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    • 23. 发明公开
    • 칩형 전기 이중층 캐패시터의 제조방법
    • 芯片型双电层电容器及其方法
    • KR1020000060043A
    • 2000-10-16
    • KR1019990008070
    • 1999-03-11
    • 주식회사삼영에스앤씨
    • 김경호오제영유남산이용욱이상현최수진
    • H01G9/00
    • Y02E60/13H01G11/84H01G11/78
    • PURPOSE: A chip type electric double layer capacitor is provided to prolong the length of an article's life with miniaturizing and light-weighting capacitor. CONSTITUTION: A chip type electric double layer capacitor is cased with an insulated armour and serial laminated two or three cell units(101) inside the case. A terminal(102,103) is connected to the top of the upper cell unit and to the bottom of the lower cell unit of the serial laminated cell units(101). The terminal(102,103) is bent at a right angle or vertically in lower part of the armoring case. And the terminal(102,103) is connected to the cell units(101) by welding to be used as a positive and a negative electrode. The serial laminated cell units(101) with the terminals(102,103) are put in a lower metal mold(107) having a molding gate slot(109) and a molding press guide(108), and covered with an upper metal mold(105) having a molding press guide(106) inside. The upper and the lower metal mold(105,107) are pressed and then molded by projecting a molding material through the molding gate slot(109). After removing the hardened metal molds, the protruding terminals are bent under the molding case.
    • 目的:提供一种片式双电层电容器,通过小型化和轻量化电容器延长制品的使用寿命。 构成:芯片式双电层电容器采用绝缘护套和套管内的串联层叠的两个或三个电池单元(101)。 端子(102,103)连接到上电池单元的顶部和连接层压电池单元(101)的下电池单元的底部。 端子(102,103)在铠装壳体的下部以直角弯曲或垂直弯曲。 端子102,103通过焊接与电池单元101连接,作为正极和负极使用。 将具有端子(102,103)的串联层叠电池单元(101)放入具有模制门槽(109)和模压机引导件(108)的下金属模具(107)中,并被上金属模具(105)覆盖 )内部具有成型压力引导件(106)。 上下金属模具(105,107)被压制,然后通过模制浇口槽(109)突出模制材料来模制。 在去除硬化的金属模具之后,突起端子在模制箱下弯曲。
    • 24. 发明公开
    • MCU 타입 먼지센서
    • 微控制器单元式传感器
    • KR1020150113575A
    • 2015-10-08
    • KR1020140037718
    • 2014-03-31
    • 주식회사삼영에스앤씨
    • 백여진
    • G01N21/94G01N21/47
    • 본발명은먼지센서에관한것으로서, 보다상세하게는입력전원의감시를통해입력전원의레벨변화량에따른감도를보정하고, 감도보정을위한기준신호의발생을통해다양한환경변화나부품의특성변화에상관없이일정한기준으로센싱감도의자가진단및 보상을하도록하는 MCU 타입먼지센서에관한것이다. 보다구체적으로본 발명에대하여설명하면, 본발명은빛을발생시키는발광부, 부유하는먼지에의해산란되는상기빛을집광시키는집광렌즈, 집광된상기빛을감지하는수광부, 상기수광부의수광부신호를증폭하는증폭부및 상기증폭부로부터증폭된신호를수신한후 펄스폭 변조(Pulse Width Modulation: PWM) 신호로변환하여출력하는 MCU(Micro Controller Unit)를포함하되, 상기 MCU는기준신호의발생기능을수행하는기준신호발생부를포함함으로써먼지센서감도의자가진단및 보상이가능한것을특징으로하는 MCU(Micro Controller Unit) 타입먼지센서를제공한다.
    • 本发明涉及一种微控制器单元型微尘传感器,更具体地说,涉及一种能够通过监视输入电源而能够控制由于输入电源电平变化引起的灵敏度的MCU型尘埃传感器, 通过产生用于控制灵敏度的参考信号,自动诊断和控制灵敏度,而不管组件的特性或各种环境变化的变化。 更具体地,本发明包括发射光的发光单元; 聚光透镜,收集由尘埃飞散的光线; 光接收单元,感测所收集的光; 放大单元,放大从光接收单元发送的信号; 以及接收由放大单元放大的信号并将接收到的信号转换并输出到脉宽调制(PWM)信号的MCU。 MCU包括产生参考信号的参考信号产生单元。 因此,本发明提供了一种具有自主地诊断和控制灰尘传感器的灵敏度的MCU型尘埃传感器。
    • 25. 发明公开
    • 알루미늄 기판의 패터닝 방법
    • 形成铝基板图案的方法
    • KR1020140037296A
    • 2014-03-27
    • KR1020120099983
    • 2012-09-10
    • 인하대학교 산학협력단주식회사삼영에스앤씨
    • 탁용석최진섭박가연김경민이호연박창현박상익김영민박승현
    • G03F7/26H01L21/027G03F7/20
    • G03F7/265G03F1/80G03F7/2004H01L21/0274
    • The present invention provides a patterning method for an aluminum substrate comprising: a step (a) of manufacturing a master stamp in which a pattern is formed; a step (b) of performing coining on an aluminum substrate by depositing epoxy on the aluminum substrate and using the master stamp; a step (c) of hardening the epoxy by using a UV lamp; a step (d) of etching the epoxy by using O_2 plasma until the coining part of the aluminum substrate is exposed; a step (e) of forming a pattern by etching the coining part of the aluminum substrate; and a step (f) of exfoliating epoxy on the aluminum substrate. The present invention prevents a PDMS stamp from being changed by excluding organic solvents such as toluene being mainly used in a process when PDMS is mainly used as an elastomer stamp, is able to performing recycling, increases the efficiency of a process and reduces costs. The present invention improves working conditions by excluding organic solvents in a process since the organic solvents have toxicity and, specifically, toluene is high volatile and is harmful to human bodies. [Reference numerals] (S100) Manufacturing a master stamp in which a pattern is formed; (S200) Performing coining on an aluminum substrate by depositing epoxy on the aluminum substrate and using a master stamp; (S300) Hardening the epoxy by using a UV lamp; (S400) Etching the epoxy by using O_2 plasma until the coining part of the aluminum substrate is exposed; (S500) Forming a pattern by etching the coining part of the aluminum substrate; (S600) Exfoliating epoxy on the aluminum substrate
    • 本发明提供一种用于铝基板的图案化方法,包括:制造其中形成图案的主印模的步骤(a); 通过在铝基板上沉积环氧树脂并使用主印模在铝基板上进行压印的步骤(b) 使用紫外灯硬化环氧树脂的步骤(c); 使用O_2等离子体蚀刻环氧树脂直到铝基材的压印部分露出的步骤(d) 通过蚀刻铝基板的压印部形成图案的步骤(e); 以及在铝基材上剥离环氧树脂的步骤(f)。 本发明通过排除主要用于PDMS主要用作弹性体印章的工艺中的有机溶剂如甲苯来防止PDMS印模变化,能够进行再循环,提高工艺的效率并降低成本。 本发明通过排除有机溶剂在工艺中改善工作条件,因为有机溶剂具有毒性,特别是甲苯是高挥发性的并且对人体有害。 (附图标记)(S100)制造其中形成图案的主印模; (S200)通过在铝基板上沉积环氧树脂并使用母版在铝基板上进行压印; (S300)使用紫外灯固化环氧树脂; (S400)使用O_2等离子体蚀刻环氧树脂直到铝基板的压印部分露出; (S500)通过蚀刻铝基板的压印部形成图案; (S600)铝基板上的去角质环氧树脂
    • 26. 发明公开
    • 습도 및 온도 통합 센서 모듈
    • 集成湿度和温度传感器模块
    • KR1020130019515A
    • 2013-02-27
    • KR1020110081508
    • 2011-08-17
    • 주식회사삼영에스앤씨
    • 박상익오제영김영민
    • G01D21/02G01N27/22G01K7/00
    • G01W1/17
    • PURPOSE: An integrated humidity and temperature sensor module is provided to integrally sense humidity and temperature by using a single sensor module, thereby simplifying a measurement task. CONSTITUTION: An integrated humidity and temperature sensor module comprises a substrate(10), a humidity sensor(30), a sensor signal processing unit(20), a protective film, and a case. The humidity sensor is connected to a line of the substrate. The sensor signal processing unit includes a temperature sensor and is connected to the humidity sensor in a wire-bonding method by being connected to the line of the substrate. Humidity sensor signals and temperature sensor signals are input to the sensor signal processing unit. The signal processing unit performs a signal process, thereby generating humidity data and temperature data. The protective film is formed in the upper part of the sensor signal processing unit. The case is attached to the substrate to protect the sensor signal processing unit and the humidity sensor. [Reference numerals] (10) Substrate
    • 目的:提供一个集成的湿度和温度传感器模块,通过使用单个传感器模块来整体感测湿度和温度,从而简化测量任务。 构成:集成的湿度和温度传感器模块包括基板(10),湿度传感器(30),传感器信号处理单元(20),保护膜和壳体。 湿度传感器连接到基板的一行。 传感器信号处理单元包括温度传感器,并且通过连接到基板的线路而以引线接合方法连接到湿度传感器。 湿度传感器信号和温度传感器信号被输入到传感器信号处理单元。 信号处理单元执行信号处理,从而生成湿度数据和温度数据。 保护膜形成在传感器信号处理单元的上部。 外壳附着在基板上,以保护传感器信号处理单元和湿度传感器。 (附图标记)(10)基板
    • 27. 发明授权
    • 습도 및 온도의 복합 검출회로
    • 用于湿度和温度的复合型感应电路
    • KR101237379B1
    • 2013-02-26
    • KR1020110081512
    • 2011-08-17
    • 주식회사삼영에스앤씨
    • 박상익오제영김영민
    • G01D21/02G01N27/12G01N7/00
    • G01D21/02G01D5/244G01K7/22G01N27/04
    • PURPOSE: A complex detection circuit for temperature and humidity is provided to complexly detect temperature and humidity through the single circuit, thereby facilitating measurement and application to equipment requiring temperature and humidity information. CONSTITUTION: A complex detection circuit for temperature and humidity comprises a moisture-sensor part(10), a filter part(20), a control signal combiner(50), an amplifier(60), a control signal generator(70), a temperature sensor part(80), and a power supply part(90). The filter part converts the voltage level of a humidity sensor signal input from the humidity sensor part. The control signal combiner synthesizes the humidity sensor signal with an offset setting signal inputted from the control signal generating part. [Reference numerals] (10) Humidity sensor part; (20) Filter part; (30) Voltage distribution part; (40) Impedance matching part; (50) Control signal combiner; (60) Amplifier; (70) Control signal generator; (80) Temperature sensor part; (90) Power supply part
    • 目的:提供温度和湿度的复杂检测电路,通过单个电路来复杂地检测温度和湿度,从而便于测量和应用于需要温度和湿度信息的设备。 构成:用于温度和湿度的复杂检测电路包括湿度传感器部分(10),滤波器部分(20),控制信号组合器(50),放大器(60),控制信号发生器(70), 温度传感器部件(80)和电源部件(90)。 滤波器部分转换从湿度传感器部分输入的湿度传感器信号的电压电平。 控制信号组合器利用从控制信号产生部分输入的偏移设置信号来合成湿度传感器信号。 (附图标记)(10)湿度传感器部; (20)过滤器部件; (30)电压分配部; (40)阻抗匹配部分; (50)控制信号组合器; (60)放大器; (70)控制信号发生器; (80)温度传感器部件; (90)电源部分