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    • 21. 发明授权
    • High speed microprocessor for processing and transferring N-bits of
M-bit data
    • 用于处理和传送N位M位数据的高速微处理器
    • US5708800A
    • 1998-01-13
    • US487170
    • 1995-06-07
    • Hiroshi TateishiHiroki TakahashiKazuo Nakamura
    • Hiroshi TateishiHiroki TakahashiKazuo Nakamura
    • G06F12/04G06F5/00G06F9/30G06F9/315G06F7/10
    • G06F5/00
    • A microprocessor comprises a control section for receiving a transfer instruction and transferring N-bits of M-bit data stored at a transfer-source address in a first memory to a transfer-destination address in a second memory in response to a received transfer instruction. In this microprocessor, the transfer of N-bits is performed with the execution of a single transfer instruction. Hence, the memory area required for storing the transfer instructions is reduced, and the residual memory area can be used for other purposes, which improves the efficiency in the use of the memory. The control section stores in the first memory of the microprocessor all the interim results obtained during the execution of a transfer instruction and outputs only the final result to the external memory, reducing the number of machine cycles required for data transfer between the microprocessor and the memory, and further reducing the execution time for data transfer in the microprocessor.
    • 微处理器包括控制部分,用于响应于接收到的传送指令,接收传送指令并将存储在第一存储器中的传送源地址的N位的M位数据传送到第二存储器中的传送目的地地址。 在该微处理器中,通过执行单个传送指令来执行N位的传送。 因此,存储转移指令所需的存储区域减少,并且剩余存储区域可以用于其他目的,这提高了存储器的使用效率。 控制部分在微处理器的第一存储器中存储在执行传送指令期间获得的所有中间结果,并且仅将最终结果输出到外部存储器,从而减少微处理器和存储器之间的数据传送所需的机器周期数 并且进一步减少微处理器中的数据传输的执行时间。
    • 22. 发明授权
    • Thermal stencil plate making method
    • 热模板制版方法
    • US5417156A
    • 1995-05-23
    • US127435
    • 1993-09-27
    • Hiroshi TateishiYuji Natori
    • Hiroshi TateishiYuji Natori
    • B41C1/14B41C1/055
    • B41C1/144
    • A thermal stencil plate making method, by which a perforation image is formed on a thermal stencil original sheet comprising a thermoplastic resin film and a porous support laminated on each other or a thermal stencil original sheet composed substantially only of a thermoplastic resin film by applying thermal energy to the thermal stencil original sheet by means of a thermal head, is characterized in that a distance between heating elements in the thermal head: d (.mu.m) and a thickness of a heating element protection layer: T (.mu.m) satisfy the following condition of Equation (1) and that a secondary scan direction heating element spacing between heating elements in the thermal head: D (.mu.m) and the thickness of the heating element protection layer: T (.mu.m) satisfy the following condition of Equation (2):5.ltoreq.d/T (1);4.5.ltoreq.D/T (2).
    • 一种热模版印版制作方法,其中在热模版原稿上形成穿孔图像,所述热模板原稿片材包括热塑性树脂薄膜和彼此层压的多孔载体,或热模版原稿片基本上仅由热塑性树脂薄膜构成, 其特征在于,热敏头中的加热元件之间的距离:d(μm)和加热元件保护层的厚度T(μm)满足: (1)的条件和热敏头中的加热元件之间的二次扫描方向加热元件间隔:D(μm)和加热元件保护层的厚度T(μm)满足以下等式的条件 (2):5