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11. 发明授权

US06664482B1 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges 失效
标题翻译：具有用于电连接导电焊盘的焊接桥的印刷电路板和制造焊接桥的方法
公开(公告)号：US06664482B1
公开(公告)日：2003-12-16
申请号：US09561591
申请日：2000-05-01
申请人： Ian P. Shaeffer , Everett Basham , Christopher D. Price
发明人： Ian P. Shaeffer , Everett Basham , Christopher D. Price
IPC分类号： H05K111
CPC分类号： H05K3/3484 , H01R31/08 , H05K1/0293 , H05K3/1216 , H05K2201/0305 , H05K2203/043 , H05K2203/173
摘要： A method of fabricating a zero signal degradation solder bridge electrical connection for connecting adjacent conducting pads of a printed circuit board, and a printed circuit board having at least one of these solder bridge electrical connections. In the method, a stencil, having an opening that corresponds to the adjacent conducting pads and at least a portion of the surface area of the printed circuit board between the adjacent conducting pads, is placed on the surface of printed circuit board. Solder paste is then applied to the stencil such that the solder paste flows through the stencil opening and onto the adjacent conducting pads and at least a portion of the surface area of the printed circuit board between the pads. The stencil is then removed and the printed circuit board is subjected to reflow soldering, thereby fabricating a printed circuit board having a solder bridge electrical connector between adjacent conducting pads.
摘要翻译：一种制造用于连接印刷电路板的相邻导电焊盘的零信号劣化焊桥电连接的方法以及具有这些焊桥电连接中的至少一个的印刷电路板。在该方法中，将具有对应于相邻导电焊盘的开口和相邻导电焊盘之间的印刷电路板的表面区域的至少一部分的模板放置在印刷电路板的表面上。然后将焊膏施加到模板上，使得焊膏流过模板开口并且流到衬垫之间的相邻导电焊盘和印刷电路板的表面区域的至少一部分。然后去除模版，并且对印刷电路板进行回流焊接，从而制造在相邻导电焊盘之间具有焊料桥电连接器的印刷电路板。

12. 发明授权

US06606247B2 Multi-feature-size electronic structures 有权
公开(公告)号：US06606247B2
公开(公告)日：2003-08-12
申请号：US09872985
申请日：2001-05-31
申请人： Thomas Lloyd Credelle , Glenn Gengel , Roger Green Stewart , William Hill Joseph
发明人： Thomas Lloyd Credelle , Glenn Gengel , Roger Green Stewart , William Hill Joseph
IPC分类号： H05K111
CPC分类号： H01L24/96 , G06K19/07749 , G06K19/0775 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H01L24/24 , H01L24/82 , H01L24/95 , H01L29/0657 , H01L2224/24137 , H01L2224/24227 , H01L2224/95085 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10158 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01Q1/2208 , H01Q7/00 , H05K1/141 , H05K1/183 , H05K3/222 , H05K3/321 , H05K2201/10477 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204 , H01L2924/00
摘要： Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

13. 发明授权

US06489574B1 Printed-wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US06489574B1
公开(公告)日：2002-12-03
申请号：US09702763
申请日：2000-11-01
申请人： Toru Otaki , Hideho Inagawa , Toru Osaka
发明人： Toru Otaki , Hideho Inagawa , Toru Osaka
IPC分类号： H05K111
CPC分类号： H05K1/112 , H05K2201/09227 , H05K2201/09336 , H05K2201/0939 , H05K2201/09627 , H05K2201/10734
摘要： A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiant, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.
摘要翻译：在其上组装有格栅阵列型封装的印刷电路板，具有以矩阵形式布置的许多端子的多端子装置，通过第一信号连接孔，信号线和第二连接孔提供，其中多个焊盘被分成多个块，以矩阵形式布置在第一层上，以相应地连接多终端设备的每个终端，与许多焊盘相连并沿与每块相同的方向拉出的信号线图案，以及位于最内层的焊盘的第一信号图案许多土地线。然后，信号线的布线图案从栅格阵列型封装的组装面上的矩阵状的多个区域中规则地拉出，使得印刷布线板更容易实现布线连接而不使其复杂或增加数量的印刷线路板的层。而且，通过提供围绕信号线的接地图案，可以减少不必要的辐射，并且抑制由于反射和地面反弹引起的电子设备故障的发生。

14. 发明授权

US06483045B1 Via plug layout structure for connecting different metallic layers 失效
标题翻译：通过插头布局结构连接不同的金属层
公开(公告)号：US06483045B1
公开(公告)日：2002-11-19
申请号：US09626409
申请日：2000-07-26
申请人： Mu-Chun Wang , Shih-Chieh Kao , Shiang Huang-Lu , Yuan-Chang Liu
发明人： Mu-Chun Wang , Shih-Chieh Kao , Shiang Huang-Lu , Yuan-Chang Liu
IPC分类号： H05K111
CPC分类号： H01L23/528 , H01L23/5226 , H01L2924/0002 , H05K1/115 , H05K2201/0769 , H05K2201/0969 , H05K2201/0979 , H01L2924/00
摘要： A via plug layout structure for connecting different metallic layers. The structure includes a plurality of via plugs arranged in a fan-shaped pattern and a plurality of empty bars positioned between a single via plug and the fanned-out via plugs so that incoming current to the single via plug is equally distributed to every one of the fanned-out via plug and current stress in each fanned-out via plug is identical. Hence, via plugs having particularly serious electromigration problem can be discovered. In addition, single via plug having different critical dimension can be fabricated so that maximum critical dimension sustainable by the via plug is determined after an electromigration test.
摘要翻译：用于连接不同金属层的通孔插头布局结构。该结构包括布置成扇形图案的多个通孔塞和位于单个通孔插头和扇形通孔之间的多个空杆，使得到单个通孔塞的进入电流被均等地分配到通过插头的每个扇形插头中的插头和电流应力都是相同的。因此，可以发现通过具有特别严重的电迁移问题的插头。此外，可以制造具有不同临界尺寸的单通孔塞，使得在电迁移测试之后确定由通孔插塞可持续的最大临界尺寸。

15. 发明授权

US06473312B1 Printed circuit board, printed circuit board module and electronic device adapting same 失效
标题翻译：印刷电路板，印刷电路板模块和适应相同的电子设备
公开(公告)号：US06473312B1
公开(公告)日：2002-10-29
申请号：US09642023
申请日：2000-08-21
申请人： Yoshiaki Hiratsuka , Masanori Yamaguchi , Hisashi Yoshinaga
发明人： Yoshiaki Hiratsuka , Masanori Yamaguchi , Hisashi Yoshinaga
IPC分类号： H05K111
CPC分类号： H05K1/0234 , H05K1/0216 , H05K1/162 , H05K1/167 , H05K2201/093 , H05K2201/09309 , H05K2201/09663
摘要： A printed circuit board includes a ground layer, a power supply layer divided into a plurality of lands, a dielectric layer disposed so as to cover the plurality of lands of the power supply layer, and a conductor layer disposed so as to cover the dielectric layer. The plurality of divided lands are coupled to each other by electrostatic capacitors formed by each of the lands of the power supply layer and the conductor layer sandwiching the dielectric layer therebetween.
摘要翻译：印刷电路板包括接地层，分成多个焊盘的电源层，设置成覆盖电源层的多个焊盘的电介质层和布置成覆盖电介质层的导体层。多个划分的焊盘通过由电源层的每个焊盘形成的静电电容器和夹在其间的电介质层的导体层彼此耦合。

16. 发明授权

US06448510B1 Substrate for electronic packaging, pin jig fixture 有权
标题翻译：基板用于电子封装，针脚夹具
公开(公告)号：US06448510B1
公开(公告)日：2002-09-10
申请号：US09424179
申请日：2000-06-22
申请人： Shimon Neftin , Uri Mirsky
发明人： Shimon Neftin , Uri Mirsky
IPC分类号： H05K111
CPC分类号： H05K3/445 , C25D11/022 , C25D11/04 , H01L21/486 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H05K3/02 , H05K2201/09827 , H05K2203/0315 , H05K2203/0323 , H05K2203/1142 , Y10S428/901 , Y10T29/49155 , H01L2924/00
摘要： A substrate for electronic packaging, the substrate having a discrete, generally prismatoid, initially electrically conductive valve metal solid body with one or more spaced apart, original valve metal vias each individually electrically islolated by a porous oxidized body portion therearound. A pin jig fixture for mechanically masking a metal surface, the pin jig fixture having an anodization resistant bed of pins each pin having a leading end surface for intimate juxtaposition against a metal surface to mask portions thereof.
摘要翻译：一种用于电子封装的衬底，该衬底具有离散的大致棱柱形的最初导电的阀金属固体，其具有一个或多个间隔开的原始阀金属通孔，每个金属孔通过其周围的多孔氧化体部分单独地电绝缘。一种用于机械地掩蔽金属表面的销夹具夹具，销夹具夹具具有阳极氧化床的销，每个销具有前端表面，用于与金属表面紧密并置以掩盖其部分。

17. 发明授权

US06424535B1 Hybrid circuit with contact surfaces (solder pads) 失效
标题翻译：带接触面的混合电路（焊盘）
公开(公告)号：US06424535B1
公开(公告)日：2002-07-23
申请号：US09647484
申请日：2000-11-13
申请人： Karl Rehnelt , Frank Templin
发明人： Karl Rehnelt , Frank Templin
IPC分类号： H05K111
CPC分类号： H05K3/3442 , H05K1/0306 , H05K1/141 , H05K3/366 , H05K3/403 , H05K2201/09181 , H05K2201/10984 , Y02P70/613
摘要： A plate-shaped ceramic circuit substrate (6), which is adapted to be vertically mounted on a mother board, has near a lower edge (7) thereof a series of contact areas (solder pads) (1) for contacting the circuit with terminals of the mother board. For improved solderability also in case of small contact area (1), these contact areas extend down as far as the lower edge (7), and there is provided one recess (2) each which constitutes a solder deposit (3) and which extends through the circuit substrate (6) and runs from the lower face side (5) of the circuit substrate (6) upwardly into the respective contact area (1).
摘要翻译：适于垂直安装在母板上的板状陶瓷电路基板（6）在其下边缘（7）附近具有一系列接触区域（焊盘）（1），用于将电路与端子的母板。为了提高可焊性，在接触面积（1）较小的情况下，这些接触面向下延伸到下边缘（7）的下方，并且设置有一个凹部（2），每个凹部构成焊料沉积物（3），并且其延伸通过电路基板（6）从电路基板（6）的下表面（5）向上延伸到相应的接触区域（1）中。

18. 发明授权

US06411519B1 Package substrate 有权
公开(公告)号：US06411519B1
公开(公告)日：2002-06-25
申请号：US09905974
申请日：2001-07-17
申请人： Motoo Asai , Yoji Mori
发明人： Motoo Asai , Yoji Mori
IPC分类号： H05K111
摘要： According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.

19. 发明授权

US06407343B1 Multilayer wiring board 失效
标题翻译：多层接线板
公开(公告)号：US06407343B1
公开(公告)日：2002-06-18
申请号：US09615942
申请日：2000-07-13
申请人： Shinji Tanaka
发明人： Shinji Tanaka
IPC分类号： H05K111
CPC分类号： H05K1/114 , H01L23/5384 , H01L23/5386 , H01L2224/16225 , H01L2924/15312 , H05K1/0289 , H05K1/115 , H05K2201/09627 , H05K2201/09709 , H05K2201/09854 , H05K2201/10674
摘要： A wiring layer on which X-directional signal lines 20 to 22 are arranged is formed on a multilayer board. Rectangular power-source conductive patterns 10c are arranged each in which via holes 12c are formed longitudinally or in the wiring direction of the X-directional signal lines 20 to 22. The area (hatched with broken lines) acts as a wiring channel for the X-directional signal line 22.
摘要翻译：在多层基板上形成配置有X方向信号线20〜22的布线层。矩形电源导体图案10c布置成沿X方向信号线20至22的纵向或布线方向形成有通孔12c。用虚线划线的区域用作X的布线通道双向信号线22。

20. 发明授权

US06369336B1 Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US06369336B1
公开(公告)日：2002-04-09
申请号：US09267442
申请日：1999-03-12
申请人： Hiroyuki Obata
发明人： Hiroyuki Obata
IPC分类号： H05K111
CPC分类号： H01R12/721 , H01R12/714 , H01R13/2464 , H05K1/117 , H05K3/429 , H05K2201/09154 , H05K2201/09481
摘要： A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).
摘要翻译：公开了一种印刷电路板，其具有位于其上表面和下表面上的板主体的边缘附近的导电焊盘，以减小接触滑动方向上的宽度，并提供电连接器的电触点与导电焊盘，尽管由于导电焊盘和电触头之间的摩擦而产生的粉末状物质。印刷电路板（1）在主体（2）的边缘（3）附近在板主体（2）的上表面和下表面上具有导电焊盘（14a，14b）。电触点（20）从电路板主体（2）的边缘（3）滑过导电焊盘（14a，14b）。导电焊盘（14a，14b）通过位于触点（20）的路径中的通孔（15a）连接在一起。

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