotating the mandrel until the outside fibers come into alignment.
摘要翻译：将多个单模光纤光学耦合到单个封装的光电阵列器件的方法使用单个渐变折射率透镜放大有源半导体元件的图像并扩大其光束之间的间隔。然后将这些分离的放大光束耦合到相关阵列的开锁光纤。同时对准是可能的，因为相对于阵列中的中心束，可以以高精度知道半导体阵列光束的位置。具有已知放大率的透镜首先相对于中心光束定位。与该中心束的对准自动地对准被固定在夹具中的其他光纤，其中工件具有由透镜的已知放大倍率设置的几何形状。单模光纤耦合到二维半导体表面阵列利用阵列的投影和放大的光束，其复制阵列元件的精确放置。心轴支撑着开口的光纤。通过首先对准中心纤维，然后旋转心轴直到外部纤维对准，来执行光纤阵列的同时对准。

26. 发明授权

US5018820A Method of optically coupling an uptapered single-mode optical fiber to optoelectronic components 失效
标题翻译：将阻尼单模光纤光学耦合到光电子部件的方法
公开(公告)号：US5018820A
公开(公告)日：1991-05-28
申请号：US526367
申请日：1990-05-21
申请人： Robert A. Boudreau , William C. Rideout
发明人： Robert A. Boudreau , William C. Rideout
IPC分类号： G02B6/42 , H01S5/00
CPC分类号： G02B6/4224 , G02B6/4208 , G02B6/4209 , G02B6/4225 , G02B6/423
摘要： A method of optically coupling an optoelectronic device having a photoactive element to an uptapered single-mode optical fiber which connects said optoelectronic device to an external device includes securing a graded index lens to a substrate carrier within a housing at a distance calculated to provide a known magnification of a light beam emanating from said element, and further includes mechanically positioning and actively aligning the fiber to said magnified light beam to achieve optimal optical coupling to said optoelectronic device. The location of a plurality of reference marks and surfaces are determined such that the photoactive element, the lens and the uptapered end of the single-mode optical fiber may be positioned with respect to these references for precise optical coupling using an active alignment for final adjustments. The reference surfaces include a pedestal for the laser and a plurality of stops for the lens integrally formed with the substrate. The method also includes mechanically positioning the uptapered fiber within a fiber tube which is removably secured to a flange. The precisely calculated alignment based on the spacing of said photoactive element, the magnification of said lens, and the fiber positioning is achieved by mechanical means.

27. 发明授权

US4957342A Single-mode optical fiber array package for optoelectronic components 失效
标题翻译：用于光电元件的单模光纤阵列封装
公开(公告)号：US4957342A
公开(公告)日：1990-09-18
申请号：US444500
申请日：1989-11-30
申请人： Robert A, Boudreau , William C. Rideout
发明人： Robert A, Boudreau , William C. Rideout
IPC分类号： G02B6/42
CPC分类号： G02B6/425 , G02B6/4249
摘要： A package for an optoelectronic array device having an array of n active elements optically coupled to an array of n single-mode optical fibers which connect said optoelectronic array to an external device includes a housing having a solderable substrate to which the array device is secured, a graded index lens also secured to said array at a distance calculated to provide a known magnification of light beams emanating from said array and n uptapered single-mode optical fibers actively aligned to said magnified light beams to achieve optimal optical coupling to said optoelectronic array. The package optionally includes a multifiber holder having precisely calculated spacing based on the spacing of said active elements which are usually semiconductor lasers and the magnification of said lens. For a two-dimensional surface array, the package includes a mandrel to position the uptapered optical fibers.
摘要翻译：一种用于光电阵列器件的封装，其具有与所述光电子阵列连接到外部器件的n个单模光纤的阵列光学耦合的n个有源元件的阵列，该阵列具有可焊接的基板，阵列器件被固定到该壳体上，渐变折射率透镜在一定距离处被固定到所述阵列，以便提供从所述阵列发出的光束的已知放大率和与所述放大光束主动对准的n个保护单模光纤，以实现对所述光电子阵列的最佳光耦合。该封装可选地包括基于通常是半导体激光器的所述有源元件的间隔和所述透镜的放大率具有精确计算的间隔的多光纤保持器。对于二维表面阵列，包装件包括用于定位开口的光纤的心轴。

28. 发明授权

US4915057A Apparatus and method for registration of shadow masked thin-film patterns 失效
标题翻译：掩膜薄膜图案配准的装置和方法
公开(公告)号：US4915057A
公开(公告)日：1990-04-10
申请号：US930844
申请日：1986-11-14
申请人： Robert A. Boudreau , Robert J. Wilkie
发明人： Robert A. Boudreau , Robert J. Wilkie
IPC分类号： C23C14/04 , C23C16/04 , H01L21/68
CPC分类号： C23C14/042 , C23C16/042 , H01L21/682
摘要： An apparatus and method for registration or alignment of thin film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system. On particular the alignment apparatus is comprised of a mask holder assembly, which supports the apertured mask, and a substrate carrier which engages with the holder assembly. Upon placing the engaged alignment apparatus in a a deposition chamber, a magnet is positioned adjacent the holder assembly in order to formly hold the apertured mask against a substrate prior to vacuum to deposition. Upon depositing the pattern material, the magnet and holder assembly are disengaged, resulting in a pattern of thin film structures remaining on the substrate. The present invention is effective for remotely operating automatic masking systems where there is a need to eliminate the need for breaking vacuum in a deposition system.
摘要翻译：一种用于在真空沉积系统中使用有孔掩模形成的衬底上的薄膜结构图案的配准或对准的装置和方法。特别地，对准装置由支撑有孔掩模的掩模保持器组件和与保持器组件接合的基板载体构成。在将接合的定位装置放置在沉积室中时，将磁体定位成邻近保持器组件，以在真空沉积之前将孔径掩模形式地保持在衬底上。在沉积图案材料时，磁体和保持器组件脱离，导致残留在衬底上的薄膜结构的图案。本发明对于远程操作自动掩蔽系统是有效的，其中需要消除在沉积系统中破坏真空的需要。

29. 发明授权

US4715940A Mask for patterning electrode structures in thin film EL devices 失效
标题翻译：用于在薄膜EL器件中构图电极结构的掩模
公开(公告)号：US4715940A
公开(公告)日：1987-12-29
申请号：US790590
申请日：1985-10-23
申请人： Robert A. Boudreau
发明人： Robert A. Boudreau
IPC分类号： H05B33/10 , C04B41/45 , C04B41/81 , C23C14/04 , C23C16/04 , H05B33/12 , H05B33/22 , H05B33/26 , H05B33/28 , H05K3/14 , C23C14/00
CPC分类号： C04B41/009 , C04B41/4572 , C04B41/81 , C23C14/042 , C23C16/042 , H05B33/26 , H05B33/28 , C04B2111/00844 , H05K3/143
摘要： A shadow mask is provided which can provide a precise patterning to a deposit at process temperature without destruction of the shadow mask itself. The shadow mask consists of a plurality of metallic strips having a series of interconnecting small arched bridges that hold the strips of the mask together. The shadow mask is used in a process for depositing electrode structures in an electroluminescent device wherein the mask is positioned over a substrate surface to be coated and deposit electrode material is sprayed from a geometrically broad source, through the mask and onto the substrate. Deposition occurs beneath the arched bridges resulting in a pattern deposition that does not readily reveal the presence of bridges because sufficient material is coated beneath to provide cosmetic and electrical continuity between areas separated by the bridges. This invention is particularly suited for a mask designed to provide a fine pattern of closely spaced parallel lines or electrode structures.
摘要翻译：提供一种荫罩，其可以在处理温度下提供精确的图案化到沉积物，而不会破坏荫罩本身。荫罩由多个具有一系列相互连接的小拱形桥梁的金属条构成，该桥将保护罩的条带固定在一起。阴影掩模用于在电致发光器件中沉积电极结构的工艺中，其中掩模位于待涂覆的衬底表面上，并且沉积电极材料从几何宽的源通过掩模喷射到衬底上。沉积发生在拱形桥下方，导致图案沉积，其不容易揭示桥的存在，因为足够的材料被涂覆在下面以提供由桥隔开的区域之间的美观和电连续性。本发明特别适用于设计成提供紧密间隔的平行线或电极结构的精细图案的掩模。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式