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    • 27. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US5023682A
    • 1991-06-11
    • US370662
    • 1989-06-23
    • Masahiro ShimizuHiroki ShimanoMasahide InuishiKatsuhiro Tsukamoto
    • Masahiro ShimizuHiroki ShimanoMasahide InuishiKatsuhiro Tsukamoto
    • H01L27/10G11C11/34H01L21/8242H01L27/00H01L27/108
    • H01L27/10805
    • A semiconductor memory device comprises a p.sup.- -type semiconductor substrate (1), thin p.sup.+ -type regions (15, 80) formed thereon, n.sup.+ -type regions (6, 7) surrounded with the p.sup.+ -type regions (15, 80), a first gate electrode (2) formed on a charge storage region in the n.sup.+ -type region (6), and a second gate electrode (3) formed on the p.sup.+ -type region (80) and serving as a word line. The p.sup.+ -type regions (15, 80) prevent passage of electrons out of electron-hole pairs induced by alpha rays so as to prevent occurrence of soft errors. Advantageously, the thin p+ layer used to control threshold voltage for a transfer gate of the device is extended and also used for prevention of such soft errors, thus providing reduced bulk for the device. In order to reduce bulk further, the n+-type regions (6, 7) are also reduced in thickness. Films 16 and 17 are added to prevent an increase in diffusion resistance of the regions (6, 7) and the interconnection resistance of the second gate electrode (3). An oxide film (16) is formed on the side wall of the second gate electrode (3), a titanium silicide film (17) is formed on the n.sup.+ -type regions (6, 7) and a titanium silicide film (18) is formed on the second gate electrode (3) in a self-aligning manner.A bit line is formed on the semiconductor region and connected thereto. An interlayer insulation film is optionally formed between the bit line and the refractory metal silicide film placed on the semiconductor n.sup.+ -type region. The interlayer insulation film preferably comprises a silicon oxide film or a phosphorous oxide film. Finally, a protective film is optionally formed on the bit line. The protective film is preferably made of a material having a low dielectric constant.
    • 半导体存储器件包括p型半导体衬底(1),形成在其上的薄p +型区域(15,80),被p +型区域(15,80)包围的n +型区域(6,7) ,形成在n +型区域(6)的电荷存储区域上的第一栅电极(2)和形成在p +型区域(80)上并用作字线的第二栅电极(3)。 p +型区域(15,80)防止电子从α射线诱发的电子 - 空穴对中流出,以防止软错误的发生。 有利地,用于控制装置的传输门的阈值电压的薄p +层被扩展,并且还用于防止这种软错误,从而为装置提供减少的体积。 为了进一步减小体积,n +型区域(6,7)的厚度也减小。 加入薄膜16和17以防止区域(6,7)的扩散阻力的增加和第二栅电极(3)的互连电阻的增加。 在第二栅电极(3)的侧壁上形成氧化膜(16),在n +型区域(6,7)上形成硅化钛膜(17),硅化钛膜(18)为 以自对准的方式形成在第二栅电极(3)上。 在半导体区域上形成位线并与其连接。 可选地,在位线和位于半导体n +型区域上的难熔金属硅化物膜之间形成层间绝缘膜。 层间绝缘膜优选包含氧化硅膜或氧化磷膜。 最后,可选地在位线上形成保护膜。 保护膜优选由具有低介电常数的材料制成。
    • 28. 发明授权
    • Method of manufacturing semiconductor memory device
    • 制造半导体存储器件的方法
    • US4702797A
    • 1987-10-27
    • US943053
    • 1986-12-18
    • Hiroki ShimanoMasahiro ShimizuKatsuhiro TsukamotoMasahide Inuishi
    • Hiroki ShimanoMasahiro ShimizuKatsuhiro TsukamotoMasahide Inuishi
    • H01L27/10G11C11/34H01L21/822H01L21/8242H01L27/04H01L27/108H01L29/08H01L29/10H01L21/306B44C1/22C03C15/00C03C25/06
    • H01L27/1085H01L27/10805H01L29/0847H01L29/1083Y10S438/953
    • A method of manufacturing a semiconductor device comprises the steps of forming memory cell portions (2, 4, 6, 11) on a p.sup.- -type semiconductor substrate (1), forming a gate insulator film (5) and a gate electrode (3) each having a larger width, by approximately 1 .mu.m, than the original width, ion-implanting p-type impurities utilizing the gate insulator film (5) and the gate electrode (3) as masks, to form p.sup.+ -type regions (120, 121), etching the side walls of the gate insulator film (5) and the gate electrode (3) to the original width and then, ion-implanting n-type impurities utilizing these regions as a mask, to form n.sup.+ -type regions (80, 81), and heat-treating these regions (80, 81, 120, 121), to form regions (80a, 81a, 120a, 121a). The p.sup.+ -type regions (120a, 121a) prevent passage of electrons out of electron-hole pairs induced by alpha rays, to prevent occurrence of soft errors. The p.sup.+ -type regions (120a, 121a) are located inside the n.sup.+ -type regions (80a, 81a), so that operation of a parasitic pnp transistor is not caused.
    • 一种制造半导体器件的方法包括以下步骤:在p型半导体衬底(1)上形成存储单元部分(2,4,6,11),形成栅极绝缘膜(5)和栅电极(3) )各自具有比原始宽度大约1μm的离子注入p型杂质,利用栅极绝缘膜(5)和栅电极(3)作为掩模,形成p +型区域( 将栅极绝缘体膜(5)和栅电极(3)的侧壁蚀刻到原始宽度,然后将这些区域的n型杂质离子注入作为掩模,形成n +型 区域(80,81),并对这些区域(80,81,120,121)进行热处理,以形成区域(80a,81a,120a,121a)。 p +型区域(120a,121a)防止电子从由α射线诱发的电子 - 空穴对中流出,以防止发生软错误。 p +型区域(120a,121a)位于n +型区域(80a,81a)内部,从而不产生寄生pnp晶体管的操作。
    • 30. 发明授权
    • Solid-state image sensor device and differential interface thereof
    • 固态图像传感器装置及其差分接口
    • US08462251B2
    • 2013-06-11
    • US13542431
    • 2012-07-05
    • Hiroki Shimano
    • Hiroki Shimano
    • H04N5/335
    • H04N5/3745H04N5/3577H04N5/3698H04N5/378
    • A solid-state image sensor device comprises an image sensor section for outputting analog signals of an image being taken; a plurality of AD converter sections, arranged with respect to the column direction of the image sensor section, for converting the analog signals into digital signals; a drive circuit section for controlling the image sensor section and the AD converter sections; and a plurality of differential interface sections for transmitting the digital signals converted by the AD converter sections as differential output signals to an external device. Each of the differential interface sections comprises a current value changeover circuit and offset voltage holding circuit operative when an operation mode changeover is made.
    • 固态图像传感器装置包括用于输出正在拍摄的图像的模拟信号的图像传感器部分; 多个AD转换器部分,相对于图像传感器部分的列方向布置,用于将模拟信号转换成数字信号; 用于控制图像传感器部分和AD转换器部分的驱动电路部分; 以及多个差分接口部分,用于将由AD转换器部分转换的数字信号作为差分输出信号发送到外部设备。 每个差分接口部分包括当进行操作模式切换时可操作的电流值转换电路和失调电压保持电路。