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21. 发明授权

US4909151A Method of forming an ink image and printing the formed image 失效
标题翻译：形成油墨图像并打印所形成图像的方法
公开(公告)号：US4909151A
公开(公告)日：1990-03-20
申请号：US178647
申请日：1988-04-07
申请人： Yasuo Fukui , Masahide Tsukamoto , Yutaka Nishimura
发明人： Yasuo Fukui , Masahide Tsukamoto , Yutaka Nishimura
IPC分类号： B41F16/00 , B41M1/00 , B41M1/08 , B41M5/382
CPC分类号： B41M1/00 , B41M1/08
摘要： A method of forming an ink image with a thermo-sensitive ink by using a printing plate that is used in dry lithographic printing, and printing the ink image onto an object. An ink remover is placed via a thermo-sensitive ink layer that is in a heated state on a printing surface of a printing plate having a part receptive to ink and a part capable of repelling ink. The printing plate and the ink remover are separated after they are cooled so that the ink layer on the part capable of repelling ink is transferred to the ink remover. The ink image obtained on the printing plate or the ink remover is transferred to an object. Printing that does not require maintenance that has been essential to conventional dry lithographic printing becomes possible.

22. 发明授权

US6045897A Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same 失效
标题翻译：印刷电路板用无纺布布基材和使用其的预浸料
公开(公告)号：US6045897A
公开(公告)日：2000-04-04
申请号：US178852
申请日：1998-10-26
申请人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
发明人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
IPC分类号： B32B15/14 , C08J5/04 , C09D5/25 , D04H1/00 , D04H1/42 , D04H1/58 , D21H13/26 , D21H17/52 , H05K1/02 , H05K1/03 , D21H13/02
CPC分类号： H05K1/0366 , B32B15/14 , C08J5/04 , D04H1/00 , D04H1/4342 , D04H1/4382 , D04H1/64 , D21H13/26 , D21H17/52 , H05K1/024 , H05K2201/0239 , H05K2201/0278 , H05K2201/0293 , H05K2203/0783 , H05K2203/087 , H05K2203/097 , H05K2203/1105 , Y10T442/198 , Y10T442/2049 , Y10T442/2475 , Y10T442/2902 , Y10T442/626
摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.
摘要翻译：一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

23. 发明授权

US5960538A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US5960538A
公开(公告)日：1999-10-05
申请号：US31082
申请日：1998-02-26
申请人： Kouji Kawakita , Seiichi Nakatani , Masahide Tsukamoto
发明人： Kouji Kawakita , Seiichi Nakatani , Masahide Tsukamoto
IPC分类号： H05K1/11 , H01L21/48 , H01L23/367 , H01L23/538 , H05K1/02 , H05K3/06 , H05K3/40 , H05K3/46 , H05K3/02
CPC分类号： H05K3/4069 , H01L21/4857 , H01L21/486 , H01L23/3677 , H01L23/5384 , H05K1/0206 , H01L2224/16 , H01L2224/16235 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H05K2201/0209 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156 , Y10T428/24917 , Y10T428/24926
摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.
摘要翻译：本发明提供一种印刷电路板，其中电极层可以通过内部通孔连接而电连接，板的热膨胀系数等于半导体的热膨胀系数，可以获得高导热性，并且布线可以以高密度形成。在树脂浸渍织物片的两个表面上层压覆盖膜，在片材和覆盖膜的厚度方向上通过激光束形成孔，填充含有导电性粒子和热固性树脂的导电性糊剂在洞里除去覆盖膜，将铜箔放置在片材的两侧，并被加压和加热，并且片材的树脂成分和导电膏的树脂成分硬化。蚀刻铜箔以形成电路图案，并且进一步蚀刻除去存在于表面层部分的导电颗粒，从而形成电绝缘层。

24. 发明授权

US5407511A Process for forming a sintered conductor circuit board 失效
标题翻译：形成烧结导体电路板的工艺
公开(公告)号：US5407511A
公开(公告)日：1995-04-18
申请号：US214267
申请日：1994-03-17
申请人： Seiichi Nakatani , Masahide Tsukamoto , Mikinari Shimada
发明人： Seiichi Nakatani , Masahide Tsukamoto , Mikinari Shimada
IPC分类号： H05K1/09 , C04B35/583 , H01L21/48 , H05K1/03 , H05K1/11 , H05K3/20 , H05K3/40 , H05K3/46 , B44C1/165 , B32B31/00
CPC分类号： C04B35/583 , H01L21/4857 , H01L21/4867 , H05K3/207 , H05K3/4069 , H05K1/0313 , H05K1/092 , H05K1/095 , H05K2201/0394 , H05K2203/016 , H05K2203/1453 , H05K2203/1461 , H05K3/4614 , H05K3/462
摘要： A circuit board that is made compact or highly dense and can be prepared using no chemical etching is obtained by patternwise printing a sinterable conductor on a releasing substrate, sintering the conductor by heating at a given temperature, and transferring the sintered conductor to a resin support. A plurality of sintered conductors each prepared by the above process may be laminated to give a multi-layered circuit board.
摘要翻译：通过在剥离基板上图案化印刷可烧结导体，通过在给定温度下加热烧结导体，并将烧结导体转印到树脂载体上，获得致密或高密度且不经化学蚀刻制备的电路板。可以将通过上述方法制备的多个烧结导体层叠以形成多层电路板。

25. 发明授权

US5141461A Method of forming a metal-backed layer and a method of forming an anode 失效
标题翻译：形成金属背层的方法和形成阳极的方法
公开(公告)号：US5141461A
公开(公告)日：1992-08-25
申请号：US478499
申请日：1990-02-12
申请人： Yutaka Nishimura , Masahide Tsukamoto , Hirotoshi Watanabe , Kohji Matsuo , Noboru Aikawa
发明人： Yutaka Nishimura , Masahide Tsukamoto , Hirotoshi Watanabe , Kohji Matsuo , Noboru Aikawa
IPC分类号： H01J9/14 , H01J29/08 , H01J29/28
CPC分类号： H01J29/085 , H01J29/28 , H01J9/14
摘要： This invention proposes methods of effectively forming a metal-backed layer and an anode using a metal film transferring sheet in which micro-holes are formed. that is, the metal film transferring sheet is structured by forming a metal film on a mold-releasable, highly characteristic sheet. Then, the metal film having micro-holes of the metal film transferring sheet is transferred onto a phosphor screen. Or, on the metal film of the above-mentioned metal film transferring sheet, is formed a phosphor screen and the metal film, the phosphor screen, etc. are all transferred onto a face plate form an anode of a cathode-ray tube. Then the methods proposed by this invention are applied for making phosphor products of, for example, a cathode-ray tube or a plasma display. According to these methods, there is no need to use a large-scaled manufacturing facility and high quality, low cost products can be obtainable.

26. 发明授权

US5006189A Coating method and cleaning method for heat-soluble material 失效
标题翻译：热溶性材料的涂布方法和清洗方法
公开(公告)号：US5006189A
公开(公告)日：1991-04-09
申请号：US357597
申请日：1989-05-26
申请人： Masahide Tsukamoto , Yutaka Nishimura , Yasuo Fukui
发明人： Masahide Tsukamoto , Yutaka Nishimura , Yasuo Fukui
IPC分类号： B41J17/40 , B41J31/14 , B41M5/26 , B41M5/382 , B44C1/00
CPC分类号： B41M5/38207 , B41J17/40 , B41J31/14 , Y10T156/1153
摘要： Coating of heat-soluble material on a substrate or cleaning is performed by supplying a heat-soluble material in heated and melted condition onto a substrate, laying a sheet member on the heat-soluble material, cooling the heat-soluble material to solidify, and peeling off the sheet member.

27. 发明授权

US4203082A Surface acoustic wave filter 失效
标题翻译：表面声波滤波器
公开(公告)号：US4203082A
公开(公告)日：1980-05-13
申请号：US911082
申请日：1978-05-31
申请人： Masahide Tsukamoto , Masahiro Nagasawa , Hiroshi Yamazoe
发明人： Masahide Tsukamoto , Masahiro Nagasawa , Hiroshi Yamazoe
IPC分类号： H03H3/08 , H03H9/00 , H03H9/145 , H03H9/64 , H03H9/04 , H01L41/10 , H03H9/26 , H03H9/32
CPC分类号： H03H9/1455 , H03H9/0038 , H03H9/1452 , H03H9/14547 , H03H9/14558 , H03H9/14564 , H03H9/14567 , H03H9/14594 , H03H9/6433 , H03H9/14552
摘要： To obtain low insertion loss and low TTE level, a first central transducer, a second transducer and a third transducer are disposed on one surface of a piezoelectric substrate in such a manner that the second and the third transducers are in the direction of propagation (X-direction) of surface acoustic waves launched by the first transducer and the distance between center lines of the first and the second transducers and also the distance between the center lines of the first and the third transducers vary along the Y-direction perpendicular to the X-direction.
摘要翻译：为了获得低插入损耗和低TTE电平，第一中心换能器，第二换能器和第三换能器以这样的方式设置在压电基板的一个表面上，使得第二和第三换能器处于传播方向（X 由第一换能器发射的表面声波和第一和第二换能器的中心线之间的距离以及第一和第三换能器的中心线之间的距离沿垂直于X的Y方向变化 -方向。

28. 发明授权

US06192581B1 Method of making printed circuit board 失效
标题翻译：制作印刷电路板的方法
公开(公告)号：US06192581B1
公开(公告)日：2001-02-27
申请号：US08997624
申请日：1997-12-23
申请人： Masahide Tsukamoto
发明人： Masahide Tsukamoto
IPC分类号： H01K310
CPC分类号： H01L24/80 , H01L23/3107 , H01L23/49827 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/115 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K2201/0367 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/1461 , Y10T29/49126 , Y10T29/49165 , Y10T29/49345 , H01L2924/00
摘要： A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
摘要翻译：印刷电路板具有：具有第一通孔的基材层; 以及具有第二通孔的绝缘层，所述绝缘层设置在所述基材层的一个表面上，其中所述第二通孔的横截面面积小于所述第一通孔的横截面面积，以及其中所述第一和第二通孔用导电材料填充。

29. 发明授权

US5858884A Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same 失效
标题翻译：印刷电路板用无纺布布基材和使用其的预浸料
公开(公告)号：US5858884A
公开(公告)日：1999-01-12
申请号：US856548
申请日：1997-05-15
申请人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
发明人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
IPC分类号： B32B15/14 , C08J5/04 , C09D5/25 , D04H1/00 , D04H1/42 , D04H1/58 , D21H13/26 , D21H17/52 , H05K1/02 , H05K1/03 , C08J5/24
CPC分类号： H05K1/0366 , B32B15/14 , C08J5/04 , D04H1/00 , D04H1/4342 , D04H1/4382 , D04H1/64 , D21H13/26 , D21H17/52 , H05K1/024 , H05K2201/0239 , H05K2201/0278 , H05K2201/0293 , H05K2203/0783 , H05K2203/087 , H05K2203/097 , H05K2203/1105 , Y10T442/198 , Y10T442/2049 , Y10T442/2475 , Y10T442/2902 , Y10T442/626
摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.
摘要翻译：一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基材的预浸料坯和印刷线路板。

30. 发明授权

US5362513A Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same 失效
标题翻译：制造导电细线膜的图案的方法和用于其的设定墨水的方法
公开(公告)号：US5362513A
公开(公告)日：1994-11-08
申请号：US698563
申请日：1991-05-10
申请人： Mikinari Shimada , Hirotoshi Watanabe , Satoru Fujii , Masato Hagino , Masahide Tsukamoto
发明人： Mikinari Shimada , Hirotoshi Watanabe , Satoru Fujii , Masato Hagino , Masahide Tsukamoto
IPC分类号： H05K1/09 , H05K3/04 , H05K3/12 , B05D1/00
CPC分类号： H05K3/1275 , H05K3/048 , H05K1/092 , H05K2203/0113 , H05K2203/0143 , H05K2203/0195 , H05K2203/0534 , H05K2203/121
摘要： A pattern forming method comprises at least a lower pattern forming step for printing a setting ink on a substrate, a setting step for setting the setting ink, an upper layer pattern forming step for forming a metalo-organic compound paste layer on the lower layer pattern by a printing method, and a firing step for firing at high temperature to remove the lower layer pattern. In the upper layer pattern forming step, the metalo-organic compound paste is printed so that the metalo-organic compound paste may be divided on the hardened setting ink so as to fill up gaps of the lower layer pattern. Otherwise the metalo-organic compound paste is printed on the hardened setting ink, and the metalo-organic compound paste is mechanically cut off, before the metalo-organic compound paste is dried, on the hardened setting ink, thereby forming an upper layer pattern. The setting ink comprises a thermo-setting resin, a setting agent, and an organic solvent, with an amount of nonvolatile materials of 50 to 70 wt. %, or comprises a carbon powder, a thermo-setting resin, a setting agent and an organic solvent, with an amount of nonvolatile materials of 60 to 80 wt. %.
摘要翻译：图案形成方法至少包括用于在基板上印刷固化油墨的下图案形成步骤，用于设定设定油墨的设定步骤，在下层图案上形成金属有机化合物浆料层的上层图案形成工序通过印刷方法，以及在高温下烧制以除去下层图案的焙烧步骤。在上层图案形成工序中，印刷金属有机化合物糊料，使得金属有机化合物糊剂可以在硬化的固化油墨上分配，以便填满下层图案的间隙。另外，将金属有机化合物糊剂印刷在硬化凝固油墨上，并且在金属有机化合物浆料被干燥之前，在硬化的固化油墨上机械地切割金属有机化合物浆料，从而形成上层图案。固化油墨包括热固性树脂，固化剂和有机溶剂，其中非挥发性物质的量为50〜70重量％。％，或包含碳粉末，热固性树脂，固化剂和有机溶剂，其中非挥发性物质的量为60〜80重量％。％。

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